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  • 1990-1994  (8)
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Year
  • 1
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 74 (1993), S. 2919-2924 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The field-effect conductance activation energy Ea as a function of the gate voltage Vg is investigated for polycrystalline silicon thin-film transistors. An analytical expression for Ea is obtained for various models of the bulk and interface states. Using a computer minimization program to fit the experimental Ea vs Vg data with the theory, the energy distribution of the bulk states and the interface states are separated for nonhydrogenated and hydrogenated polycrystalline silicon thin-film transistors. In both cases, the bulk states have exponential band tails and a wide peak near the midgap and the interface states have an exponential distribution from the band edge.
    Type of Medium: Electronic Resource
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  • 2
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The morphology of polycrystalline films grown by low-pressure chemical-vapor deposition (LPCVD) is investigated by transmission electron microscopy (TEM) as a function of the film thickness, the deposition pressure, and the level of contamination. An orientation filtering mechanism, due to the growth-velocity competition in the early stage of growth, is responsible for the preferred orientation of the films. The size of the crystallites, the surface roughness, and the type of the structural defects are investigated by combined cross-sectional and plane-view TEM analysis. In polycrystalline silicon thin-film transistors (TFTs), the influence of surface roughness scattering on the mobility is investigated by measuring the effective electron mobility under high effective normal field at 295 and 77 K. Although the surface curvature is increased when the deposition pressure is decreased, the surface roughness scattering is constant in the deposition pressure range from 40 to 0.5 mTorr. By decreasing the deposition pressure from 40 to 10 mTorr, although the grain size increases, the TFT performance degrades due to the following factors: (a) the increase of the grain-boundary trap density which is related to the change of the mode of growth at 10 mTorr; and (b) the increase of impurity contamination in the environment of the LPCVD system with constant silane flow rate at all pressures. At a deposition pressure of 0.5 mTorr the TFT performance is improved indicating that the grain size is the prevailing key factor.
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 75 (1994), S. 3944-3952 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The structure and the morphology of crystallized amorphous silicon (α-Si) films which were deposited on glass and annealed in a conventional furnace or by rapid thermal process (RTP) are studied using transmission electron microscopy (TEM). The ellipsoidal shape of the grains is attributed to the fast solid-state crystallization along the two mutually perpendicular 〈112〉 and 〈110〉 crystallographic directions. The growth is solely based on the twin formation. The stability of the microtwins was studied by RTP and in situ TEM heating experiments. The effect of the film thickness on the preferred orientation of the grains is discussed. Very thin films exhibit (111) preferred orientation due to the strongly anisotropic rate of growth of the nuclei, which imposes an orientation filtering due to a growth velocity competition. The mode of growth of these films is compared with poly-Si films grown by low-pressure chemical-vapor deposition.
    Type of Medium: Electronic Resource
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  • 4
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 58 (1991), S. 1196-1198 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: A gold layer one order of magnitude thinner than the thickness of an amorphous silicon layer in intimate contact leads to the dissolution of the amorphous silicon into the liquid and the subsequent precipitation of crystalline Si as the liquid phase propagates into the amorphous phase at above eutectic temperatures. The crystalline Si precipitate has grain sizes of the order of 6 μm. The Si/Au liquid is very sensitive to constitutional supercooling and subsequent crystallization.
    Type of Medium: Electronic Resource
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  • 5
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 59 (1991), S. 172-174 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: We investigate the temperature dependence of the field-effect (FE) conductance of thin-film transistors on undoped polycrystalline silicon layers. The FE conductance is thermally activated at a fixed gate voltage. The conductance prefactor G0 increases exponentially with the FE activation energy Ea, in accordance with the Meyer–Neldel rule. Using these results, a model of exponentially decaying band tails explains the FE activation energy data. By fitting the FE activation energy data with the theory, we determine the trap distribution in polysilicon layers deposited at various pressures. The results indicate that the existence of band tails is not an intrinsic property of grain boundaries.
    Type of Medium: Electronic Resource
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  • 6
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The effect of deposition pressure, p, on the bulk and interface states of undoped low pressure chemical vapor deposited polycrystalline silicon thin-film transistors (polysilicon TFTs) is investigated by field-effect conductance activation energy measurements. The bulk states consist of deep states with a characteristic wide peak near the midgap and shallow exponential tails near the conduction band. The interface states show an exponential distribution which cause a faster change of the gap states density near the conduction-band edge. For p(approximately-greater-than)40 mTorr, the bulk and interface states are controlled by the grain size and the degree of disorder of the material. For p〈40 mTorr, the experimental results indicate that the films are contaminated by some impurities. The concentration of these impurities increases as p decreases and contributes mainly to the deep states generation.
    Type of Medium: Electronic Resource
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  • 7
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 63 (1993), S. 943-945 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The influence of the deposition pressure on the output characteristics of low pressure chemical vapor deposited polycrystalline silicon thin-film transistors is investigated. The polysilicon films are deposited at pressures 40, 10, and 0.5 mTorr. For channel lengths L greater than 10 μm, the device has the conventional output characteristics dominated by the grain boundaries. In short-channel devices (L〈10 μm), the experimental results show the presence of the "kink'' effect and a reduction of the threshold voltage at high drain biases. When the deposition pressure of the polysilicon layer decreases, despite the increase of the grain size, the kink effect becomes more pronounced due to the enhanced diffusion of dopants from the source and drain contacts along the grain boundaries. The enhanced dopant diffusion reduces the effective channel length resulting in higher channel electric fields and increased kink effect.
    Type of Medium: Electronic Resource
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  • 8
    ISSN: 1573-4803
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Abstract The deposition of undoped polycrystalline and amorphous silicon in an ultra-low pressure chemical vapour deposition system capable of achieving operating pressure of 0.03 Pa is discussed. It is found that at deposition temperatures in the region of 630 °C and reactor pressures of less than 1.3 Pa very large grained polycrystalline silicon films are obtained, and in this regime the growth rate is independent of the reactor pressure. Excellent uniformity is obtained and the process can be easily scaled up for large substrates and high volume batch production.
    Type of Medium: Electronic Resource
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