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  • 1
    Electronic Resource
    Electronic Resource
    Amsterdam : Elsevier
    Journal of Photochemistry and Photobiology A: Chemistry 66 (1992), S. 53-60 
    ISSN: 1010-6030
    Source: Elsevier Journal Backfiles on ScienceDirect 1907 - 2002
    Topics: Chemistry and Pharmacology
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    Amsterdam : Elsevier
    Journal of Photochemistry and Photobiology A: Chemistry 84 (1994), S. 161-166 
    ISSN: 1010-6030
    Source: Elsevier Journal Backfiles on ScienceDirect 1907 - 2002
    Topics: Chemistry and Pharmacology
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 79 (1996), S. 4211-4215 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: We report that a Au/Ge/Pd layered structure can result in low contact resistivities (∼10−6 Ω cm2) to n-GaAs processed in three temperature ranges (175–200, 340–350, and 425–450 °C). The contacts processed below the Au–Ge eutectic temperature (361 °C) show good surface and interface morphology, thermal stability, Au wire bondability, and reproducibility. The ohmic contact formation mechanisms are also presented. © 1996 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 4
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 79 (1996), S. 4216-4220 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: We report the ohmic contact formation mechanism of the low resistance (∼1×10−6 Ω cm2) Au/Ge/Pd contact to n-GaAs annealed at 175 °C. Cross-sectional transmission electron microscopy and Rutherford backscattering spectrometry were utilized in this study. It is found that the solid phase regrowth process, interdiffusion between Au and Ge, and the enhancement of the conductivity of the excess Ge layer are responsible for the observed low contact resistivity. © 1996 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 5
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 78 (1995), S. 6539-6542 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The formation of amorphous interlayers (a-interlayers) by solid-state diffusion in ultrahigh-vacuum-deposited polycrystalline Ti thin film on germanium and epitaxial Si1−xGex (x=0.3, 0.4, and 0.7) alloys grown on (001)Si has been investigated by transmission electron microscopy and Auger electron spectroscopy. Amorphous interlayers, less than 2 nm in thickness, were observed to form in all as-deposited samples. The growth of the a-interlayers was found to vary nonmonotonically with the composition of Si–Ge alloys in annealed samples. On the other hand, the formation temperature of crystalline phase was found to decrease with the Ge content. The results are compared with those of the Ti/Si system. © 1995 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 6
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 80 (1996), S. 2105-2112 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The extended defects induced in silicon by high energy implantation (1.5 MeV B and 2.6 MeV P) have been investigated by plan-view and cross-sectional transmission electron microscopy studies and defect etching measurements. The threading dislocations were identified to be long dislocation dipoles generated in the region of the ion projected range which grew up to the surface. The formation of threading dislocations is shown to have a strong dependence on the implantation dose and O concentration. After 900 °C annealing, a high density of threading dislocations was formed for B and P implants in a dose range of 5×1013–2×1014 cm−2 and 5×1013–3×1014 cm−2, respectively. The threading dislocation density in B-implanted Czochralski Si substrates was found to be much higher than that in B-implanted epitaxial Si substrates. This difference is attributed to the strong pinning effect of oxygen immobilizing dislocations in Czochralski substrates. Because P impurities are also efficient at pinning dislocation motion in Si, a high density of threading dislocations was observed even in epitaxial Si substrates with P implantation. Two-step annealing with a first step at 700 °C (to precipitate oxygen) and a second step at 900 °C was found to be very effective at eliminating the formation of threading dislocations. © 1996 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 7
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 68 (1990), S. 4002-4007 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The growth kinetics of an amorphous (a-)interlayer in polycrystalline Zr and Hf thin films on (111)Si have been investigated by cross-sectional transmission electron microscopy. The growth of the a-interlayer in group-IVb metals and silicon systems was found to exhibit similar behaviors. The growth was found to follow a linear growth law initially. The growth rate then slows down and deviates from a linear growth law as a critical thickness of the a-interlayer was reached. Crystalline silicide (ZrSi or HfSi) was found to nucleate at the a-interlayer/Si interface in samples after prolonged and/or high-temperature annealing. Silicon atoms were found to be the dominant diffusing species during the formation of amorphous alloys. The activation energy of the linear growth and maximum thickness of the a-interlayer were measured to be 1.4 eV, 17 nm and 1.2 eV, 27 nm in Zr/Si and Hf/Si systems, respectively. The correlations among the differences in atomic size between metal and Si atoms, growth rate and activation energy of the linear growth, critical and maximum a-interlayer thickness, the largest heat of formation energy for crystalline silicides, the calculated free-energy difference in forming amorphous phase, as well as the atomic mobility in Ti/Si, Zr/Si, and Hf/Si systems are discussed.
    Type of Medium: Electronic Resource
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  • 8
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 69 (1991), S. 2161-2168 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The growth kinetics of amorphous interlayer (a-interlayer) formed by solid-state diffusion in ultrahigh vacuum deposited polycrystalline Nb and Ta thin films on (111)Si have been investigated by cross-sectional transmission electron microscopy. The growth of a-interlayers in Nb/Si and Ta/Si systems was found to exhibit similar behaviors. The growth was found to follow a linear growth law initially in sample annealed at 450–500 °C and 550–625 °C for Nb/Si and Ta/Si, respectively. The growth then slows down and deviates from a linear growth law as a critical thickness of a-interlayer was reached. The activation energy for the linear growth of a-interlayer was found to be 0.8±0.3 and 0.9±0.3 eV for Nb/Si and Ta/Si, respectively. The correlations among difference in atomic size between metal and Si atoms, growth rate and activation energy of the linear growth, critical and maximum a-interlayer thickness, the largest heat of formation energy for crystalline silicides, the calculated free energy difference in forming amorphous phase as well as atomic mobility in Ti/Si, Zr/Si, Hf/Si, Ta/Si, and Nb/Si systems are discussed.
    Type of Medium: Electronic Resource
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  • 9
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 61 (1987), S. 2218-2223 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Cross-sectional transmission electron microscopy (XTEM) has been applied to the study of the growth kinetics of hexagonal MoSi2 on (001)Si. Growth rates, interface structures, and microstructures in the growth layers were determined for samples annealed at 560–580 °C for various periods of time. The silicide thickness was found to be proportional to the square root of annealing time. The activation energy and the rate constant of the growth were measured to be 2.3 eV and 14 cm2/s, respectively. Growth mechanisms are discussed. The results of the previous studies on the MoSi2 growth are summarized. Advantages of the present approach in the study of the growth kinetics of silicides on silicon, both in sample preparation and in the employment of XTEM technique, are outlined.
    Type of Medium: Electronic Resource
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  • 10
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 62 (1987), S. 3722-3725 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Both plan-view and cross-sectional transmission electron microscopy as well as sheet resistance measurement have been applied to study the effects of As+ ion-beam mixing on the epitaxial growth of MoSi2 on (111)Si. Significant improvement in the epitaxial growth of MoSi2 on (111)Si and lower electrical resistivity of the MoSi2 overlayer were found as a result of ion-beam mixing. Island formation was almost completely alleviated in samples implanted under suitable conditions and subsequently annealed up to 1100 °C. The dispersion of impurities near the Mo/Si interface and/or the generation of defects as a result of the ion-beam mixing are thought to be particularly beneficial to the growth of MoSi2 epitaxy on silicon. The ineffectiveness of the ion-beam mixing for the improvement of the silicon surface coverage in some instances is attributed to the more pronounced accumulation of As atoms at the MoSi2/Si interface to increase the interface energy so that island formation becomes energetically more favorable.
    Type of Medium: Electronic Resource
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