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  • 1
    Electronic Resource
    Electronic Resource
    Fabrication process and thermal properties of SiCp/Al metal matrix composites for electronic packaging applications (2000)
    Springer
    Journal of materials science 35 (2000), S. 6231-6236 
    Details
    ISSN: 1573-4803
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Abstract The fabrication process and thermal properties of 50–71 vol% SiCp/Al metal matrix composites (MMCs) for electronic packaging applications have been investigated. The preforms consisted with 50–71 vol% SiC particles were fabricated by the ball milling and pressing method. The SiC particles were mixed with SiO2 as an inorganic binder, and cationic starch as a organic binder in distilled water. The mixtures were consolidated in a mold by pressing and dried in two step process, followed by calcination at 1100 °C. The SiCp/Al composites were fabricated by the infiltration of Al melt into SiC preforms using squeeze casting process. The thermal conductivity ranged 120–177 W/mK and coefficient of thermal expansion ranged 6–10 × 10−6/K were obtained in 50–71 vol% SiCp/Al MMCs. The thermal conductivity of SiCp/Al composite decreased with increasing volume fraction of SiCp and with increasing the amount of inorganic binder. The coefficient of thermal expansion of SiCp/Al composite decreased with increasing volume fraction of SiCp, while thermal conductivity was insensitive to the amount of inorganic binder. The experimental values of the coefficient of thermal expansion and thermal conductivity were in good agreement with the calculated coefficient of thermal expansion based on Turner's model and the calculated thermal conductivity based on Maxwell's model.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1023/A:1026749831726
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  • 2
    Electronic Resource
    Electronic Resource
    Effect of thermomechanical treatments on microstructure and properties of Cu-base leadframe alloy (2000)
    Springer
    Journal of materials science 35 (2000), S. 3641-3646 
    Details
    ISSN: 1573-4803
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Abstract The effect of thermomechanical treatments (TMT) on the microstructuresand properties of Cu-1.5Ni-0.3Si-0.03P-0.05Mg leadframe alloy wasinvestigated. The Cu-base leadframe alloy was received as hot rolledplates with 8 mm thickness. The hot rolled plates were solutiontreated at 700°C or 800°C for 1 hour, and coldrolled with 40–85% reduction, then followed by aging treatment at450°C. The leadframe alloy solution treated at 800°Cshowed larger grain size of 15 μm comparing with the grain size of10 μm in leadframe alloy solution treated at 700°C. Theleadframe alloy with smaller grain size of 10 μm showed highertensile strength and lower electrical resistivity than that withlarger grain size of 15 μm. The dislocation density increased withincreasing reduction ratio of cold rolling from 40% to 85% andresulted in finer Ni2Si precipitates. Tensile strength increasedand electrical resistivity decreased with increasing reduction ratioof cold rolling due to the formation of finer Ni2Si precipitates.Two types of thermomechanical treatments were performed to enhance theproperties of leadframe alloy. One type of thermomechanical treatmentis to refine the grain size through the overaging, cold rollingfollowed by recrystallization. The recrystallization process improvedthe tensile strength to 540 MPa and elongation to 15% by reducing thegrain size to 5 μm. The other type of thermomechanical treatmentis to refine the precipitate size by two-step aging process. Thetwo-step aging process increased the tensile strength to 640 MPa andreduced the electrical resistivity to1.475 × 10−8 Ωm by reducing the size of Ni2Si precipitates to 4 nm.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1023/A:1004830000742
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  • 3
    Electronic Resource
    Electronic Resource
    Effect of elastic interaction energy on coarsening of γ′ precipitates in a mechanically alloyed ODS Ni-base superalloy (1999)
    Springer
    Journal of materials science 34 (1999), S. 329-336 
    Details
    ISSN: 1573-4803
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Abstract The coarsening behavior of γ′ precipitates with a uniform size distribution and with a bimodal size distribution in a mechanically alloyed ODS Ni-base superalloy were investigated to clarify the effect of elastic interaction energy on the coarsening behavior of γ′ precipitates. The coarsening rate decreased with increasing size of γ′ precipitates with a uniform size distribution, contrary to the classical LSW theory, and the coarsening behavior of γ′ precipitates with a bimodal size distribution exhibited Ostwald ripening in which the larger precipitates grow at the expense of smaller precipitates. The driving force for coarsening of γ′ precipitates was analyzed based on the two-particle model, considering the effect of elastic interaction energy in addition to the effect of interfacial energy. The contribution of elastic interaction energy on the total energy was found to increase with increasing size of precipitates, and the decelerated coarsening of γ′ precipitates was attributed to the decrease in the driving force for coarsening with increasing size of precipitates.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1023/A:1004461724568
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    Paper (German National Licenses)
    Fulltext
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