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  • 1
    Electronic Resource
    Electronic Resource
    Amsterdam : Elsevier
    Phytochemistry 14 (1975), S. 1295-1301 
    ISSN: 0031-9422
    Keywords: 22,26-epiminocholestane alkaloid ; Liliaceae ; Veratrum alkaloid ; Veratrum grandiflorum ; biosynthesis ; hakurirodine ; rubijervine
    Source: Elsevier Journal Backfiles on ScienceDirect 1907 - 2002
    Topics: Biology , Chemistry and Pharmacology
    Type of Medium: Electronic Resource
    Library Location Call Number Volume/Issue/Year Availability
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  • 2
    Electronic Resource
    Electronic Resource
    Amsterdam : Elsevier
    Phytochemistry 14 (1975), S. 1295-1301 
    ISSN: 0031-9422
    Keywords: 22,26-epiminocholestane alkaloid ; Liliaceae ; Veratrum alkaloid ; Veratrum grandiflorum ; biosynthesis ; hakurirodine ; rubijervine.
    Source: Elsevier Journal Backfiles on ScienceDirect 1907 - 2002
    Topics: Biology , Chemistry and Pharmacology
    Type of Medium: Electronic Resource
    Library Location Call Number Volume/Issue/Year Availability
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  • 3
    Electronic Resource
    Electronic Resource
    New York, NY [u.a.] : Wiley-Blackwell
    Advanced Materials for Optics and Electronics 5 (1995), S. 191-198 
    ISSN: 1057-9257
    Keywords: TiN ; adhesion ; PVD ; electron shower ; arc ion plating ; sputtering ; wear ; surface ; morphology ; Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Physics
    Notes: It has been found that TiN films with high wear resistance and high adhesion can be prepared by electron shower deposition and arc ion plating on glass and austenitic stainless steel (SUS 316) substrates. The high wear resistance is principally explained by the grain size and surface morphology. Fine {100}-faceted crystals (10-150 nm) grew on the surface. The typical morphology of the crystals was triangular pyramidal. The crystallite size was changed by the bias voltage. Faceted crystals produced by arc ion plating were rounded and smoothed by a change in bias, but were unaltered in samples prepared by the electron shower process. The fine faceted surfaces had higher wear resistance than the granularly rounded ones. When TiO2 was formed at the interface of the glass substrate, the adhesion was lowered. The high-adhesion film prepared by electron shower deposition contained a small amount of TiO2 at the interface.
    Additional Material: 8 Ill.
    Type of Medium: Electronic Resource
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  • 4
    Electronic Resource
    Electronic Resource
    Weinheim : Wiley-Blackwell
    Zeitschrift für anorganische Chemie 391 (1972), S. 86-96 
    ISSN: 0044-2313
    Keywords: Chemistry ; Inorganic Chemistry
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology
    Description / Table of Contents: Der Einfluß von Kupfer(II) auf die Kristallisation von α-FeOOHα-FeOOH wurde in mehreren Proben ohne und mit Zusatz von Cu(II)-Ionen (bis zu 5 Atom-%) unter bestimmten Bedingungen dargestellt und röntgeno-graphisch, durch BET, DTA und elektronenmikroskopisch untersucht. Durch Zusatz von 2,5 Atom-% wird die Kristallisation des α-FeOOH vollständig verhindert. Geringe Cu-Zusätze verzögern die Kristallisation. Das Wachsen der Partikel- und Kristallitgrößen von reinem und Cu-dotiertem α-FeOOH unterscheidet sich. Nach der Theorie des Autors wird der Einfluß der Cu2+-Ionen auf die Verzerrung des Koordinationsgitters diskutiert. Es besteht vermutlich ein Zusammenhang zür korrosionshemmenden Wirkung von Kupferzusätzen im Stahl.
    Notes: Various α-FeOOH samples have been prepared with or without addition of Cu(II) (0-5% Cu/Fe) and examined by X-ray diffraction, BET surface area determination, electron-microscopical observation and DTA. Doping with Cu in suitable amounts impedes completely the formation of α-FeOOH. The mechanism of growth, based on the changes of particle size and crystallite dimension, appears to be different between pure and Cu-doped α-FeOOH. The reason of the remarkable effect of Cu on the crystallization process of α-FeOOH is discussed. The effect of Cu is likely relevant to the role of Cu added to anticorrosive steel used in atmospheric environment.
    Additional Material: 12 Ill.
    Type of Medium: Electronic Resource
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