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  • 1
    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Advances in science and technology Vol. 56 (Sept. 2008), p. 334-338 
    ISSN: 1662-0356
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Natural Sciences in General , Technology
    Notes: Water is an essential requirement in everyday life and global demand for clean usablewater is increasing year by year. Therefore, developing and implementing effective water resourcemanagement and conservation strategies is vital. Generally speaking, most individuals (particularlysenior citizens) prefer to use warm water when washing their hands or taking a bath. When hot wateris left standing in the hot water pipe (i.e. the faucet is turned off), it will gradually cool. Consequently,when the faucet is first turned on, the water is generally allowed to run until it becomes sufficientlyhot. Meanwhile, the original cooler water is simply drained away. Clearly, this approach is wastefulof both time and water. Therefore, this paper develops a green storage tank to perform athermo-controlled water supply function. The tank is positioned between the hot water supply and thefaucet and its operation is controlled by an electro-thermal thin-film heater and a thermo-controlledvalve. When the faucet is turned on, the cooler water in the hot water pipe is directed into the tank.Once this water enters the tank, it is mixed with hot water stored inside until it acquires the desiredtemperature. The warmed water is then supplied to the faucet. When the water flowing through thehot pipe to the tank is already sufficiently warm for use, the thermo-controlled water supply functionis automatically overridden, and the warm water is delivered directly to the faucet. The proposedgreen storage tank not only provides effective water and energy resource savings, but also provides amore convenient operation
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Materials science forum Vol. 505-507 (Jan. 2006), p. 805-810 
    ISSN: 1662-9752
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Chemical Mechanical Polishing (CMP) is the key technique for wafer global planarization. However, the characteristic of abrasive particle, including particle size and grain/grain collision elasticity, plays an important role in CMP process. This investigation analyzes the slurry flow between the wafer and pad using a grain flow model with partial hydrodynamic lubrication theory. This model predicts the film thickness and remove rate of the slurry flow under a variety of the CMPparameters including load, rotation speed, pad roughness, grain/grain collision elasticity and grain size. The theoretical results compare well with the previous experiment data. This study elucidates the grain characteristics during CMP process. It also contributes to the understanding of abrasive particleeffects in the chemical mechanical polishing mechanism
    Type of Medium: Electronic Resource
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