ISSN:
1356-5362
Source:
Emerald Fulltext Archive Database 1994-2005
Topics:
Electrical Engineering, Measurement and Control Technology
Notes:
A novel interconnect technology, introducing thin film on a laminate substrate base, is presented. A specially constructed laminate board is used as a substrate for the thin film build-up process. The main characteristics of the laminate core substrate are the z-axis electrical connections, the absence of holes in the substrate and the very flat nature of the top surface. As a result, the base substrate can be processed further in a thin film processing line. The manufacturing and properties of these substrates are discussed.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1108/EUM0000000005830
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