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The emissivity of etched Cu-Nb in situ alloys (1987)

Downing, H. L. ; Verhoeven, J. D. ; Gibson, E. D.

[S.l.] : American Institute of Physics (AIP)

Journal of Applied Physics 61 (1987), S. 2621-2625

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ISSN: 1089-7550

Quelle: AIP Digital Archive

Thema: Physik

Notizen: Cu-Nb in-situ alloys possess high strenght plus thermal conductivity properties and are therefore of interest in heat transfer applications. Etching the surfaces of these alloys to preferentially remove Cu places the Nb filaments in relief. Experiments demonstrate that the emissivity of such etched surfaces can be increased from around 0.08 to values greater thana 0.9.

Materialart: Digitale Medien

URL: http://dx.doi.org/10.1063/1.337891

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Digitale Medien

The resistivity and microstructure of heavily drawn Cu-Nb alloys (1989)

Verhoeven, J. D. ; Downing, H. L. ; Chumbley, L. S. ; [weitere]

[S.l.] : American Institute of Physics (AIP)

Journal of Applied Physics 65 (1989), S. 1293-1301

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ISSN: 1089-7550

Quelle: AIP Digital Archive

Thema: Physik

Notizen: A combined resistivity transmission electron microscopy (TEM) study has been done on heavily drawn Cu-20 vol % Nb alloys (so-called in situ alloys). The results show that electron scattering at Cu-Nb interfaces makes the major contribution to resistivity in heavily drawn wire. The dislocation contribution is small and constant at deformation strains greater than around 4, apparently as a result of dynamic recovery/recrystallization of the Cu matrix which occurs during room-temperature drawing. Results of this study and other recent TEM dislocation studies indicate that the dislocation density in heavily drawn Cu-20 vol % Nb material does not exceed 1011 cm−2. It is demonstrated here that the 1013- cm−2 dislocation density predicted by the resistivity study of Karasek and Bevk [J. Appl. Phys. 52, 1370 (1981)] is high because the interface scattering contribution is more strongly reduced by coarsening than they assumed. It is shown that resistivity measurements provide a means of evaluating an average Cu channel diameter in the aligned composite alloys formed at large deformation strains.

Materialart: Digitale Medien

URL: http://dx.doi.org/10.1063/1.343024

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Digitale Medien

Effect of temperature on the strength and conductivity of a deformation processed Cu-20%Fe composite (1992)

Spitzig, W. A. ; Chumbley, L. S. ; Verhoeven, J. D. ; [weitere]

Springer

Journal of materials science 27 (1992), S. 2005-2011

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ISSN: 1573-4803

Quelle: Springer Online Journal Archives 1860-2000

Thema: Maschinenbau

Notizen: Abstract The high temperature (22–600 °C) properties were evaluated for a Cu-20%Fe composite deformation processed from a powder metallurgy compact. The ultimate tensile strengths decreased with increasing temperature but were appreciably better than those of similarly processed Cu at temperatures up to 450 °C. At 600 °C, the strength of Cu-20%Fe was only slightly better than that of Cu as a result of the pronounced coarsening of the Fe filaments. However, at temperatures of 300 and 450 °C, the strength of Cu-20%Fe is about seven and six times greater, respectively, than that of Cu, as compared to about a two fold advantage at room temperature. Therefore, Cu-20%Fe composites made by deformation processing of powder metallurgy compacts have mechanical properties much superior to those of similarly processed Cu at room temperature and at temperatures up to 450 °C. The pronounced decrease in electrical conductivity of deformation processed Cu-20%Fe as compared to Cu is attributed to the appreciable dissolution of Fe into the Cu matrix which occurred during the fabrication of the starting compacts where temperatures up to 675 °C were used. While the powder metallurgy compacts used for the starting material for deformation processing in this study did not lead to a high conductivity composite, the powder metallurgy approach should still be a viable one if processing temperatures can be reduced further to prevent the dissolution of Fe into the Cu matrix.

Materialart: Digitale Medien

URL: http://dx.doi.org/10.1007/BF01117911

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