ISSN:
1013-9826
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
Si3N4-filled epoxy resin composite was fabricated employing liquid press molding method.Properties, such as thermal conductivity, dielectric constant of Si3N4-filled epoxy resin composite wereevaluated, the effect of the content of Si3N4 and surface treatment of the filler was also considered. Asilane coupling agent, namely NH2−(CH2)3Si−(OC2H5)3, was applied to functionalize the surface of Si3N4filler. Experimental results showed that the thermal conductivity of the composites is strongly dependenton the filler and is dominated by the interface of epoxy resin and Si3N4 particles. As the Si3N4 volumefraction increasing, thermal conductance of Si3N4-filled composite was improved obviously, especiallyfor that of silane-treated Si3N4 powder filled composite. Dielectric constant of the composite increaseslinearly, however, it still remains at a relatively low level (〈5, at 1MHz)
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/53/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.336-338.1346.pdf
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