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Effect of thiourea on the electrodeposition of copper powder (1972)

Gurevich, L. I. ; Pomosov, A. V.

Springer

Powder metallurgy and metal ceramics 11 (1972), S. 773-776

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ISSN: 1573-9066

Source: Springer Online Journal Archives 1860-2000

Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics

Notes: Conclusions 1. It is shown that TU may be utilized for regulating the structure and particle size of copper powder electrodeposits. 2. Depending on its concentration, TU may have a depolarizing or a passivating action. At gxu 4 · 10−4 mole/liter, a limiting adsorption current is generated.

Type of Medium: Electronic Resource

URL: http://dx.doi.org/10.1007/BF00844698

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