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  • 1
    Electronic Resource
    Electronic Resource
    Comparative cutaneous testing with purified protein derivative and the antigen complex A60 in vaccinated subjects and tuberculosis patients (1995)
    Springer
    Medical microbiology and immunology 184 (1995), S. 9-15 
    Details
    ISSN: 1432-1831
    Keywords: Mycobacteria · ; Infectious diseases · ; Immune reactions · ; Cutaneous testing
    Source: Springer Online Journal Archives 1860-2000
    Topics: Medicine
    Notes: Abstract Some 840 bacille Calmette-Guérin (BCG)-vaccinated healthy controls and tuberculosis patients from two Chinese hospitals were submitted to comparative skin tests with purified protein derivative of tuberculin (PPD; as reference) and with the antigen complex A60 from Mycobacterium bovis BCG. In a first trial, including 581 persons (185 healthy juveniles, 180 healthy adults and 216 tuberculosis patients), a limited dose of A60 (1μg) was used. Performance of the A60 test was similar to that of 5 I.U. PPD for controls (cut-off values=5 mm induration diameter), but lower than that seen for tuberculosis patients (10 mm cut-off values). A second survey was conducted on 259 persons (109 recently revaccinated healthy persons, considered as tuberculin-negative in the first trial, and 150 tuberculosis patients), using a higher dose of A60 (2 μg) and the same dose of PPD (5 I.U.). Similar results were obtained with the two tests in all cases, thus supporting the possibility of PPD replacement by A60 in cutaneous testing. The pattern of induration diameter distribution in healthy subjects who took part in the first testing round (64% positively rate) was displaced to the inactivity side (with a peak at 5 to 9-mm diameter), in comparison with the second round (90% positivity rate and peak at 10–14 mm). This indicates a progressive fading of cellular immunity reactions after BCG vaccination. In tuberculosis patients, no correlation was found among the following three parameters: positivity at cutaneous testing (with PPD or A60), titer of anti-A60 mycobacterial immunoglobulins in blood (IgG titer higher than cut-off line) and presence of mycobacteria in sputum.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF00216784
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  • 2
    Electronic Resource
    Electronic Resource
    Texture and stress of Ag films in Ag/Ti, Ag/Cr bilayers, and self-encapsulated structures (1997)
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 81 (1997), S. 7773-7777 
    Details
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The texture of evaporated Ag films prepared on Ti or Cr underlayers before and after encapsulation process has been studied by x-ray diffraction. In addition, the stress state in self-encapsulated Ag/Ti structures has also been investigated using a "sin2 ψ" technique. Silver films deposited on Ti layers exhibit a strong 〈111〉 texture, which is in contrast to the nearly random orientation of Ag films on Cr underlayers. The minimization of interfacial energy with respect to lattice match can account for this underlayer dependence. After an encapsulation process involving Ti reactions in an ammonia ambient, the texture of Ag films in Ag/Ti bilayers is further enhanced. Highly textured Ag films may provide the basis for electromigration-resistant Ag metallization in integrated circuit devices. For the Ag/Ti bilayer structures, a low tensile stress of approximately 61 MPa arising from the nonequilibrium growth during the film deposition is present in the Ag films. This results in a lattice tension state in the film plane and a lattice compression state along the film normal. Thermal mismatch stress is produced by the encapsulation process at 600 °C. Most of this stress relaxes during the cooling stage and a residual tensile stress of ∼320 MPa in the film plane was determined. © 1997 American Institute of Physics.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1063/1.365386
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  • 3
    Electronic Resource
    Electronic Resource
    Texture and microstructural evolution of thin silver films in Ag/Ti bilayers (1998)
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 83 (1998), S. 779-785 
    Details
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The texture and microstructure of thin silver films in Ag/Ti bilayer structures have been characterized as a function of vacuum annealing temperature and time with the use of x-ray diffraction and transmission electron microscopy. A strong preexisting (111) texture in Ag films was further improved upon annealing as evidenced by an increased intensity and narrower distribution of the texture along the film normal. A new (200) texture component was generated after 600 °C annealing; it however had a relatively low intensity when compared to the dominant (111) texture. No abnormal grain growth was observed in annealed Ag films. The texture evolution in all films appeared to complete within the first 15 min annealing, while the microstructure continued to change with additional annealing time. The roles of both surface energy and strain energy in the grain growth were evaluated. A model of the grain growth and texture evolution has been proposed to explain these observations. © 1998 American Institute of Physics.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1063/1.366758
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  • 4
    Electronic Resource
    Electronic Resource
    Formation of titanium nitride by annealing Ag/Ti structures in ammonia ambient (1997)
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 82 (1997), S. 3321-3327 
    Details
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Titanium nitride thin films have been formed in the temperature range of 400–600 °C by annealing Ag/Ti bilayer films on oxidized Si substrates in an ammonia ambient. Rutherford backscattering spectrometry and Auger depth profiling have shown the segregation of Ti at the surface and at interface. Ti diffused out through the silver layer and reacted with ammonia to form a TiN layer that self-encapsulated the silver film. A near-bamboo structure in the encapsulated Ag films was observed using cross-sectional transmission electron microscopy. Such a structure is expected to improve the electromigration resistance of the silver metallization. The kinetics of the Ti-nitride growth was studied by investigating its dependence on time, temperature, and Ag/Ti bilayer thicknesses. We also found that two processes govern the nitridation reaction. A dominant nitridation process takes place initially at fast growth rates. After 15 min anneals the nitride growth can be described by x2=B t, where B is a parabolic rate constant for the growing nitride phase. The parabolic rate constants follow an Arrhenius behavior with an apparent activation energy of ∼0.4 eV. These observations led to further discussion regarding the diffusion mechanism as well as the rate-limiting step. © 1997 American Institute of Physics.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1063/1.365641
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