ISSN:
1013-9826
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
To fabricate a (110) silicon hard master, we used anisotropic wet etching. The etchingchemical for the silicon wafer was a TMAH 25% solution. We fabricated a 1x4 multimode planarwaveguide splitter using the silicon hard master. Organic-inorganic hybrid materials were used ascore and cladding layers of the planar waveguide splitter. The 15 μm-thick under-cladding layerwas coated on a silicon substrate and baked. After the core layer was coated on the under-claddinglayer, the core pattern was formed by using a hot embossing process at 100 °C and 1-3 kg/cm2. Thepropagation loss of the planar waveguide was 0.4 dB/cm and the insertion loss of the 1x4 planarwaveguide splitter was 11.2 dB at the total splitter length of 3.5 cm
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/52/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.321-323.1704.pdf
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