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  • 1995-1999  (4)
  • 1965-1969
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  • 1
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 80 (1996), S. 6670-6676 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Advancement of a fine slit along a planar grain boundary in an electric field E0, applied parallel to the slit, is investigated by considering electromigration along both the grain boundary and the slit surface. Electrically induced flux in the grain boundary Igb (+ toward the slit tip) and both electrically and curvature-induced fluxes on the slit surfaces are considered assuming 2Is〉Igb, where Is is the flux (+ away from the slit tip) on each of the parallel slit surfaces far removed from the tip. Steady-state solutions of the transport equations are classified according to the value of a parameter β=tan−1 (2Is/Igb) which, under reasonable assumptions, depends on material parameters only. For 5π/4≥β≥β2, unique steady-state solutions exist; for β2〉β〉β1, multiple steady-state solutions occur; below β1≥π/4, no steady-state solution is possible. Since β1〈π/2, Igb〉0 (flux exiting the grain boundary into the slit) for all cases in which no steady-state solution is possible. In the case of multiple solutions, those corresponding to smallest width (and hence largest velocity) are determined. For all steady-state solutions, slit width and tip velocity scale as E−1/20 and E3/20, respectively. Results also apply to the propagation of a slit within a grain or along a passivation layer. Generally, tip velocities can approach 1 nm/s (3.6 μm/h), thereby representing a likely failure mechanism in fine-line (near bamboo structure) interconnects. © 1996 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 78 (1995), S. 3833-3838 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Groove profiles are computed under isotropic conditions for the intersection of a periodic array of grain boundaries with an external surface, assuming that grain boundary flux I is directed to (I(approximately-greater-than)0) or away from (I〈0) the surface. When I=0, the surface assumes an equilibrium (time-independent) profile. For I≠0, in a range bounded by upper and lower limits that depend on geometry and material parameters, a global steady-state develops in which the entire surface advances (I(approximately-greater-than)0) or recedes (I〈0) from its original position at constant velocity. Beyond these limits, the surface near the groove roots becomes diffusively detached from the remaining surface. A rapidly growing ridge (I(approximately-greater-than)0) or slit (I〈0) then develops along each grain boundary, whose tip ultimately translates at constant velocity in a local steady state, leaving the remaining surface behind. These velocity regimes govern the ultimate stability of polycrystalline materials subjected to large electric (electromigration) or stress (creep) fields, especially in thin films where grain size approximates film thickness. © 1995 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 70 (1997), S. 194-196 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Previous treatments of void shape evolution during electromigration have been restricted to nonsingular void surfaces. We consider the lateral spreading of a void when its leading surface is a singular facet. The facet may nucleate at the leading surface of a void migrating within one grain or may develop when a singular surface is exposed by impingement of the void at a (transverse) grain boundary. Advance of the facet requires a source of steps that we assume to be absent; void spreading results. A stationary void shape is possible when a dimensionless parameter is less than a critical value (estimated), whereas above this value the void spreads indefinitely. © 1997 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 4
    ISSN: 1398-9995
    Source: Blackwell Publishing Journal Backfiles 1879-2005
    Topics: Medicine
    Notes: For screening atopy risk in 6401 (84%) of all infants born during the year 1990 in six obstetric departments of five German cities, cord-blood IgE values were determined with CAP-RAST-FEIA. After cases with elevated IgA values had been excluded, 25 % of the values were above the detection limit of 0.35 kU/1, and 8.5% were above 0.9 kU/1. Boys had significantly higher values than girls (P≤0.001). The distribution of values was significantly different for different nationalities of mothers (P≤0.001). The percentage of elevated values (≥0.9kU/l) increased significantly with the number of close family members with atopic history (P≤0.001). Regarding the atopic history of the father, siblings, and mother separately, only the mother's history had a significant association with the cord-blood IgE class (P≤0.001). The IgE values of 81 twin pairs correlated significantly with a coefficient of r = 0.4909 (P≤0.001). The smoking history of the parents during pregnancy showed an association with cord-blood IgE values (P≤0.02). No significant association could be shown between cord-blood IgE distribution and other variables, i.e., gestational age, birth size, birth modus, Apgar score, cord-blood pH value, neonatal problems, parity, age of the mother, medication during pregnancy, educational level of mother or father, time of year, or obstetric department. It is hypothesized that, in addition to some postpartum contamination or placental transfer of maternal IgE, cord-blood IgE values are also determined by the fetal immunologic reaction to intrauterine exposure to allergens and trigger factors, and by genetic influences.
    Type of Medium: Electronic Resource
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