Library

X
feed icon rss

Your email was sent successfully. Check your inbox.

An error occurred while sending the email. Please try again.

Proceed reservation?

Export
  • 1
    Electronic Resource
    Electronic Resource
    Extensions of thermal grooving for arbitrary grain-boundary flux (1995)
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 78 (1995), S. 3833-3838 
    Details
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Groove profiles are computed under isotropic conditions for the intersection of a periodic array of grain boundaries with an external surface, assuming that grain boundary flux I is directed to (I(approximately-greater-than)0) or away from (I〈0) the surface. When I=0, the surface assumes an equilibrium (time-independent) profile. For I≠0, in a range bounded by upper and lower limits that depend on geometry and material parameters, a global steady-state develops in which the entire surface advances (I(approximately-greater-than)0) or recedes (I〈0) from its original position at constant velocity. Beyond these limits, the surface near the groove roots becomes diffusively detached from the remaining surface. A rapidly growing ridge (I(approximately-greater-than)0) or slit (I〈0) then develops along each grain boundary, whose tip ultimately translates at constant velocity in a local steady state, leaving the remaining surface behind. These velocity regimes govern the ultimate stability of polycrystalline materials subjected to large electric (electromigration) or stress (creep) fields, especially in thin films where grain size approximates film thickness. © 1995 American Institute of Physics.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1063/1.359898
    Library Location Call Number Volume/Issue/Year Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 2
    Electronic Resource
    Electronic Resource
    On the kinetic mechanism of grain boundary wetting in metals (1999)
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 85 (1999), S. 3185-3191 
    Details
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The thermodynamic condition characteristic of grain boundary wetting (GBW) causes an imbalance between grain boundary (GB) and solid–liquid interphase surface tensions γGB and γSL. This creates in turn a force acting at the root of the GB groove, and pointing into the solid. The "indentation" action of this force is suggested to cause stress-driven self-diffusion into the GB. This process removes the solid atoms from the groove cavity and causes their deposition along the GB ("internal solution"). Assuming that the GB acts as a perfect sink, this "self-indentation-internal solution" mechanism can account for a number of GBW features: the non-Mullins grooving morphology and linear kinetics, the origin of the singular stress field at the wetting front, the expansion of the solid under GBW, the influence of external stress on GBW, the GBW transitions with temperature, and the fast atomic penetration of the liquid metal ahead of the groove root. © 1999 American Institute of Physics.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1063/1.369659
    Library Location Call Number Volume/Issue/Year Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
Close ⊗
This website uses cookies and the analysis tool Matomo. More information can be found here...