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  • 1
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 64 (1988), S. 761-765 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: An electron channeling study has been done on large grained YBa2Cu3Ox samples. Selected area channeling patterns (SACP) were used to examine several dozen grains on electropolished surfaces and it was demonstrated that (a) the twin planes observed in polarized optical light microscopy lie parallel to {110} crystal planes, and (b) the long flat sides of high aspect ratio grains are formed by basal planes, and the shorter sides are formed by either (010), (100), or {110} planes. A majority of the large grains examined were found to contain subgrains, misaligned by 0.5°–1° and ranging in size from less than 3 to 20 μm. The origin of the subgrains is not understood.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 66 (1989), S. 772-779 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Twinned single crystals of the giant magnetostrictive intermetallic compound TbxDy1−xFey with a 〈112〉 axial alignment have been prepared by float-zone solidification with Y varying from 1.90 to 1.98 and X being 0.32 or 0.28. The chemical compositions of the crystals were carefully analyzed. A very sharp jump in the magnetostrictive strain λ sometimes occurs in these alloys as the applied field H is increased to values of around 280 Oe under a compressive stress of 6.9 MPa. This large jump in λ is shown to depend strongly on the values of X and Y, and possible reasons for this result are discussed. A magnetic heat treatment has been developed which involves cooling the samples through the Curie temperature under a field applied transverse to the crystal axis. It is shown that this treatment is very effective at increasing the magnetostrictive properties at low applied compressive stresses for certain values of X and Y.
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 65 (1989), S. 3712-3713 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The strength of the magnetostrictive material, Terfenol-D, Tb0.27Dy0.73Fe2.0, has been evaluated by measuring the modulus of rupture as a function of the Fe stoichiometry of the compound. It is shown that the strength improves markedly as the Fe concentration decreases from the stoichiometric value of 2.0 in the compound. The increased strength results from the increasing volume fraction of the rare-earth metal phase produced in the Terfenol-D matrix by the solidification process at lower Fe concentrations.
    Type of Medium: Electronic Resource
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  • 4
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 65 (1989), S. 1293-1301 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: A combined resistivity transmission electron microscopy (TEM) study has been done on heavily drawn Cu-20 vol % Nb alloys (so-called in situ alloys). The results show that electron scattering at Cu-Nb interfaces makes the major contribution to resistivity in heavily drawn wire. The dislocation contribution is small and constant at deformation strains greater than around 4, apparently as a result of dynamic recovery/recrystallization of the Cu matrix which occurs during room-temperature drawing. Results of this study and other recent TEM dislocation studies indicate that the dislocation density in heavily drawn Cu-20 vol % Nb material does not exceed 1011 cm−2. It is demonstrated here that the 1013- cm−2 dislocation density predicted by the resistivity study of Karasek and Bevk [J. Appl. Phys. 52, 1370 (1981)] is high because the interface scattering contribution is more strongly reduced by coarsening than they assumed. It is shown that resistivity measurements provide a means of evaluating an average Cu channel diameter in the aligned composite alloys formed at large deformation strains.
    Type of Medium: Electronic Resource
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  • 5
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 61 (1987), S. 2621-2625 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Cu-Nb in-situ alloys possess high strenght plus thermal conductivity properties and are therefore of interest in heat transfer applications. Etching the surfaces of these alloys to preferentially remove Cu places the Nb filaments in relief. Experiments demonstrate that the emissivity of such etched surfaces can be increased from around 0.08 to values greater thana 0.9.
    Type of Medium: Electronic Resource
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  • 6
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 59 (1986), S. 2105-2113 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The tin (Sn) diffusion step for producing Nb3Sn-Cu superconducting wire by the external Sn process was modeled in experiments where either pure Sn or a Cu-Sn alloy was plated on sheets of either pure Cu or a Cu-Sn bronze. Each stage of the three-stage solid-state diffusion process was evaluated and it was found that rows of voids are produced in stage I of the process. These voids coarsen in stages II and III and in the worst case they are observed to coalesce and cause complete spalling away of the Sn-rich diffusion layers. Methods for minimizing void formation and possible causes of the void formation are discussed.
    Type of Medium: Electronic Resource
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  • 7
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 59 (1986), S. 2096-2104 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Assuming volume diffusion is dominant, an analysis has been presented which allows one to analytically describe the three stages of the solid-state diffusion process for adding Sn in the external tin method for preparing Nb3Sn/Cu superconducting material. It is shown that one obtains a maximum intermetallic compound layer thickness in stage III which then decreases to zero thickness. Important practical questions in utilizing this process are the times required to complete stages I and II of the process, and this analysis predicts that the times required to complete stage I are on the order of days while stage II is completed in a matter of hours. The roles of grain-boundary diffusion and sample geometry are discussed and it is concluded that the analysis may be regarded as an upper bound for determining the times required to complete stages I and II of the solid state Sn diffusion process.
    Type of Medium: Electronic Resource
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  • 8
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 52 (1988), S. 1190-1192 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Polycrystalline arrays of YBa2Cu3Ox grains display optical twin patterns and flat sides. The long sides of elongated grains are basal planes, {001}, and the twin planes are {110} planes. A technique is presented here for evaluating the crystallographic orientation of an elongated grain from the angles formed on the polish surface by its (110) and (1¯10) twin traces with the long grain boundary. Comparison with selected area channeling patterns from individual grains confirms the validity of the technique. The technique may be of some use in evaluating the texture of polycrystalline samples.
    Type of Medium: Electronic Resource
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  • 9
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 52 (1988), S. 745-747 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: A scanning Auger microscopy study has been carried out on fractured surfaces of YBa2Cu3Ox samples prepared by standard sintering procedures from powders. It is concluded that in the large-grained samples examined, a majority of the grain boundaries are sufficiently "open'' that standard metallographic preparation causes them to become contaminated with C. This suggests that an actual loss of contact at the grain boundaries during sample preparation is responsible for the low Jc values observed in bulk-sized large-grained YBa2Cu3Ox.
    Type of Medium: Electronic Resource
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  • 10
    Electronic Resource
    Electronic Resource
    Springer
    Journal of materials science 7 (1988), S. 897-899 
    ISSN: 1573-4811
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Type of Medium: Electronic Resource
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