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  • 1
    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 312 (June 2006), p. 3-8 
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Toughening of thermosets by creation of residual compressive stresses around microspheres is studied. Expandable hollow micro-spheres containing liquefied gas were used for the creation of residual compressive stresses. Microscopic compressive residual stresses around the micro-spheres in the vicinity of the crack tip were graphically analysed and related to macroscopic mechanical behaviour for mode I fracture. It was confirmed that toughening was due to residual compressive stresses rather post-cure effect
    Type of Medium: Electronic Resource
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