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  • Digitale Medien  (6)
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  • Digitale Medien  (6)
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  • 1
    Digitale Medien
    Digitale Medien
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 88 (2000), S. 3202-3207 
    ISSN: 1089-7550
    Quelle: AIP Digital Archive
    Thema: Physik
    Notizen: It is shown experimentally that electrostatic coupling between the ferroelectric "capacitor" and the anode-cathode gap controls the emission process in ferroelectric cathode. Three main quantities were demonstrated to be directly correlated to the energy stored in the ferroelectric: the energy in the diode, the diode impedance, and the delay of the peak (anode) current relative to the triggering time of the ferroelectric. The polarity of the triggering voltage does not seem to have a significant impact on the performance of the diode. © 2000 American Institute of Physics.
    Materialart: Digitale Medien
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  • 2
    ISSN: 1077-3118
    Quelle: AIP Digital Archive
    Thema: Physik
    Notizen: Very low resistance nonalloyed ohmic contacts of Pt/Ti to 1.5×1019 cm−3 Zn-doped In0.53Ga0.47As have been formed by rapid thermal processing. These contacts were ohmic as deposited with a specific contact resistance value of 3.0×10−4 Ω cm2. Cross-sectional transmission electron microscopy showed a very limited interfacial reacted layer (20 nm thick) between the Ti and the InGaAs as a result of heating at 450 °C for 30 s. The interfacial layer contained mostly InAs and a small portion of other five binary phases. Heating at 500 °C or higher temperatures resulted in an extensive interaction and degradation of the contact. The contact formed at 450 °C, 30 s exhibited tensile stress of 5.6×109 dyne cm−2 at the Ti/Pt bilayer, but the metal adhesion remained strong. Rapid thermal processing at 450 °C for 30 s decreased the specific contact resistance to a minimum with an extremely low value of 3.4×10−8 Ω cm2 (0.08 Ω mm), which is very close to the theoretical prediction.
    Materialart: Digitale Medien
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  • 3
    Digitale Medien
    Digitale Medien
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 62 (1987), S. 1768-1777 
    ISSN: 1089-7550
    Quelle: AIP Digital Archive
    Thema: Physik
    Notizen: Interfacial reactions of a Ni60Ta40 alloy film deposited on (001) GaAs substrate were studied and compared to the reactions between GaAs and single or double layer metals: Ni, Ta, Ni/Ta, and Ta/Ni. The reaction of Ni films started at a temperature as low as 100 °C by formation of Ni2GaAs and, following annealing in vacuum at 600 °C, resulted in an epitaxial β'-NiGa. On the contrary, the Ta/GaAs reaction started only at 650 °C, yielding TaAs compound. The above difference in reaction temperatures was explained by differing reaction mechanism, namely dominant diffusion of Ni atoms in Ni/GaAs reaction versus dominant diffusion of Ga and As atoms in Ta/GaAs reaction. The as-deposited alloy film was found to be amorphous and its interaction with the substrate started only at 450 °C. The reaction resulted in a phase separation where Ni diffused toward the GaAs substrate forming Ni2GaAs at the early stages of reaction, and epitaxial β'-NiGa at a later stage. The depleted Ta reacted with the out-diffusing As, forming TaAs. The reacted bilayer metal structures exhibited similar phase separation, where Ni was accumulated adjacent to the substrate and Ta in the outer layer. The presence of Ni phases at the interface with GaAs was correlated with the variation of the Schottky barrier height.
    Materialart: Digitale Medien
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  • 4
    Digitale Medien
    Digitale Medien
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 60 (1986), S. 991-1001 
    ISSN: 1089-7550
    Quelle: AIP Digital Archive
    Thema: Physik
    Notizen: The metallurgical examination of solid-state reaction between nickel thin films and single-crystal GaAs substrates and the resultant electrical properties of the contacts are reported. Annealing at 100–300 °C in forming gas led to formation of a metastable hexagonal phase Ni2GaAs which was stabilized due to its epitaxial growth on (001) and (111) GaAs substrates, as follows: (101¯1)Ni2GaAs(parallel)(001)GaAs and (0001)Ni2GaAs(parallel)(111)GaAs. Nickel atoms were found to be the dominant diffusing species during the ternary phase growth. Ni2GaAs is stable on (111)GaAs up to at least 600 °C, compared to 350 °C on (001)GaAs. The larger stability on (111) is explained by the better epitaxial match found in this case. Reaction on (001)GaAs in the temperature range of 350–550 °C resulted in decomposition of Ni2GaAs by NiAs precipitation. After annealing at 600 °C the reacted film was composed of two phases: NiGa and NiAs. The electrical properties of the contacts were correlated to the phase interfacing the substrate. The Ni2GaAs formed rectifying contact with a barrier height of 0.84 eV, whereas when NiGa and NiAs were at the interface an ohmic behavior was observed.
    Materialart: Digitale Medien
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  • 5
    Digitale Medien
    Digitale Medien
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 65 (1989), S. 4319-4323 
    ISSN: 1089-7550
    Quelle: AIP Digital Archive
    Thema: Physik
    Notizen: Nonalloyed ohmic contacts of Pt/Ti to 5×1018 cm−3 doped p-InGaAsP (λg =1.3 μm) have been fabricated by rapid thermal processing of sputtered and e-gun-deposited metallizations. While the former as-deposited had a rectifying characteristic, the latter showed ohmic behavior prior to any heat treatment, with a specific contact resistance of 4×10−3 Ω cm2. Rapid thermal processing at temperatures higher than 400 °C caused the formation of ohmic contacts for the sputtered metals also, but with the evaporated metals producing slightly lower contact resistance. The lowest specific contact resistance values of 3.6–5.5×10−4 Ω cm2 for evaporated and sputtered metallizations, respectively, were achieved in both cases as a result of heating at 450 °C for 30 s. These heating conditions produced only a limited reaction at the Ti/InGaAsP interface, which was sharper for the e-gun-deposited contact, but had a significant effect on the stresses in the Ti/Pt bilayer. In both the sputtered and electron gun evaporated samples, the stresses were inverted from tensile as-deposited to compressive with values of 2.4×109 and 1.0×109 dyn cm−2, respectively, as a result of the heat treatment.
    Materialart: Digitale Medien
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  • 6
    Digitale Medien
    Digitale Medien
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 67 (1990), S. 3136-3140 
    ISSN: 1089-7550
    Quelle: AIP Digital Archive
    Thema: Physik
    Notizen: The ohmic contact characteristics of nickel antimonide in n-type GaAs semiconductor circuits are evaluated. Deposition techniques, structural, and electrical properties were studied. The structural analysis revealed a well-defined, sharp interface of a polycrystalline nickel antimonide phase with various solid-phase interactions at higher annealing temperatures. The sheet resistance of 1000-A(ring)-thick films decreased to 7–10 Ω/(D'Alembertian) after annealing at 400 °C. The ohmic contact formation was demonstrated using transmission line measurements. Subtractive etching of the contacts was accomplished by a wet etchant system which was found not to attack the GaAs substrate.
    Materialart: Digitale Medien
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