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  • 1
    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Advanced materials research Vol. 15-17 (Feb. 2006), p. 894-899 
    ISSN: 1662-8985
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: The effect of a mixed powder on the wide gap transient liquid phase diffusion bonding ofa directionally solidified Ni base superalloy, GTD-111 was investigated. The mixed powderconsisted of a mixture of a powdered Ni base filler (GNi-3) and powdered base metal (GTD-111).The range of the base metal powder was 40 to 70wt%. Bonding was performed at a temperature of1463K, using various holding time. In the case of a lower 50wt%, the base metal powderscompletely melted and base metal mating at the interface dissolved at an early time, and extent ofdissolution of base metal decreased with increasing mixing ratio. Liquid was eliminated byisothermal solidification, which was controlled by the diffusion of B into the base metal. The solidsin the bonded interlayer grew epitaxially from the mating base metal inward from the insert metaland the number of grain boundaries formed at the bonded interlayer corresponded with those of thebase metal. The finishing time for isothermal solidification was about 74ks. In the case 60wt% andhigher, the base metal powders partially melted and remained in the vicinity of bonded interlayer.The solid was formed from the remaining powder and base metal mating at the interface. Finally,the bonded interlayer underwent the poly-crystallization when isothermal solidification wascomplete. The contents of Al and Ti in the bonded interlayer with a holding of 74ks were equal tothat of the base metal
    Type of Medium: Electronic Resource
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