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  • 1
    Electronic Resource
    Electronic Resource
    The use of metal/semiconductor structures to develop MULSAM analytical techniquesThis paper forms the text of an invited talk read at ECASIA 91, 14-18 October 1991, Budapest, Hungary. (1992)
    Chichester [u.a.] : Wiley-Blackwell
    Surface and Interface Analysis 18 (1992), S. 295-302 
    Details
    ISSN: 0142-2421
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Physics
    Notes: The structures that can be fabricated by integrated circuit technology are very useful as well-characterized samples for testing image processing methodologies in multi-imaging instruments. Such samples are employed in the work described in this paper to evaluate schemes for correction of spectral background, substrate backscattering, surface topography and beam current fluctuation effects out of Auger images. The outstanding problems associated with the effects on Auger image contrast of sharp edges bounding overlayer structures are outlined and possible solutions are discussed.
    Additional Material: 3 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/sia.740180502
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    Paper (German National Licenses)
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  • 2
    Electronic Resource
    Electronic Resource
    Testing the success of analytical image correction routines: Surface images (1993)
    Chichester [u.a.] : Wiley-Blackwell
    Surface and Interface Analysis 20 (1993), S. 583-588 
    Details
    ISSN: 0142-2421
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Physics
    Notes: Multispectral techniques in Auger microscopy involve the acquisition of data as several spatially registered images or signals from the Auger, specimen absorption current, characteristic x-ray, backscattered and secondary electron signals. Each signal contains information from different interactions and volumes within the sample. Various combinations of these signals can be used along with simple physical models to remove those contrast variations in Auger images that are not due to compositional variations of the sample within the Auger escape depth. Such contrast may, for example, be due to beam current fluctuations during data acquisition, substrate backscattering or topographical effects. To measure the success of these corrections, two tests have been devised: the calculation of the number of resolvable levels in the Auger image before and after correction; and the measurement of the modulus of correlation |CAR| between the corrected Auger image and the correction factor image. The tests may be used to evaluate any new image correction method. They have been applied to simulated and experimental data for a sample with varying subsurface composition. The results show that both tests are useful for evaluating the accuracy of a correction, and that measurement of |CAR| is the more sensitive test.
    Additional Material: 8 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/sia.740200707
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    Paper (German National Licenses)
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  • 3
    Electronic Resource
    Electronic Resource
    An examination of the use of principal component analysis and target factor analysis for the determination of Auger depth profiles in two magnetic multilayer metal systems - Cu/Co and Co/PtEnlarged version of papers presented at QSA8 and ECASIA '95. (1995)
    Chichester [u.a.] : Wiley-Blackwell
    Surface and Interface Analysis 23 (1995), S. 858-872 
    Details
    ISSN: 0142-2421
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Physics
    Notes: Target factor analysis and principal component analysis have been applied to Auger spectra acquired from two metallic multilayer systems (Cu/Co and Co/Pt) depth profiled using ion beam bevelling. Both multilayers contained alternating 10 nm films, the Co/Pt being capped with 25 nm of Co. The results reveal the expected improvement in the precision of the depth profiles because of the amount of information included in the factor analysis. However, the data sets always contain more factors than expected from the number of different elements present. These extra factors are revealed by examination of the principal components as being due to the depth dependence of the inelastic scattering at energies lower than the Auger features. This yields more information about the samples than can be obtained from inspection of the raw spectra but compromises the accuracy of quantification of the depth profiles.
    Additional Material: 14 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/sia.740231303
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    Paper (German National Licenses)
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  • 4
    Electronic Resource
    Electronic Resource
    3D characterization of a W/TiN/ Ti/Si contact structure using MULSAM (1998)
    Chichester [u.a.] : Wiley-Blackwell
    Surface and Interface Analysis 26 (1998), S. 461-470 
    Details
    ISSN: 0142-2421
    Keywords: W/TiN/Ti/Si contact structure ; MULSAM ; TEM ; Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Physics
    Notes: The W/TiN/Ti/Si contact structures needed for ultra-large-scale integrated circuits have been studied using cross-sectional transmission electron microscopy (TEM) and multi-spectral Auger electron microscopy. Access to the Ti/Si interface for chemical characterization using SEM, Auger and electron energy-loss imaging and spectroscopy has been achieved by using a novel method of bevelled polishing of the silicon substrate material. Cross-sectional TEM was used to calibrate the depth scale in the MULSAM image sets, so allowing measurements of the thicknesses of various interfacial layers and the penetration of the ohmic contacts into the silicon. The TiN layer, providing adhesion of the tungsten as well as acting as a diffusion barrier, appears to have a domed shape, which penetrates the tungsten overlayer to a greater extent in the contact centres. The results of this work, combined with earlier, related, studies, enable a three-dimensional characterization of the bottom and sidewall structures in these contacts. © 1998 John Wiley & Sons, Ltd.
    Additional Material: 8 Ill.
    Type of Medium: Electronic Resource
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    Paper (German National Licenses)
  • 5
    Electronic Resource
    Electronic Resource
    Topographical contrast using scatter diagrams and correlated images form four backscattered electron detectors (1991)
    Chichester [u.a.] : Wiley-Blackwell
    Surface and Interface Analysis 17 (1991), S. 203-208 
    Details
    ISSN: 0142-2421
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Physics
    Notes: The York multi-spectral Auger electron microscope has been used to examine the correlations between four images measured simultaneously by collecting energetic backscattered electrons (BSEs) with four quadrants of an Si p-n junction BSE detector. Digital signal processing of the four images reveals the topography expected of the polyhedra on the surface of an Ag-coated, anisotropically etched Si sample. Scatter diagrams formed form the pair of topographical images appear as distorted stereographic projections of the distribution of local surface normals. The use of such projections via models of the scattering process is proposed as a means of correcting topographical artifacts in Auger, EDX and other chemically specific images.
    Additional Material: 5 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/sia.740170407
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    Paper (German National Licenses)
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  • 6
    Electronic Resource
    Electronic Resource
    Automatic removal of substrate backscattering effects in Auger imaging and spectroscopy (1993)
    Chichester [u.a.] : Wiley-Blackwell
    Surface and Interface Analysis 20 (1993), S. 984-990 
    Details
    ISSN: 0142-2421
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Physics
    Notes: The York multi-spectral scanning Auger microscope has been used to investigate the correlations between Auger and backscattered electron images collected simultaneously from a electron spectrometer and the quadrants of a Sip-n junction backscattered electron detector. Digital signal processing of the four backscattered electron signals allows the calculation of the Auger backscattering factor at each pixel position, the division of which into the Auger image allows the removal of contrast due to subsurface composition variations. The method, which allows the quantification of complicated heterogeneous samples, requires no fitting parameters or prior knowledge regarding the sample.
    Additional Material: 5 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/sia.740201209
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  • 7
    Electronic Resource
    Electronic Resource
    Auger imaging from rough, chemically inhomogenous, materials (1994)
    Chichester [u.a.] : Wiley-Blackwell
    Surface and Interface Analysis 22 (1994), S. 581-584 
    Details
    ISSN: 0142-2421
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Physics
    Notes: Surface analysis of practical materials often presents a challenging situation in Auger spectroscopy and imaging because the yield of Auger electrons depends not only on the composition of the surface but also upon the local surface inclination (the topography) and the composition of the material below the surface. The use of simultaneous imaging of the same area of a sample with an electron spectrometer and four quadrants of a backscattered electron (BSE) detector has been demonstrated previously to be very useful for the separate correction of either topographical contrast or sub-surface composition effects. In this work the possibility is tested of using BSE detector images to correct simultaneously acquired Auger images for the presence of both topographical and sub-surface composition effects in the same sample. Measurements on model samples with known topography and sub-surface composition are used. The samples are formed from anisotropically etched Si(100) coated in some places with a thick Au film and then overcoated everywhere with either a thin film of CuSn alloy or partially coated with a thin film of Au. The correction process is successful in reducing the artefacts everywhere and the extent of this correction is discussed.
    Additional Material: 3 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/sia.7402201123
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  • 8
    Electronic Resource
    Electronic Resource
    Automatic and Interactive Correlation Partitioning Compared: Application to TiN/Ti/SiO2This paper is an enlarged version of a presentation given by the authors at QSA9, University of Surrey, July 1996. (1997)
    Chichester [u.a.] : Wiley-Blackwell
    Surface and Interface Analysis 25 (1997), S. 335-340 
    Details
    ISSN: 0142-2421
    Keywords: AES ; correlation ; depth profiling ; imaging ; partitioning ; silicides ; Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Physics
    Notes: A new method has been developed for the partitioning of sets of images with the objective of automatically identifying the number and locations of different regions in a material. The method is called automatic correlation partitioning and it involves the identification of clusters in the n-dimensional intensity histogram of a set of n images that are spatially registered. The method uses the peaks located in the simple intensity histograms of each image in the set to produce a list of all possible clusters in the entire data set. This list is then searched in order to find the actual clusters. The method is tested using data from a multi-imaging Auger electron microscope, which yields sets of Auger images characteristic of the spatial distributions of selected kinds of atoms in the surface of a solid. The first tests involve the use of a model sample consisting of a W overlay pattern on a Si substrate. The second tests are done on a TiN/Ti/SiO2 planar layer structure that has been ion beam bevelled to reveal a cross-section of the composition depth profile. The first set contains two images and the second set contains five images. The results of the new automatic method are compared with those obtained by the analyst working interactively with the data set to identify the clusters subjectively. Cluster analysis of the second sample reveals details of the interfacial layer chemistry not revealed by the interactive method and is consistent with published XPS depth profiling experiments reporting a titanium silicide layer at the Ti/SiO2 interface. © John Wiley & Sons, Ltd.
    Additional Material: 6 Ill.
    Type of Medium: Electronic Resource
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    Paper (German National Licenses)
  • 9
    Electronic Resource
    Electronic Resource
    Separation of sample geometry and material effects within the secondary electron cascade: Preliminary results for gold (1994)
    Chichester [u.a.] : Wiley-Blackwell
    Surface and Interface Analysis 21 (1994), S. 805-808 
    Details
    ISSN: 0142-2421
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Physics
    Notes: Experimental results are reported for the energy-analysed angular distributions of the secondary electron cascade with energies from 200 eV up to 2450 eV using an incident beam energy of 20 keV and samples of Au and Au on Si. These angular distributions are compared to those of the Auger electron emission of the same samples. The dependence of the shape of the secondary electron cascade on the angle of incidence and the take-off angle to the analyser is examined. In the case of Au, the results are reported for a bulk and a layered specimen consisting of a thin Au film on an Si substrate. It is concluded for these samples that the contributions of the sample geometry and atomic number to the shape of the electron spectrum can be separated within a power law description of the secondary electron cascade.
    Additional Material: 6 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/sia.740211111
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  • 10
    Electronic Resource
    Electronic Resource
    New technique for the simultaneous correction of topographical and backscattering artefacts in electron-excited Auger spectroscopy and microscopyPaper presented at QSA8, University of Surrey, August 1994. (1994)
    Chichester [u.a.] : Wiley-Blackwell
    Surface and Interface Analysis 21 (1994), S. 857-863 
    Details
    ISSN: 0142-2421
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Physics
    Notes: In order to relate an Auger signal to the atomic concentration in the surface of a solid, it is well known that corrections have to be made for matrix effects. Also, corrections may be needed to compensate for the effects of artefacts caused by properties of the sample other than the concentration of different elements. Large artefacts can be caused by the surface topography and subsurface composition variations often present in ‘real’ samples. This paper reports a new correction scheme that enables the quantitative analysis of samples with a structure for which no prior knowledge exists. The scheme uses the ratio of the Auger peak height to a background count rate above the energy of all significant Auger features, combined with a linear correction invoving the atomic number of the substrate and the Auger backscattering factor. Inhomogeneous samples with angle of incidence variations from 0° to 45° and an arbitrary atomic number can be analysed with an accuracy of ∼5 at.% using this method. Limitations exist for thin unsupported films.
    Additional Material: 3 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/sia.740211207
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