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  • 1
    Electronic Resource
    Electronic Resource
    Factors influencing the formation of "black pad" in electroless nickel-immersion gold solderable finishes—a processing perspective (2002)
    Bradford : Emerald
    Circuit world 28 (2002), S. 36-39 
    Details
    ISSN: 0305-6120
    Source: Emerald Fulltext Archive Database 1994-2005
    Topics: Electrical Engineering, Measurement and Control Technology
    Notes: Nickel–gold planar surface coatings have been increasingly specified over the last ten years as the circuit board solderable finish of choice. Although offering a number of significant advantages over both conventional Hot Air Solder Levelled (HASL) finishes and alternative planar finishes, nickel–gold can, under certain conditions, be associated with a premature brittle interfacial solder joint fracture failure. This failure typically occurs at the interface of the nickel deposit and the intermetallic formed during soldering. The exposed nickel usually exhibits a "blackish" discolouration that has led to the term "black pad" being used to describe such failures. Although black pad usually occurs at very low levels, its incidence can be catastrophic and hence much work has been done by numerous workers to elucidate further the causes and mechanisms of this failure. This paper reviews the current understanding of the black pad failures and details work carried out by Shipley to extend this knowledge and to help users minimise the likelihood of its formation.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1108/03056120310418475
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    Paper (German National Licenses)
    Fulltext
  • 2
    Electronic Resource
    Electronic Resource
    Evaluation of an enhanced oxidation method for the destruction of ethylene diamine tetra-acetic acid (EDTA) and related compounds in aqueous solution (2003)
    Bradford : Emerald
    Circuit world 29 (2003), S. 15-19 
    Details
    ISSN: 0305-6120
    Source: Emerald Fulltext Archive Database 1994-2005
    Topics: Electrical Engineering, Measurement and Control Technology
    Notes: Ethylene diamine tetra-acetic acid (EDTA) and other chelates are widely employed in the electroless copper plating solutions and related chemistries used in printed circuit board (PCB) manufacturing. EDTA in particular, imparts many benefits to these processes but it is also becoming increasingly undesirable from an effluent treatment and environmental perspective. Consequently, there is a need to remove EDTA and similar compounds from effluent produced during the PCB manufacturing process. In this paper, the effectiveness of hydroxyl radicals, generated by a UV/ozone based enhanced oxidation process, in destroying relatively low levels of EDTA and other chelates has been evaluated. The influence of temperature, operating pH and chelate concentration has been investigated. Initial results indicate that a combined UV/ozone based process provides a useful and effective method for conveniently destroying EDTA, its hydroxy ethyl analogue and ethanolamine in aqueous solution.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1108/03056120310454952
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    Paper (German National Licenses)
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  • 3
    Electronic Resource
    Electronic Resource
    Recycling technologies for the treatment of end of life printed circuit boards (PCBs) (2003)
    Bradford : Emerald
    Circuit world 29 (2003), S. 33-37 
    Details
    ISSN: 0305-6120
    Source: Emerald Fulltext Archive Database 1994-2005
    Topics: Electrical Engineering, Measurement and Control Technology
    Notes: New legislation to encourage the recycling of end of life electronics and moves to implement sustainable development in electronics manufacturing have focussed attention on the large quantity of printed circuit boards (PCBs) being consigned to landfill. Also, in a recent investigation conducted on behalf of the UK's Department of Trade and Industry, the need for new methodologies for dealing with end of life circuit boards was identified as a priority issue. Within the UK it is estimated that ~50,000 tonnes per annum of PCB scrap is currently generated and investigations indicate that only ~15 per cent is subjected to any form of recycling, with the remainder consigned to landfill. This paper reports the results of a scoping study carried out to identify the technologies and processes that can be used to recycle materials from end of life PCBs.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1108/03056120310460801
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    Paper (German National Licenses)
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  • 4
    Electronic Resource
    Electronic Resource
    New technologies for a sustainable printed circuit board manufacturing process: initial results (2005)
    Bradford : Emerald
    Circuit world 31 (2005), S. 21-25 
    Details
    ISSN: 0305-6120
    Source: Emerald Fulltext Archive Database 1994-2005
    Topics: Electrical Engineering, Measurement and Control Technology
    Notes: Purpose - To present the initial results from a project recently undertaken by Rohm and Haas Electronic Materials Europe Ltd, in collaboration with a number of European partners, to develop individual elements of the traditional PCB manufacturing process towards a sustainable and zero-discharge alternative. Design/methodology/approach - This paper presents initial results from work aimed at enabling PCB manufacturing to become more sustainable. Novel processes evaluated include special electroplating techniques, advanced oxidation methods to remove organic contaminants, and new ion exchange systems. Work has been carried out to develop these processes into viable demonstrators and the results of progress to date are reported. Descriptions of how these individual technologies may be combined to provide an integrated approach to a more sustainable PCB manufacturing methodology are also given. Findings - Initial results indicate that a more sustainable PCB manufacturing process may be achieved by combining the use of organic and metal capture resins with advanced oxidation and electrochemical recovery technologies. Originality/value - The value of the paper lies in its provision of information from a project that is integrating available treatment technologies in a novel approach that will take the PCB manufacturing process closer to a zero effluent discharge situation.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1108/03056120510585036
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    Paper (German National Licenses)
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  • 5
    Electronic Resource
    Electronic Resource
    Soldering considerations for lead-free printed circuit board assembly - an Envirowise Guide (2005)
    Bradford : Emerald
    Circuit world 31 (2005), S. 40-44 
    Details
    ISSN: 0305-6120
    Source: Emerald Fulltext Archive Database 1994-2005
    Topics: Electrical Engineering, Measurement and Control Technology
    Notes: Purpose - To give an overview of the issues encountered, and changes that need to be made in the various types of soldering process when converting them from conventional to lead-free assembly. Design/methodology/approach - This paper has been written to provide a review of the lead-free reflow, wave and hand soldering processes. Problem areas highlighted and methods for adjusting and optimising each type of soldering process for compatibility with lead-free solders are described. Findings - The move to lead-free soldering in electronics assembly can lead to a number of issues that affect process performance, yields and reliability. Problems that are sometimes encountered with conventional lead-bearing solders can exacerbated when moving to lead-free. Many of the issues are associated with the higher melting points of the recommended lead-free solders. Fortunately, these issues are now well known and, with care and attention to process optimisation, they can largely be avoided. Originality/value - The value of the paper lies in its ability to provide information on the types of problems and issues encountered when moving to lead-free solders and the advice it gives on how to avoid them. It also describes how to convert the various lead-free soldering processes used in PCB assembly using a range of measures that can minimise defects, avoid common problems and optimise yields. Sources of additional assistance are also identified.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1108/03056120510585063
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    Paper (German National Licenses)
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  • 6
    Electronic Resource
    Electronic Resource
    Environmental best practice in the PCB industry (2000)
    Bradford : Emerald
    Circuit world 26 (2000), S. 30-33 
    Details
    ISSN: 0305-6120
    Source: Emerald Fulltext Archive Database 1994-2005
    Topics: Electrical Engineering, Measurement and Control Technology
    Notes: The need for the printed circuit board (PCB) industry to minimise its environmental impact is increasingly important, not only because of public lobbying but also because of the potential negative financial implications. For the industry to be competitive and to reduce its costs, it must therefore maximise the benefits of available environmental best practices. Since PCB manufacturing uses many processes that are potentially harmful to the environment, their negative impact can be significant. This also means, however, that there are major opportunities available through the adoption of waste minimisation and environmental best practices. This article outlines the advantages of adopting such practices within PCB manufacturing and details specific examples of where real improvements and savings can be made. Sources of further information are given and specific reference is made to the PCIF's new PCB Industry Environmental Best Practice Guide.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1108/03056120010322870
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    Paper (German National Licenses)
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  • 7
    Electronic Resource
    Electronic Resource
    Development of a new, more efficient and environmentally friendly method of producing high density interconnects - the "PRIME" process (2001)
    Bradford : Emerald
    Circuit world 27 (2001), S. 12-16 
    Details
    ISSN: 0305-6120
    Source: Emerald Fulltext Archive Database 1994-2005
    Topics: Electrical Engineering, Measurement and Control Technology
    Notes: In September 1998 six European companies involved in PCB manufacturing and electronic packaging started collaborating in a development project known as "PRIME". The "Program for Re-engineering and Innovating (PCB) Manufacturing and Equipment" project lost one of its original members in late 1999, and Coates Circuit Products joined as the dielectric supplier. The project is now approaching the mid-term assessment (MTA), where alternative production scenarios will be discussed and the most attractive carried forward to fabricate test vehicles and ultimately demonstrator patterns. Some essential features of the project have already been demonstrated and these initial results will be presented.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1108/EUM0000000005400
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    Paper (German National Licenses)
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  • 8
    Electronic Resource
    Electronic Resource
    A new method for destroying organic contaminants and recycling waste water from printed circuit board manufacturing process effluent streams (2003)
    Bradford : Emerald
    Circuit world 29 (2003), S. 34-41 
    Details
    ISSN: 0305-6120
    Source: Emerald Fulltext Archive Database 1994-2005
    Topics: Electrical Engineering, Measurement and Control Technology
    Notes: Ethylenediaminetetraacetic acid and other organic chelates are widely employed in electroless plating processes used by the printed circuit board and metal finishing industries. These chelating agents can pose problems with downstream waste water treatment, and metals and water recycling processes, due to their ability to complex heavy metal ions and their low biodegradabilities. Conventional treatment methods, such as carbon adsorption, air stripping and reverse osmosis can create secondary waste problems and are normally applied as "end of pipe" treatments. The development of new technology to address these problems would be welcomed. The ROCWAT project, funded by the EC under the "CRAFT" programme, detailed in this paper was undertaken to develop and deliver innovative techniques for the in situ destruction of chelates and other organics found in manufacturing process chemistries and effluent streams.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1108/03056120310478569
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    Paper (German National Licenses)
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  • 9
    Electronic Resource
    Electronic Resource
    An overview of the current status of lead-free assembly and related issues (2003)
    Bradford : Emerald
    Circuit world 29 (2003), S. 23-27 
    Details
    ISSN: 0305-6120
    Source: Emerald Fulltext Archive Database 1994-2005
    Topics: Electrical Engineering, Measurement and Control Technology
    Notes: Over the last few years, the emergence of new European draft legislation has focussed electronics industry attention on the likely ultimate proscription of lead in electronics assembly. Much work has already been undertaken to identify the possible alternatives to conventional tin-lead solders and to evaluate their performance benefits and limitations in comparison with the traditional materials. Although, some companies are already offering products manufactured using lead-free products, there is still a widespread lack of activity in many areas. With this none-too-distant deadline rapidly approaching, Envirowise has sponsored this paper as part of its coordinated activities to assist the UK electronics industry and to promote environmental efficiency and best practice. This paper details the current situation with respect to the drivers towards the adoption of lead-free assembly before giving an overview of the current situation. This paper concludes with details of sources of further information.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1108/03056120310478541
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    Paper (German National Licenses)
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  • 10
    Electronic Resource
    Electronic Resource
    End-of-life electronics legislation - an industry perspective (2004)
    Bradford : Emerald
    Circuit world 30 (2004), S. 41-45 
    Details
    ISSN: 0305-6120
    Source: Emerald Fulltext Archive Database 1994-2005
    Topics: Electrical Engineering, Measurement and Control Technology
    Notes: Increasing awareness of man's impact on the environment and pressure to behave in a more sustainable manner are encouraging both the recycling and reuse of materials and the replacement of hazardous chemicals with more benign ones. The Waste Electrical and Electronic Equipment (WEEE) Directive and the Restriction on the use of certain Hazardous Substances in Electrical and Electronic Equipment (RoHS) Directive, have recently been adopted into law with the specific intention of further encouraging these activities through legislation. In addition to these directives, there is a growing need to adopt sound design principles so that new products are created in a more environmentally acceptable way and that their environmental impact throughout their lifecycles is minimised. This paper gives an overview of this new European legislation and discusses its impact on the electronics industry. The potential benefits of adopting such an approach are outlined.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1108/03056120410512235
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    Paper (German National Licenses)
    Fulltext
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