ISSN:
1662-8985
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
The friction behavior of single silicon wafer sliding against different ice counterparts(α-Al2O3, CeO2 and SiO2) at 10±0.5 °C within a velocity of 60 rpm~300 rpm were studied using ahome-made friction and wear testing machine. The morphologies and surfaces roughness of the wornsilicon wafers were observed and examined on a non-contact surface topography instrument (ADE). Itwas found that the friction coefficient of the single silicon wafer decreased with the increase of slidingvelocity. Single crystal silicon wafer coupled with α-Al2O3 ice counterpart recorded the highestfriction coefficient and the biggest surface roughness, while it had the lowest friction coefficient andthe smallest surface roughness as with CeO2 ice counterpart. One reason was that a series oftribochemical reactions occurred at the local contact point between the ice counterpart and the siliconwafer during sliding. Under alkaline condition, there would be a soft corrosion layer formed on thesurface of the silicon wafer. Another reason was that the hardness of the abrasive particles wasdifferent and this caused different cutting depth of them
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/41/transtech_doi~10.4028%252Fwww.scientific.net%252FAMR.53-54.167.pdf
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