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  • 1
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 64 (1988), S. 4187-4193 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The results of an investigation into the redistribution of dopants—As, B, and P—during the solid-phase reaction of Cr with Si substrates to form CrSi2 are presented. Cr layers, 47 nm thick, were evaporated onto B-doped Si substrates which had previously been implanted with one of the three dopants. Two implant doses were investigated for each dopant. Following heat treatment at 500 °C, doping profiles were determined by secondary-ion mass spectrometery (SIMS) and, for arsenic-doped samples, by Rutherford backscattering spectroscopy (RBS). Both SIMS and RBS were also used to measure the extent of silicide formation. The results demonstrate that B and P are transported from the Si substrate to the surface of the growing CrSi2 layer while As accumulates at the CrSi2/Si interface. The silicide formation reaction is shown to be inhibited by large As concentrations. No other dopant-concentration-related effects were observed. A model, based on dopant segregation driven by the relative free energies of CrSi2 and Cr-dopant compounds, is proposed to explain the results.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 81 (2002), S. 895-897 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Pb(Zr,Ti)O3 (PZT) films (450 nm thick) were grown on 4H–silicon carbide (SiC) substrates by a pulsed-laser deposition technique. X-ray diffraction confirms single PZT phase without a preferred orientation. Stable capacitance–voltage (C–V) loops with low conductance (〈0.1 mS/cm2, tan δ∼0.0007 at 400 kHz) and memory window as wide as 10 V were obtained when 5-nm-thick Al2O3 was used as a high band gap (Eg∼9 eV) barrier buffer layer between PZT (Eg∼3.5 eV) and SiC (Eg∼3.2 eV). High-frequency (400 kHz) C–V characteristics revealed clear accumulation, and depletion behavior. Although the charge injection from SiC is the dominant mechanism for C–V hysteresis in PZT/Al2O3/SiC, negligible sweep rate dependence and negligible applied bias dependence were observed compared to that of PZT/SiC. By using room-temperature photoilluminated C–V measurements, the interface states as well as the charge trapping in the PZT/Al2O3 stacks have been calculated. © 2002 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 3
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Thin-film growth and compositional effects of c-axis oriented YBa2Cu3O7−x (YBCO) thin films synthesized by metalorganic chemical vapor deposition have been investigated. The formation of single cation films using tetramethylheptanedionate precursors was shown to be mass controlled, exhibiting a ratio of deposited to evaporated species in the increasing order Ba, Y, and Cu. The physical properties of off-stoichiometric YBCO films deposited on MgO substrates were measured in the compositional range 1.1≤Ba/Y≤2.3 and 1.5≤Cu/Ba≤4.6. While structural properties such as c-axis values and rocking curves appeared unaffected to variations in cation stoichiometry, morphology was observed to be extremely sensitive even to slight changes in composition. Off-stoichiometric layers with Cu/Ba(approximately-greater-than)1.5 were observed to exhibit Cu-rich precipitates embedded in a 1:2:3 YBCO film matrix. The zero-resistivity temperatures were above 77 K for all cation film compositions measured. However, sharp ac-susceptibility transitions were restricted to a more narrow compositional range (1.9〈Cu/Ba〈3.6). The best superconducting properties [Tc=85 K, Jc (77 K)(approximately-greater-than)106 A/cm2] were observed for films with relatively rough surface morphologies (Ba/Y=1.6 and Cu/Ba=3.5). An optimum trade-off between smooth surfaces and superconducting properties was found for Ba/Y=1.5 and Cu/Ba=1.9, yielding Tc=81 K and Jc (77 K)=3×105 A/cm2.
    Type of Medium: Electronic Resource
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  • 4
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Thin layers of YBa2Cu3O7−x (YBCO) deposited on LaAlO3 substrates have been prepared in situ by coevaporation of Y, Ba, and Cu. Incorporation of oxygen was accomplished by an atomic oxygen beam source with high cracking efficiency. The total oxygen flow at the substrate could be kept low enough to permit the use of a quadrupole mass spectrometer for evaporation rate monitoring. Films were strongly c-axis oriented with rocking curve full width at half-maximum values of 0.6°. Transport measurements on patterned films yielded critical current densities of 6×106 A/cm2 at 77 K. The deposition method was demonstrated to be feasible for preparation of Y2O3/YBCO heterostructures.
    Type of Medium: Electronic Resource
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  • 5
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Tungsten was deposited from a gas mixture of hydrogen and tungsten hexafluoride onto a polycrystalline silicon gate structure in a chemical vapor deposition system. During the deposition process fluorine was also deposited as an undesired impurity. In order to remove the fluorine, heat treatments in the temperature range 550–1050 °C were performed in a hydrogen atmosphere. By this treatment it is possible to form volatile hydrofluoric acid and hence remove fluorine from the structure. Nuclear-resonance-broadening technique and secondary ion mass spectrometry were used for the analysis of fluorine. Fluorine was detected in all the samples except for the sample heat treated at 1050 °C. Moreover, etching of the polycrystalline silicon was observed. The gettering of fluorine, the etching of silicon and the observed formation of tungsten disilicide at 650 °C are discussed with respect to conceivable mechanisms. A thermodynamic study supporting the interpretations is also included.
    Type of Medium: Electronic Resource
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  • 6
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 69 (1991), S. 213-219 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Tungsten disilicide (WSi2) was formed by annealing tungsten films deposited by low-pressure chemical vapor deposition on 〈100〉-silicon substrates. The influence of oxygen on the silicidation rate was studied. Si wafers with different oxygen content in the form of Czochralski, float-zone, and epitaxial wafers were used. Oxygen was also ion implanted into either the silicon substrate or the as-deposited tungsten film. The Rutherford backscattering technique was used to follow the progress of the silicidation. The silicidation rate was found to be dependent on the oxygen content of the Si substrates. The rate was lowest for Czochralski substrates and highest for float-zone substrates. Secondary ion mass spectroscopy was used to study the oxygen and fluorine profiles in the films prior to and after silicidation. Growth of WSi2 was found to be retarded concurrently with a pile-up of fluorine at the tungsten side of the W/WSi2 interface and a gettering of oxygen from the annealing atmosphere at the interface. Growth of WSi2 was then transferred to the tungsten surface. Oxygen implantation into silicon and tungsten, respectively, reduced the rate of silicide formation. Oxygen implantation into tungsten altered the distribution of fluorine and suppressed WSi2 growth at the tungsten surface. The observations led to a conceptual model, which ascribes the retardation in the growth of the inner WSi2 to a"poisoning'' effect caused by the increase of oxygen and fluorine levels at the interface.
    Type of Medium: Electronic Resource
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  • 7
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 65 (1989), S. 567-574 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Oxygen behavior during the formation of CrSi2 and TiSi2 was studied using 16O(α,α)16O resonant scattering and mass dispersive recoil detection analysis. The Ti and Cr films were deposited by e-beam evaporation in a cryopumped system. The oxygen content in the films was varied by evaporating at different pressures. The silicide films were formed by solid-solid reaction of the metal layers with the silicon substrate, and the annealing conditions were such that both partly and fully reacted silicides were obtained. The extent of the silicide formation was monitored by backscattering spectrometry. In the case of CrSi2, oxygen was found to be uniformly distributed throughout the silicide layer after annealing. For the Ti/TiSi2 system, however, oxygen seems to have preferentially remained in the Ti layer during the silicide growth, and its final distribution was confined in a region in the silicide close to the surface. It was also observed in the latter case that silicon diffused to the surface at the initial stage of annealing. A model based on the Nernst–Einstein equation is proposed to provide a general explanation for the oxygen behavior in metal/silicon systems. In addition, it was shown that oxygen which was initially in the form of metal oxides and in solid solution had been transformed into SiO2 after the silicide formation. Oxygen loss is observed for all samples, and increases with the extent of annealing.
    Type of Medium: Electronic Resource
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  • 8
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 87 (2000), S. 8039-8044 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Titanium tungsten (Ti0.58W0.42) Schottky contacts to both n- and p-type 4H silicon carbide were fabricated using sputtering. The n- as well as p-type Schottky contacts had excellent rectifying characteristics after vacuum annealing at 500 °C with a thermally stable ideality factor of 1.06±0.03 for n-type and 1.08±0.01 for p-type. The measured Schottky barrier height (SBH) was 1.22±0.03 eV for n-type and 1.93±0.01 eV for p-type in the range of 24–300 °C. Our results of Ti0.58W0.42 Schottky contacts to both n- and p-type can be explained perfectly by thermionic emission theory and also satisfy the Schottky–Mott model in contrast to earlier works. Capacitance–voltage measurements were also performed and the results were in good agreement with those of current–voltage measurements. In addition, the inhomogeneous behavior with higher ideality factor and lower SBH of p-type Ti0.58W0.42 contacts for as-deposited contacts is explained by using a model with contribution of recombination current originated by lattice defects to thermionic emission current. © 2000 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 9
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: A nonselective epitaxial growth process for heterojunction bipolar transistors has been studied. The difference in growth rates for epitaxial and polycrystalline films could be used to monitor the thickness of the intrinsic and extrinsic base layers. The films were grown using chemical vapor deposition on Si 〈100〉 (epitaxy) and on silicon dioxide (polycrystalline) at reduced pressure (20–80 Torr) for undoped and in situ B or As doping. The depositions were carried out using silane diluted in hydrogen. Diborane and arsine were used as the source gas for dopants. For the undoped Si films, the deposition of polycrystalline films had a substantially higher rate than that of epitaxial ones. The growth rate of both epitaxial and polycrystalline depositions decreased with increasing total pressure. It was, however, linearly proportional to the silane partial pressure, pSiH4. The dependence of the growth rate on the hydrogen partial pressure was proportional to pH2−0.82 for epitaxial and to pH2−0.60 for polycrystalline depositions. The apparent activation energy was 2.1 and 1.6 eV for the epitaxial and polycrystalline depositions, respectively. A growth mechanism assuming the dissociative adsorption of silane on the Si surface, in combination with first-order hydrogen desorption kinetics, was employed to describe the experimental observations, including the differences in deposition rates, dependency on the hydrogen partial pressure as well as apparent activation energy. In situ B doping influenced neither the epitaxial nor polycrystalline depositions. In situ As doping, on the other hand, largely reduced the growth rate compared to the undoped films to such an extent that there was no appreciable difference in growth rate between the epitaxial and polycrystalline Si. The doping concentration in the epitaxial B and As films were of the order of 1018 cm−3, identical deposition conditions yielded a 5 and 20 times larger dopant incorporation in the B and As doped polycrystalline films, respectively. © 2000 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 10
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 86 (1999), S. 1970-1973 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The kinetics of hydrogen incorporation in amorphous silicon films were studied. The layers were deposited by low pressure chemical vapor deposition using disilane (Si2H6) and phosphine (PH3). The hydrogen concentration, determined by nuclear resonant reaction analysis, increased with decreasing substrate temperature. In accordance with the reported reduction of hydrogen adsorption in the presence of surface phosphorus, the addition of phosphine to disilane was observed to reduce the hydrogen film concentration. The results are discussed in terms of hydrogen adsorption/ desorption kinetics. The activation energy for hydrogen desorption in an undoped film was 1.8±0.2 eV, in good agreement with previously reported values obtained by surface analysis and desorption studies. When phosphine was added, an increase in activation energy was observed. © 1999 American Institute of Physics.
    Type of Medium: Electronic Resource
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