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  • 1
    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Advanced materials research Vol. 15-17 (Feb. 2006), p. 894-899 
    ISSN: 1662-8985
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: The effect of a mixed powder on the wide gap transient liquid phase diffusion bonding ofa directionally solidified Ni base superalloy, GTD-111 was investigated. The mixed powderconsisted of a mixture of a powdered Ni base filler (GNi-3) and powdered base metal (GTD-111).The range of the base metal powder was 40 to 70wt%. Bonding was performed at a temperature of1463K, using various holding time. In the case of a lower 50wt%, the base metal powderscompletely melted and base metal mating at the interface dissolved at an early time, and extent ofdissolution of base metal decreased with increasing mixing ratio. Liquid was eliminated byisothermal solidification, which was controlled by the diffusion of B into the base metal. The solidsin the bonded interlayer grew epitaxially from the mating base metal inward from the insert metaland the number of grain boundaries formed at the bonded interlayer corresponded with those of thebase metal. The finishing time for isothermal solidification was about 74ks. In the case 60wt% andhigher, the base metal powders partially melted and remained in the vicinity of bonded interlayer.The solid was formed from the remaining powder and base metal mating at the interface. Finally,the bonded interlayer underwent the poly-crystallization when isothermal solidification wascomplete. The contents of Al and Ti in the bonded interlayer with a holding of 74ks were equal tothat of the base metal
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Solid state phenomena Vol. 118 (Dec. 2006), p. 65-70 
    ISSN: 1662-9779
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Physics
    Notes: In the case of transient liquid phase diffusion bonding with Ni base superalloy GTD-111,the bonding temperature was sustained at 1403K ~ 1453K. Thus, the microstructure of specimensheated at 1403K ~ 1453K was examined. In the raw material, γ-γ' eutectic phases, platelet η phases,MC carbide and PFZ were clearly observed in interdendritic regions or near the grain boundary andthe size of primary γ' precipitates near the interdendritic regions were larger than the core. Theprimary γ' precipitated in the dendrite core dissolved early in the bonding process. γ' precipitatednear the interdendritic regions were partially solubilized and their shape was changed. Thedissolution rate increased with increasing temperature. Phases in the interdendritic regions or nearthe grain boundary changed continuously with time at the bonding temperature. At a bondingtemperature of 1403K, the eutectic phases remained, but η phases were transformed from a plateletshape to a needle morphology and the PFZ region widened with time. The interdendritic region andnear the grain boundary became partially liquid at 1423K and fully at 1453K by the reaction of ηphases and PFZ. The interdendritic region and near grain the boundary became liquid and newphases which were mixed with η phases, PFZ and MC carbide crystallized during cooling at 1453K.Crystalline η phases were transformed from a rod shape to a platelet shape with increasing holdingtime
    Type of Medium: Electronic Resource
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