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  • 1
    Electronic Resource
    Electronic Resource
    Springer
    Journal of materials science 18 (1983), S. 2354-2360 
    ISSN: 1573-4803
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Abstract In the non-destructive evaluation of diffusion bonds, a possible technique is to measure the potential drop for a given current flow. Using evidence from optical and acoustic microscopy, the geometrical details of an incomplete diffusion bond are represented by an idealized mathematical approximation. This is solved exactly using conformai mapping by a Schwarz transformation. The result for the change in resistance as a function of bond development is given as an analytic expression.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    New York, NY : Wiley-Blackwell
    International Journal of Quantum Chemistry 23 (1983), S. 1057-1063 
    ISSN: 0020-7608
    Keywords: Computational Chemistry and Molecular Modeling ; Atomic, Molecular and Optical Physics
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology
    Notes: We have recently produced a Lifson-Warshel force field for the silicon crystal. This field, that goes further than the harmonic approximation, is particularly adapted for the calculation of defect structures. It requires five free parameters, but one of them in the field already produced, the linear bending term, is significant for the perfect lattice structure only and should be eliminated in dealing with defect structures. Also, one of the fixed parameters can be adjusted to fit precisely the experimental value of the stacking fault energy. We show that an excellent fitting of the phonon dispersion curves, in the least squares sense, is obtained with the parameters thus changed. We illustrate the use of this field in discussing the problem of reconstruction of the 90° partial dislocation in silicon.
    Additional Material: 8 Ill.
    Type of Medium: Electronic Resource
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