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  • 1
    Electronic Resource
    Electronic Resource
    s.l. : American Chemical Society
    Journal of the American Chemical Society 73 (1951), S. 755-756 
    ISSN: 1520-5126
    Source: ACS Legacy Archives
    Topics: Chemistry and Pharmacology
    Type of Medium: Electronic Resource
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  • 2
    ISSN: 0375-9474
    Source: Elsevier Journal Backfiles on ScienceDirect 1907 - 2002
    Topics: Physics
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 89 (2001), S. 7983-7987 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Gold Schottky contacts to n-AlGaN were fabricated, and the influence of the semiconductor surface preparation on the electrical performance of the diodes was examined. More significantly, the electrical characteristics of the diodes were found to be sensitive to the environment in which they were exposed. Diodes stored in vacuum had stable but poor electrical characteristics, exhibiting the same high reverse leakage currents, low barrier heights, and high ideality factors as the freshly prepared diodes. On the other hand, didoes exposed to air changed over the course of days, in some cases with decreases in the reverse leakage currents by four or more orders of magnitude and increases in the barrier height by 0.3–0.5 eV. Further study of this change in electrical properties showed that the effect was reversible with exposure to N2 gas or vacuum and adequate temperature. In addition, the effect was more pronounced when the metal contact was thin, indicating that diffusion of gases through the metal was significant. This study suggests that nitride semiconductor devices with Schottky barriers to n-AlGaN as components may exhibit improved performance if they are initially stored in air for a few days prior to encapsulation and will also exhibit a pronounced sensitivity to their storage and operational environment if not adequately protected from it. © 2001 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 4
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 79 (2001), S. 3248-3250 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: We have demonstrated sub-100 ps jitter operation of a pressurized high-voltage air spark gap triggered by a femtosecond Ti:Sapphire laser. Time delay statistical fluctuations with a standard deviation as low as +−σ=0.037 ns were obtained. © 2001 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 5
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 71 (1997), S. 3859-3861 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Using high resolution transmission electron microscopy, a thin pseudomorphic AlN layer (2–3 nm) has been observed at the metal/GaN interfaces of Ti/Al (35/115 nm) and Pd/Al (25/125 nm) ohmic contacts to n-type GaN annealed in Ar at 600 °C for 15 and 30 s, respectively. The interfacial layer has a c-plane (002) lattice spacing of 2.48±.03 Å and an a-plane (100) spacing matching that of GaN (2.76 Å), and the identification of this layer as AlN is consistent with chemical analysis by energy dispersive x-ray spectroscopy. The formation of this interfacial AlN layer coincides with the onset of ohmic behavior in Ti/Al and Pd/Al contacts annealed at 600 °C and may be the cause. © 1997 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 6
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 70 (1997), S. 2156-2158 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The oxidation of single crystal gallium nitride in dry air has been investigated. X-ray photoelectron spectroscopy (XPS) revealed minimal oxide growth at 450 and 750 °C for up to 25 h. However, at 900 °C the growth of an oxide approximately 5000 Å thick was observed after 25 h. This oxide was determined to be the monoclinic β-Ga2O3 using glancing angle x-ray diffraction. XPS spectra of the Ga 3d and Ga 2p core levels indicated peak shifts of 1.2 and 1.3 eV, respectively, from Ga–O to Ga–N bonding. The Ga L3M45M45 core level binding energy was also investigated and β-Ga2O3 and GaN each presented a characteristic peak shape. © 1997 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 7
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 82 (1997), S. 650-654 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Thin Ni films on GaN were annealed at temperatures between 400 and 900 °C in N2, Ar, and forming gas and were analyzed using glancing angle x-ray diffraction and Auger depth profiling. The first indication of an interfacial reaction was found after an anneal at 600 °C for 1 h, after which Ga was observed to be dissolved in the face-centered cubic Ni film. The extent of dissolution increased with continued annealing. After annealing at 750 °C for 1 hr in either N2 or Ar, greater intermixing occurred. The reaction product was either Ni3Ga or face-centered cubic Ni with dissolved Ga. Annealing at 900 °C resulted in the formation of the B2 phase NiGa. It was clear from Auger depth profiles that the reacted film contained significantly more Ga than N and that N2 gas was released to the annealing environment, even when the samples were annealed in N2 gas at 1 atm. Thus, a trend of increasing Ga content in the reacted films was observed with increasing temperature. The observed reactions are consistent with the thermodynamics of the Ni–Ga–N system. © 1997 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 8
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 67 (1995), S. 1902-1904 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The etch rates and selectivity of Si3N4 over SiO2 have been investigated by microwave discharging a mixture of NF3 and Cl2 and flowing the resultant fluorine and chlorine atoms and interhalogenous molecules simultaneously over a silicon wafer covered with low pressure chemical vapor deposition (LPCVD) Si3N4, and a wafer covered with thermally grown SiO2. The temperature dependence of the etch rates of Si3N4 and SiO2 in the NF3/Cl2 mixture was examined in the range from 25 to 500 °C, and the selectivity of the nitride etch over the oxide etch as well as nitride etch rate was found to increase with increasing temperature. It was also found that both etch rates and selectivities increase with NF3 flow rates within the range used in this study. © 1995 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 9
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 70 (1997), S. 57-59 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: We report on a study of Al and Ti/Al contacts to n-type GaN. Al contacts on n-GaN (7×1017 cm−3) annealed in forming gas at 600 °C reached a minimum contact resistivity of 8×10−6 Ω cm2 and had much better thermal stability than reported by previous researchers. Ti/Al (35/115 nm) contacts on n-GaN (5×1017 cm−3) had resistivities of 7×10−6 and 5×10−6 Ω cm2 after annealing in Ar at 400 °C for 5 min and 600 °C for 15 s, respectively. Depth profiles of Ti/Al contacts annealed at 400 °C showed that low contact resistance was only achieved after Al diffused to the GaN interface. We propose that the mechanism for Ohmic contact formation in Ti/Al contacts annealed in the 400–600 °C range includes Ti reducing the GaN native oxide and an Al–Ti intermetallic coming into intimate contact with the GaN. © 1997 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 10
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 63 (1993), S. 171-173 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Nearly isotropic etching of the 6H-SiC carbon face has been achieved in a remote plasma at 330 °C using a mixture of O2 and NF3 in argon. Using evaporated aluminum as a mask, undercutting has been observed to a distance equal to the etch depth. The etch rate is a function of the ratio of O2 to NF3 flow rates and of temperature, peaking strongly to 220 nm/min at 82% oxygen for 330 °C. Smooth surfaces were obtained for gas ratios leading to the maximum etch rate, and also for a NF3-argon mixture, with significant roughening observed for other O2-NF3-argon mixtures. In the absence of a practical wet etch for SiC, this procedure is promising for isotropic etching in SiC device processing.
    Type of Medium: Electronic Resource
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