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  • 1
    ISSN: 1573-4803
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Abstract Thermal degradation pathways of the rigid-rod polymer, poly (p-phenylene benzobisthiazole, PBT) have been elucidated by thermal volatilization analysis and related techniques. Processes are characterized by the expulsion of hydrogen sulphide, acetylene, and some carbon disulphide. Evidence is presented for the production and subsequent polymerization of aromatic nitriles and for the existence of thermal rearrangements to produce quinoline derivatives. A similar analysis of the semi-flexible coil polymer, poly (ether ether ketone ether ketone, PEEKEK) revealed the importance of directed chain-scission processes to form oligomers, carbon monoxide expulsion with radical recombination to produce biphenyl linkages, and aromatic fusions to produce fluorenone-type derivatives. Examination of a “hairy rod” comb-type graft copolymer of PBT and PEEKEK revealed some instability introduced by the grafting process and determined that the graft site thermally isomerized through oxygen migration to yield xanthone-based heterocyclic intermediates of degradation.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    New York, NY [u.a.] : Wiley-Blackwell
    Journal of Applied Polymer Science 42 (1991), S. 679-691 
    ISSN: 0021-8995
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: The kinetics and thermodynamics of the cure and post-cure reactions of an acetylene terminated sulfone (ATS) resin mixture and pure fractions from that mixture were studied using differential scanning calorimetry. Thermal stabilities were measured by programmed thermogravimetry under helium, and oxidative stabilities using isothermal thermogravimetry in air. Microstructural changes accompanying the cure reaction were identified using infrared spectroscopy. Early products of thermal degradation were trapped for identification and quantitative analysis using the technique of sub-ambient thermal volatilization analysis. We found that glass transition temperatures increase with crosslink density in the resin, that oxygen is able to copolymerize or couple with the polyenes to produce peroxides or hydroperoxides (respectively) which subsequently decompose to form terminal alcohols on the polyene, that weight loss in air at 600°F is an oxidative process that is insensitive to resin crosslink density, and that sulfone functionality constitutes the thermal weak link in the ATS resin system.
    Additional Material: 14 Ill.
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 27 (1987), S. 1557-1561 
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: Rigid rod molecular composites involve molecular level mixing of two polymers having greatly disparate chain conformations (one rodlike and one flexible coil like). Morphology studies have shown that in such materials the bundle diameter of these rigid rod molecules is less than 5 nm. The rigid rod molecule used is poly(para-phenylene benzobisthiazole) (PPBT). The thermoplastic flexible polymer matrix is Nylon-66, DuPont's Zytel 42. Thermal analysis studies on these materials indicate that the expected Tg shifts, as observed for blends of two flexible polymers, and depression of Tm with increased rod molecule composition does not occur.
    Additional Material: 10 Ill.
    Type of Medium: Electronic Resource
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  • 4
    Electronic Resource
    Electronic Resource
    Bognor Regis [u.a.] : Wiley-Blackwell
    Journal of Polymer Science Part B: Polymer Physics 29 (1991), S. 119-128 
    ISSN: 0887-6266
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Physics
    Notes: Poly(oxy-1,3-phenylenecarbonyl-1,4-phenylene), mPEK, was synthesized in a methane sulfonic acid/phosphorus pentoxide medium through the polycondensation of 3-phenoxybenzoic acid. The polymer was soluble at room temperature in strong acids and common organic solvents. Differential scanning calorimetry on mPEK indicated a glass transition temperature of 132°C and no detectable crystal melting behavior. The polymer was thermo-oxidatively stable up to 420°C in air as determined by thermogravimetric analysis. Thermal degradation resulted in a crosslinked polymer. Compression molding was successfully applied to consolidate mPEK powder into bulk specimens without causing degradation. Tensilefractured surfaces of the consolidated specimens were examined by scanning electron microscopy which strongly indicated adequate fusion of mPEK powder but also disclosed microvoids of uniform size, shape, and distribution. X-ray scattering revealed that mPEK powder was amorphous and that the consolidated mPEK specimens were structurally isotropic as well as amorphous. The bulk specimen density was determined to be 1.29 ± 0.01 g/cm3 and the three-dimensionally isotropic bulk tensile properties were shown to be 4.10 ± 0.10 GPa (modulus), 0.07 ± 0.01 GPa (strength), and 0.021 ± 0.006 (elongation at break). Tensile properties of the amorphous mPEK specimens compared favourably with literature values of state-of-the-art semicrystalline thermoplastics. Crystaline phases could be realized for mPEK by melt-processing, or precipitating from a solvent.
    Additional Material: 11 Ill.
    Type of Medium: Electronic Resource
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