ISSN:
0305-6120
Source:
Emerald Fulltext Archive Database 1994-2005
Topics:
Electrical Engineering, Measurement and Control Technology
Notes:
L iguid crystal polymer(LCP) dielectric materials have been used to fabricate surface mount PWBs with acoefficient of thermal expansion matched to leadless ceramic chip carriers. Proprietary and patentedpolymer processing technology results in self-reinforcing material with balancedin-plane mechanical properties. In addition, LCPs possess excellent electrical properties,including a low dielectric constant (~3) and very low moisture absorption (〈0.02 %). Laser drilling of blind vias in the LCP dielectric provides a very high density foruse in direct chip attach and area array packages. Modelling indicates that the highout-of-plane CTE of LCPs does not affect the reliability of theplated-through-holes vias. RF characterisation indicates that the material is suitable upto very high frequencies. The material is ideally suited to MCM-L and PCMCIA applicationsinvolving very thin dielectric layers of the LCP.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1108/03056129610799958
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