ISSN:
1573-4803
Source:
Springer Online Journal Archives 1860-2000
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
Abstract Interface evolution of nanometer scale Au-Ag bimetal film on SiO2 substrate surface during electromigration was investigated by angle resolved X-ray photoelectronspectroscopy (ARXPS). ARXPS spectra showed that a chemical reaction between Au-Ag filmand SiO2 layer occurred at interface, which caused Au, Ag and Si having differentdistribution and chemical states across the film. This result as well as previousobservation by atomic force microscopy (AFM) demonstrate that electromigration of Au-Agbimetal film on SiO2 surface is accompanied with strong interfacial chemicalreaction rather than a simple lateral physical diffusion process.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1023/A:1004886118489
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