ISSN:
1551-2916
Source:
Blackwell Publishing Journal Backfiles 1879-2005
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
,
Physics
Notes:
An experimental self-reinforced hot-pressed silicon nitride was used to examine the effects of microstructure on high-temperature deformation mechanisms during compression testing. At 1575–1625°C, the as-received material exhibited a stress exponent of 1 and appeared to deform by steady-state grain-boundary sliding accommodated by solution-reprecipitation of silicon nitride through the grain-boundary phase. The activation energy was 610 ± 110 kJ/mol. At 1450–1525°C for the as-received material, and at 1525–1600°C for the larger-grained heat-treated samples, the stress exponent was 〉1. Damage, primarily in the form of pockets of intergranular material at two-grain junctions, was observed in these samples.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1111/j.1151-2916.2000.tb01683.x
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