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  • Articles: DFG German National Licenses  (33)
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  • Articles: DFG German National Licenses  (33)
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  • 1
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 79 (1996), S. 7051-7057 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Interface states in the Si band gap present at oxide/Si(100) interfaces for ∼3-nm-thick Pt/2.1∼3.6-nm-thick silicon oxide/n-Si(100) metal–oxide–semiconductor devices are investigated by measurements of x-ray photoelectron spectra under biases between the Pt layer and the Si substrate, and their energy distribution is obtained by analyzing the amount of the energy shift of the substrate Si 2p3/2 peak measured as a function of the bias voltage. All the interface states observed using this new technique have discrete energy levels, showing that they are due to defect states. For the oxide layer formed in H2SO4+H2O2, the interface states have three density maxima at ∼0.3, ∼0.5, and ∼0.7 eV above the valence-band maximum (VBM). For the oxide layer produced in HNO3, two density maxima appear at ∼0.3 and ∼0.7 eV above the VBM. The energy distribution for the oxide layer grown in HCl+H2O2 has one peak at ∼0.5 eV. The 0.5 eV interface state is attributed to the isolated Si dangling bond defect. The 0.3 and 0.7 eV interface states are, respectively, due to Si dangling bonds with which Si and oxygen atoms in the silicon oxide layer interact weakly. The oxide layer formed in HCl+H2O2 has the highest-density interface states. The oxide layer produced in HNO3 has the lowest-density interface states and, thus, the final cleaning using HNO3 is recommended for the device fabrication. © 1996 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 78 (1995), S. 3931-3939 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The mechanism of carrier transport through a thin silicon-oxide layer for 〈spray-deposited indium-tin-oxide (ITO)/silicon-oxide/Si〉 solar cells has been studied by measurements of the dark current density as a function of the thickness of the silicon-oxide layer, together with the observation of transmission electron micrographs. Cross-sectional transmission electron micrography shows that a uniform silicon-oxide layer with the thickness of ∼2 nm is present between ITO and Si when the ITO film is deposited on a flat Si(100) surface at 450 °C. The dark current density under a depletion condition strongly depends on the thickness of the silicon-oxide layer. It is concluded from these results that quantum mechanical tunneling is the dominant mechanism for the charge carrier transport through the silicon-oxide layer. On the other hand, when the ITO film is deposited on a mat-textured Si surface at the same temperature, a nonuniform silicon-oxide layer is formed, with ITO penetrating into the silicon-oxide layer in the top and valley regions of the pyramidal structure. By raising the deposition temperature of the ITO film on the flat Si(100) surface to 500 °C, the silicon-oxide layer becomes also nonuniform. For these diodes with the nonuniform silicon-oxide layer, the carrier transfer probability is less dependent on the thickness of the silicon-oxide layer, leading to the conclusion that minute channels of ITO are present in the silicon-oxide layer and charge carriers transfer through the channels. The photovoltage is decreased by the presence of the minute channels, with its magnitude depending on the density of the channels. The conversion efficiency of the 〈ITO/silicon-oxide/n-Si(100)〉 solar cells is unchanged upon illumination for 1000 h. The good cell stability is attributed to the well-crystallized ITO film which effectively suppresses diffusion of oxygen from the air and to low reactivity of ITO with Si at room temperature. © 1995 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 77 (1995), S. 1301-1307 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Zinc oxide (ZnO)/n-Si junction solar cells were fabricated by a spray-pyrolysis method and high short-circuit photocurrent densities and relatively high photovoltages were obtained by adjusting the conditions of the deposition and the post-deposition heat treatment. Consequently, relatively high conversion efficiencies ranging between 6.9% and 8.5% were obtained. The efficiency of the solar cells with ZnO/n-Si structure decreases slowly with time when they are kept in air in the dark because of the increase in the thickness of the silicon oxide layer between Si and the ZnO film. This degradation can be avoided by forming an indium-tin-oxide (ITO) overlayer on the ZnO film, indicating that the silicon oxide layer grows through the reaction of Si with oxygen diffusing from the atmosphere, not with ZnO. The efficiency of the ZnO/n-Si junction solar cells decreases rapidly with the illumination time. Capacitance-voltage measurements show that this degradation is caused by a decrease in the work function of the ZnO film. The decrease in the work function is caused by desorption of O−2 from the grain boundaries of the ZnO films. When incident light contains no ultraviolet (UV) component, this degradation does not occur, indicating that the desorption is caused by the acceptance of holes generated by UV light. © 1995 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 4
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 81 (1997), S. 7006-7011 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Si oxidation promoted by a platinum (Pt) overlayer has been investigated using x-ray photoelectron spectroscopy and synchrotron radiation ultraviolet photoelectron spectroscopy. Heat treatments of the specimens with 〈∼5-nm-Pt/0.5–1-nm-chemical oxide/Si(100)〉 structure at 300–400 °C increase the oxide thickness to 4–5 nm. The amounts of the suboxide species, a(Si+), a(Si2+), and a(Si3+), in the chemical oxide layers formed in hydrochloric acid (HCl) plus hydrogen peroxide (H2O2) are in the order of a(Si+)〉a(Si2+)〉a(Si3+), while those for the oxide layers formed in nitric acid (HNO3) have an order of a(Si3+)〉a(Si2+)(approximate)a(Si+). The amounts of the suboxide species in the former oxide layers are much higher than those in the latter oxide layers. These results indicate that the HNO3 oxide layers are more highly oxidized, probably resulting in a higher atomic density and a lower defect density. Although the initial chemical oxide layers formed in HCl+H2O2 are thinner than those grown in HNO3, the former oxide layers become thicker than the latter after the Pt deposition and the heat treatments below 200 °C. This result is attributed to the lower atomic density and the higher defect density of the chemical oxide layers produced in HCl+H2O2, which enhance the diffusion of oxidizing species. It is suggested that the variation in the atomic density of the chemical oxide layers cause the different energy distribution of interface states in the Si band gap. © 1997 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 5
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 80 (1996), S. 1578-1582 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Measurements of x-ray photoelectron spectra are performed for ∼3-nm-thick Pt/∼3.6-nm-thick silicon oxide/n-Si(100) devices under biases between the Pt layer and the Si substrate. It is observed that the oxide Si 2p peak as well as the substrate peaks is shifted upon applying biases. These shifts are caused by a bias-induced change of the potential drop across the oxide layer due to the change in the amount of the interface state charge. The amount of the shift of the oxide Si 2p peak is well correlated to that of the substrate Si 2p3/2 peak. The energy distribution of the interface states is obtained by analyzing the amount of the shift of the substrate Si 2p3/2 peak measured as a function of the bias voltage. The interface state spectrum has one peak near the midgap, and the peak is attributed to isolated Si dangling bond states. © 1996 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 6
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 78 (1995), S. 6554-6561 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The mechanism of the formation of hydrogen-induced interface states at the Si/silicon oxide interface for metal–oxide–semiconductor tunneling diodes has been investigated by conductance measurements as well as current–voltage measurements. It is found that the diffusing species through the silicon oxide layer to form the interface states is protons, not hydrogen atoms. A conductance peak due to the interface states is present at the reverse bias voltage of −0.3 V. The density of the interface states increases nearly exponentially with time t after the introduction of hydrogen in the air. The time constant of the interface state density versus time curve increases with the hydrogen concentration, in contrast to usual chemical reactions in which the reaction time constant decreases with an increase in the concentration of reactants. This unusual result can be explained by the mechanism that the interfacial reaction sites located adjacent to the interface states react with protons more easily than the other sites, resulting in the formation of two-dimensional aggregations of the interface states. The bias voltage at the constant forward current density is shifted slowly only when a forward bias is applied throughout the measurements, while such a shift does not occur when a reverse bias voltage is applied during the intervals of the current–voltage measurements. The density of the interface states is high in the presence of hydrogen in the air, but the density decreases markedly after evacuating hydrogen-containing air, indicating that the interface states equilibrate with hydrogen in the air. © 1995 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 7
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 73 (1993), S. 4344-4350 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Indium tin oxide (ITO) films deposited on single-crystal Si wafers by the electron-beam-(EB) evaporation method have been investigated by x-ray photoelectron spectroscopy (XPS) together with work-function and resistivity measurements. The XPS studies suggest that all the ITO films consist of crystalline and amorphous phases. The amount of the crystalline phase with respect to the amorphous phase for the ITO films, deposited with the incident angle of the ITO vapor to the Si substrate θi at 0°, is smaller than that for the ITO films deposited at θi=45°. The amount of the crystalline phase hardly depends on the conditions of postdeposition heat treatments, while that of the amorphous phase increases by raising the temperature of the heat treatments. Metal indium present in the films deposited at θi=0° is transformed into amorphous indium oxide by heating at 450 °C in air. Metal tin is also present near the ITO/Si interface for the ITO films deposited at θi=0°. The work function of the ITO films deposited at θi=0° is lower by 0.8 eV in maximum than that for the films deposited at θi=45°. It is concluded that the work function of the ITO films increases not only with a decrease in the amount of metal indium and metal tin in the films but also with an increase in the amount of the crystalline ITO phase with respect to that of the amorphous phase.
    Type of Medium: Electronic Resource
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  • 8
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Indium tin oxide (ITO)/silicon oxide/silicon (Si) junction solar cells were produced by depositing ITO on a thin silicon oxide-covered single-crystal Si substrate using the electron-beam evaporation method. The current-voltage (I-V) characteristics strongly depended on the incident angle (θi) of the evaporated ITO vapor to the Si substrate during the ITO deposition, as well as the post-deposition heating temperature (Th) and the kind of the ambient gases during post-deposition heat treatment. The ITO films deposited at θi=0° and treated at Th=380 °C in air formed a high-energy barrier with p-Si, and formed ohmic contact with n-Si. X-ray diffraction analysis showed that the ITO films deposited at θi=0° contained metal indium. The amount of the metal indium decreased either by reducing the deposition rate of the ITO film or by raising the substrate temperature during the ITO deposition. The ITO films deposited at θi=45° and treated at Th=350∼450 °C in hydrogen, on the other hand, formed a high-energy barrier with n Si. In this case, no metal indium was observed in the ITO films. It is concluded that the formation of the metal indium in the ITO films changes their work functions, and thus its presence strongly affects the I-V characteristics of the ITO/silicon oxide/Si solar cells. Darkening observed for the ITO films deposited at θi=0° is also attributed to the presence of the metal indium.
    Type of Medium: Electronic Resource
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  • 9
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 74 (1993), S. 4756-4761 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Indium-tin-oxide (ITO)/silicon oxide/mat-textured n-Si junction solar cells having an energy conversion efficiency of 15% are fabricated by the spray pyrolysis method. Their characteristics and the junction properties are compared with the same junction solar cells having a flat Si surface. In cases where the ITO film is deposited on a hydrofluoric acid-etched mat-textured Si surface, the open circuit photovoltage (Voc) is low (405 mV). Scanning electron microscopy observation shows that high-density dislocations are formed near the Si surface, and the temperature dependence of the current-voltage characteristics suggests that the trap-assisted multistep tunneling through the Si depletion layer is a dominant current flow mechanism. In cases where the ITO film is deposited on a thermal silicon oxide-covered mat-textured Si surface, the formation of the dislocations is suppressed, and consequently Voc is increased to 485 mV. For this solar cell, a surface recombination current takes the dominant part of the dark current in the bias region below ∼250 mV, and a thermionic-assisted tunneling current is dominant in the higher bias region. For a cell where the thermal silicon oxide-covered mat-textured Si surface is annealed at 800 °C under nitrogen before the deposition of the ITO film, Voc is further increased to 540 mV, and the energy conversion efficiency of 15% is achieved. In this case, the thermionic-assisted tunneling current density is decreased by an increase in the barrier height due probably to a reduction in the density of the positive charge in the silicon oxide layer. The surface recombination current density is also reduced by the removal of interface states, leading to the improvement of the fill factor.
    Type of Medium: Electronic Resource
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  • 10
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 69 (1991), S. 1736-1743 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The carrier transport mechanism of the Si solar cells having n-Si/indium tin oxide (ITO) junctions has been studied by use of the current-voltage and capacitance-voltage measurements and x-ray photoelectron spectroscopy. An 11-A(ring)-thick nonstoichiometric Si oxide layer is formed when ITO is deposited by spray pyrolysis on a Si electrode etched with hydrofluoric acid. In this case, the tunneling probability of majority carriers through the oxide layer is high, and the thermionic emission current over the energy barrier in Si takes a dominant part of the dark current. On the other hand, for a Si electrode where a Si oxide layer is intentionally interposed between ITO and Si, the thermionic emission current is suppressed, and trap-assisted multistep tunneling through the depletion layer becomes dominant. By making a mat-structure treatment on the Si surface, a solar energy conversion efficiency of 13% and the photocurrent density of 42.5 mA cm−2 were attained under AM 1 100 mW cm−2 illumination.
    Type of Medium: Electronic Resource
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