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  • 1
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: A nonselective epitaxial growth process for heterojunction bipolar transistors has been studied. The difference in growth rates for epitaxial and polycrystalline films could be used to monitor the thickness of the intrinsic and extrinsic base layers. The films were grown using chemical vapor deposition on Si 〈100〉 (epitaxy) and on silicon dioxide (polycrystalline) at reduced pressure (20–80 Torr) for undoped and in situ B or As doping. The depositions were carried out using silane diluted in hydrogen. Diborane and arsine were used as the source gas for dopants. For the undoped Si films, the deposition of polycrystalline films had a substantially higher rate than that of epitaxial ones. The growth rate of both epitaxial and polycrystalline depositions decreased with increasing total pressure. It was, however, linearly proportional to the silane partial pressure, pSiH4. The dependence of the growth rate on the hydrogen partial pressure was proportional to pH2−0.82 for epitaxial and to pH2−0.60 for polycrystalline depositions. The apparent activation energy was 2.1 and 1.6 eV for the epitaxial and polycrystalline depositions, respectively. A growth mechanism assuming the dissociative adsorption of silane on the Si surface, in combination with first-order hydrogen desorption kinetics, was employed to describe the experimental observations, including the differences in deposition rates, dependency on the hydrogen partial pressure as well as apparent activation energy. In situ B doping influenced neither the epitaxial nor polycrystalline depositions. In situ As doping, on the other hand, largely reduced the growth rate compared to the undoped films to such an extent that there was no appreciable difference in growth rate between the epitaxial and polycrystalline Si. The doping concentration in the epitaxial B and As films were of the order of 1018 cm−3, identical deposition conditions yielded a 5 and 20 times larger dopant incorporation in the B and As doped polycrystalline films, respectively. © 2000 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 86 (1999), S. 1970-1973 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The kinetics of hydrogen incorporation in amorphous silicon films were studied. The layers were deposited by low pressure chemical vapor deposition using disilane (Si2H6) and phosphine (PH3). The hydrogen concentration, determined by nuclear resonant reaction analysis, increased with decreasing substrate temperature. In accordance with the reported reduction of hydrogen adsorption in the presence of surface phosphorus, the addition of phosphine to disilane was observed to reduce the hydrogen film concentration. The results are discussed in terms of hydrogen adsorption/ desorption kinetics. The activation energy for hydrogen desorption in an undoped film was 1.8±0.2 eV, in good agreement with previously reported values obtained by surface analysis and desorption studies. When phosphine was added, an increase in activation energy was observed. © 1999 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 84 (1998), S. 1632-1642 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The effect of growth temperature (170–730 °C) on the properties of as-deposited 1000 Å thick Ta2O5 films has been studied. The layers were grown by evaporation of tantalum metal on silicon exposed to a flux of oxygen radicals. X-ray diffractometry (XRD) and high-resolution cross-sectional transmission electron microscopy (XTEM) revealed that films grown at or below 400 °C were deposited in an amorphous state. The layers grown at 520 °C were observed to be in a nanocrystalline state with no discernible grain boundaries whereas films grown at 650 °C demonstrated distinct grain boundary formation in the β-phase modification of Ta2O5 as evidenced by XTEM and XRD analyses. For the highest growth temperature of 730 °C, the XRD pattern indicated the presence of an impurity phase in the β-Ta2O5 film. XTEM revealed an abrupt 20–30 Å thick layer, presumably SiO2, between the Ta2O5 layer and the silicon substrate for all films. The measured relative static dielectric constant was found to increase with increasing growth temperature accompanied by an increase in film refractive index. For the amorphous layers, the leakage currents were lower for films grown at 380 °C than for films grown at 170 °C. This is proposed to be related to the reduction of annealable short-range defects in the amorphous Ta2O5 film with increasing growth temperature. For polycrystalline layers, the leakage currents were much higher compared to amorphous films, suggesting that crystal-induced defects play an important role in determining the leakage current even for the nanocrystalline film grown at 520 °C. © 1998 American Institute of Physics.
    Type of Medium: Electronic Resource
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