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  • 1
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Capacitance-voltage (C-V) characteristics of the low-pressure chemical vapor deposited phospho-silicate glass (P-glass) films deposited on thin (∼250 A(ring)) thermal SiO2 films on silicon have been investigated as a function of the phosphorus content and rapid thermal annealing in the temperature range of room temperature to 450 °C carried out in various ambients. Simultaneously, the quantitative hydrogen concentration depth profiles of both as-deposited and annealed oxide films were obtained using the nuclear reaction technique. The C-V characteristics were found to be related to the charges in the oxide. The charge density, in turn, is controlled by both the phosphorus and the hydrogen (hydrogenous species) concentration in the films. An interactive relationship that controls the C-V characteristics is postulated between the presence of phosphorus and hydrogen and their concentrations in these oxides. A schematic model is presented that also postulates that hydrogenous species of two different characters are present in these films: one that easily comes out of the film at low temperature annealing and the other that comes out at significantly higher temperatures.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 71 (1992), S. 4623-4625 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The formation of copper silicide by reaction of silane with sputtered copper films has been observed at temperatures as low as 300 °C. The growth kinetics have been monitored by both sheet resistance and x-ray diffraction techniques. Cu5Si is the first phase to form followed next by Cu3Si, coincident with the loss of the original copper layer. The silicide layer provides significant oxidation protection for the underlying copper up to 550 °C in air.
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 74 (1993), S. 1331-1334 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Ion implantation can be used effectively to passivate copper. The effect of B ion implantation on the oxidization rate of copper is studied as a function of B energy and dose. The increase of sheet resistance associated with ion implantation damage and with the incorporation of B is studied. It is found that a post-implantation inert gas annealing (at 400 °C for 20 min) removes the increase in sheet resistance caused by implant damage while preserving the passivation effects of the B implant.
    Type of Medium: Electronic Resource
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  • 4
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 72 (1992), S. 2947-2950 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The effect of exposing low-temperature-annealed chemical vapor deposited phosphosilicate glass films directly to water on the properties of such oxides has been studied. The capacitance-voltage (C-V) curves of these as-deposited oxides have been known to shift on annealing at temperatures in the range of 150–1000 °C in gaseous or vacuum ambients. It is found that when exposed to water, with the increasing duration of water exposure, the C-V curves of these annealed oxides gradually shift back, to the original preanneal location on the voltage axis. The effect, which is similar to the reported effect of water-related traps, is directly observed without using avalanche injection. The C-V recovery is, however, limited to oxides annealed at temperatures ≤450 °C. Hydrogen concentration analysis clearly associates these C-V shifts with changes in concentration resulting from an anneal in a gaseous ambient or to the water exposure. If, however, the oxides are dry annealed at temperatures of 500 °C or higher, the C-V recovery, on water exposure, is very small. So is the increase in the hydrogen concentration, confirming the role of the hydrogenous species in the oxide. The results also suggest a structural change in the oxide occurring at temperatures above 500 °C and leading to oxides that have much lower water solubility compared to that in as-deposited oxides or oxides annealed at temperatures ≤450 °C. Possible mechanisms of oxide charge generation are discussed.
    Type of Medium: Electronic Resource
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  • 5
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 72 (1992), S. 1833-1836 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Silicide formation in Pt-Si bilayers was induced by rapid isothermal annealing using incoherent light from tungsten halogen lamps. The growth sequence of the Pt2Si and the PtSi phases that evolved as the result of the solid state reaction in the bilayers was monitored by Rutherford backscattering spectroscopy. The identification of the phases was confirmed by x-ray diffraction. Activation energies for the formation of the Pt2Si and the PtSi phase were determined to be 1.38 and 1.67 eV, respectively. These values agree with the reported results of the formation of these silicides by furnace anneals. Hence, rapid isothermal anneals do not appear to enhance the solid-state reactions in Pt-Si bilayers. It was also found that even rapid thermal anneals led to the formation of a very thin oxide that provided protection to the underlying silicide during selective Pt etch.
    Type of Medium: Electronic Resource
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  • 6
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 77 (1995), S. 3581-3583 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: A 500 A(ring) erbium (Er) film was deposited on potassium titanyl phosphate (KTiOPO4 or KTP) by electron-beam evaporation. The doping of Er into KTP was induced by mega-electron-volt Ar+ with different doses. The doping amount was investigated by Rutherford backscattering of 3.0 MeV He+. The results show that the doping concentrations of Er in KTP were 2.88 and 1.88 at. % induced by 2.0 and 3.0 MeV Ar+ with the dose of 2×1016 ions/cm2 at room temperature, respectively. Perhaps the present result can provide an important approach not only for the laser and waveguide laser fabrication, but also for the high-concentration dopants (atomic percent levels) into KTiOPO4 at room temperature. © 1995 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 7
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 76 (1994), S. 2104-2108 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: 600–1200 keV Xe+ were implanted into KTiOPO4 (potassium titanyl phosphate) in increments of 100 keV. The depth distributions of implanted Xe+ in KTiOPO4 were measured by Rutherford backscattering. The effects of channeling, temperature, and dose on the depth distribution were briefly investigated. All range distributions were nearly Gaussian. The mean projected range and range straggling obtained were compared with the TRIM'91 code, projected range algorithm (PRAL) and Wang and Shi's (WS) calculation procedure based on Biersack's angular diffusion model. The results show that TRIM'91 systematically underestimates the projected range by approximately 25%, PRAL underestimates the range by approximately 28%, and WS underestimates the range by approximately 7%. All calculate the underestimated range straggling by approximately a factor of two.
    Type of Medium: Electronic Resource
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  • 8
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 75 (1994), S. 3627-3631 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The properties of thin films of Cu with 1 at. % Al are explored. As-deposited films of Cu(1 at. % Al) oxidize orders of magnitude more slowly than do those of pure Cu. After Cu(1 at. % Al) films are annealed in Ar at 400 °C for 30 min, very thin protective layers of aluminum oxide form on the surface. These thin oxide layers stop further oxidation of the copper. Cu(1 at. % Al) films also adhere better to SiO2 than do films of pure copper. Unlike pure Cu, films of Cu(1 at. % Al) remain microscopically smooth after anneals at temperatures up to 700 °C. In addition, Cu(1 at. % Al) films show no diffusion of Cu (as measured by Rutherford backscattering spectroscopy) into SiO2 at temperatures up to 700 °C. The addition of Al to Cu does increase its resistivity by about 2 μΩ cm per 1 at. % Al, but a possible procedure to avoid this problem is proposed.
    Type of Medium: Electronic Resource
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  • 9
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 68 (1996), S. 1622-1624 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Thin films made by annealing Cu(500 nm)/Al(7 nm)/SiO2/Si are investigated using Rutherford backscattering and resistivity measurements. Annealing these films in a low pressure of oxygen results in the formation of a thin surface layer of hole-free aluminum oxide which protects the underlying copper from oxidation. Even when heated in air at 350 °C for 4 h, no growth of copper oxide is detected. These films have a resistivity as low as 2.4 μΩ cm, comparable to the resistivity of pure copper films (2.1 μΩ cm) made in the same deposition system. The use of such films for microelectronic metallization is briefly discussed. © 1996 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 10
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 52 (1988), S. 1962-1964 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Hydrogen content at the Al/Si interface of samples with Al films deposited by conventional means and by a partially ionized beam (PIB) was measured using 1H(15N,αγ)12C nuclear resonance reaction. We observed that samples with PIB-deposited Al film exhibited significantly lower hydrogen concentration at the Al/Si in interface than that of the sample deposited by conventional means. The results demonstrated the ability of the PIB technique to perform interface self-cleaning, at least for hydrogen contaminant.
    Type of Medium: Electronic Resource
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