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  • 1
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 66 (1989), S. 711-715 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The origin of the ohmic behavior observed after annealing Au/n-GaAs {110} Schottky diodes was investigated by electron-beam-induced current (EBIC) measurements of diode plan views and cross sections, combined with standard scanning electron microscopy and transmission electron microscopy techniques. The large leakage currents responsible for this behavior arise at the periphery of the deposited gold films, where elongated gold crystallites which lie on the GaAs surface are observed after heat treatment. These crystallites are typically 2–5 μm long, 500–2000 A(ring) wide, and are crystallographically oriented along the GaAs [110] direction. EBIC imaging demonstrated that a space-charge region was present under the peripheral area showing the gold crystallites. Comparison of current collection as measured with EBIC between annealed and unannealed diodes shows a large reduction in current collection under and around the periphery of the annealed diodes. These data allow attribution of the ohmic behavior to a recombination current. Experiments done with overlapping Au evaporations show that recombination on the bare GaAs surface between the observed crystallites surrounding each annealed diode is the main component of this recombination current, and thus of the large leakage current.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 61 (1992), S. 2545-2547 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: InP was found to be semi-insulating after Cu diffusion. This conversion of both n-InP and p-InP was ascribed to the presence of Cu-In precipitates that act as buried Schottky barriers. The thermal stability of both the precipitates and the electrical properties of InP:Cu were studied after high temperature annealing treatments. Atomic resolution microscopy was used to determine the structure of these precipitates. Diffraction studies of some of these inclusions show that they have the structure of the metallic hexagonal compound Cu16In9. The concentration of Cu-In precipitates was found to be comparable with what our calculations show would achieve intrinsic behavior due to the effect of the metallic inclusions.
    Type of Medium: Electronic Resource
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