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  • 1
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 68 (1990), S. 6485-6494 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: In modern production schemes for Si solar cells, defect passivation and impurity gettering are often used to improve material quality and thereby cell efficiency. These processes generally alter the spatial uniformity of minority-carrier transport parameters over the wafer and may result in minority-carrier lifetime and diffusion length variations both lateral and in depth. In polycrystalline Si these spatial dependences are already present due to the nature of the material. We present an extension of the photocurrent decay method to determine the diffusion length in a three-dimensionally resolved fashion. From a single photocurrent decay curve the back-surface recombination velocity, the average minority-carrier diffusion length, and an asymmetry factor which qualitatively describes the depth dependence of the diffusion length are determined. This is done using the three observables: quantum efficiency, fundamental decay time, and intercept of the extrapolated decay curve with the time-zero axis. Lateral resolution is obtained by focusing the light beam to a small spot on the cell and measuring the current decay curve as a function of position on the cell. It is shown that light-pulse durations longer than the minority-carrier lifetime and wavelengths longer than 950 nm are required. These conditions are met by using modulated wavelength-tunable light from a Ti:sapphire laser. Measurements on monocrystalline cells show that the decay time is independent of wavelength and light-pulse duration, as predicted by theory. Furthermore, the intercept with the time-zero axis was shown to increase with increasing pulse duration and wavelength. Measurements on a set of polycrystalline Si cells were performed showing that gettering treatments during cell production result in depth-dependent lifetimes.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 71 (1992), S. 3780-3784 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: A new concept of ion beam defect engineering is proposed. Reduction of secondary defects in 1 MeV As ion-implanted Si(100) has been investigated by Rutherford backscattering/channeling and high resolution electron microscopy. It is found that the additional irradiation of 1.6 MeV Si ions prior to two-step thermal annealing leads to a noticeable reduction of secondary defects. Good recrystallization of a buried amorphous layer is also obtained by irradiation of 1.6 MeV, 2×1015 Si/cm2 into the implanted Si sample held at elevated temperatures.
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 58 (1991), S. 2827-2829 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Implantation of 1.0 MeV 115In in Si results in secondary-defect formation during subsequent 900 °C annealing if the total number of displaced Si atoms is greater than 1.6×1017/cm2, achieved with a dose near 1.5×1013/cm2. We demonstrate, though, that higher total In doses can be introduced without forming secondary defects by repetitive subthreshold implants each followed by an anneal to remove the implant damage. While a single 6×1013 In/cm2 implant results in a high density of dislocation loops after annealing, instead using four separate 1.5×1013 In/cm2 implants each followed by an anneal leads to the formation of only a few partial dislocations.
    Type of Medium: Electronic Resource
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  • 4
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 55 (1989), S. 1838-1840 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: MeV ion implantation in Si above a dose of 1014/cm2 leads to secondary defect formation in a buried layer, which is rather stable. Annealing of Si(100) implanted with 2.0 MeV B+ ions to a dose of 2.2×1014/cm2 has been investigated by means of cross-sectional transmission electron microscopy. After annealing at 900 °C for 15 min, dislocation loops elongated along [110] were found. A remarkable decrease in secondary defect formation has been observed if, in addition, 140 keV Si+ was implanted prior to annealing.
    Type of Medium: Electronic Resource
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  • 5
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 63 (1993), S. 1134-1136 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: For 30 keV B implants in Si, doses above 1.5×1014 B/cm2 will lead to dislocation formation during a subsequent 900 °C anneal to make the B electrically active. Although dislocations are avoided for doses 〈1.5×1014 B/cm2, the B concentration is only ∼1×1019 B/cm3, a factor of 4–5 lower than the solid solubility of B in Si at 900 °C. Using multiple implant/anneal steps, we demonstrate here that implanted, electrically active B can be introduced up to the solid solubility limit while avoiding dislocation formation.
    Type of Medium: Electronic Resource
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