Electronic Resource
s.l. ; Stafa-Zurich, Switzerland
Solid state phenomena
Vol. 124-126 (June 2007), p. 45-48
ISSN:
1662-9779
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Physics
Notes:
We investigated the phase transformation and thermal stability of Ni silicides formed inNi/Si and Ni0.95Ta0.05/Si systems. The sheet resistance values of the silicide in the Ni0.95Ta0.05/Sisystem were lower than those in Ni/Si system at any temperature. The enhancement of thermalstability is closely related to the phase transformation occurred during post heat-treatment. Microstructureof the phases formed by reaction was investigated by analytical electron microscopy (AEM)and the phase identification of Ni silicide was carried out using convergent beam electron diffraction(CBED) technique. It was found that a Ta rich layer formed on the top of the Ni silicide layer andsmall amount of Ta dissolved into the silicide layer. By addition of Ta atoms, phase transformationfrom NiSi to NiSi2 is retarded and thermal stability of Ni silicide is improved
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/02/23/transtech_doi~10.4028%252Fwww.scientific.net%252FSSP.124-126.45.pdf
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