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  • 1
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: A nonselective epitaxial growth process for heterojunction bipolar transistors has been studied. The difference in growth rates for epitaxial and polycrystalline films could be used to monitor the thickness of the intrinsic and extrinsic base layers. The films were grown using chemical vapor deposition on Si 〈100〉 (epitaxy) and on silicon dioxide (polycrystalline) at reduced pressure (20–80 Torr) for undoped and in situ B or As doping. The depositions were carried out using silane diluted in hydrogen. Diborane and arsine were used as the source gas for dopants. For the undoped Si films, the deposition of polycrystalline films had a substantially higher rate than that of epitaxial ones. The growth rate of both epitaxial and polycrystalline depositions decreased with increasing total pressure. It was, however, linearly proportional to the silane partial pressure, pSiH4. The dependence of the growth rate on the hydrogen partial pressure was proportional to pH2−0.82 for epitaxial and to pH2−0.60 for polycrystalline depositions. The apparent activation energy was 2.1 and 1.6 eV for the epitaxial and polycrystalline depositions, respectively. A growth mechanism assuming the dissociative adsorption of silane on the Si surface, in combination with first-order hydrogen desorption kinetics, was employed to describe the experimental observations, including the differences in deposition rates, dependency on the hydrogen partial pressure as well as apparent activation energy. In situ B doping influenced neither the epitaxial nor polycrystalline depositions. In situ As doping, on the other hand, largely reduced the growth rate compared to the undoped films to such an extent that there was no appreciable difference in growth rate between the epitaxial and polycrystalline Si. The doping concentration in the epitaxial B and As films were of the order of 1018 cm−3, identical deposition conditions yielded a 5 and 20 times larger dopant incorporation in the B and As doped polycrystalline films, respectively. © 2000 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 86 (1999), S. 1970-1973 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The kinetics of hydrogen incorporation in amorphous silicon films were studied. The layers were deposited by low pressure chemical vapor deposition using disilane (Si2H6) and phosphine (PH3). The hydrogen concentration, determined by nuclear resonant reaction analysis, increased with decreasing substrate temperature. In accordance with the reported reduction of hydrogen adsorption in the presence of surface phosphorus, the addition of phosphine to disilane was observed to reduce the hydrogen film concentration. The results are discussed in terms of hydrogen adsorption/ desorption kinetics. The activation energy for hydrogen desorption in an undoped film was 1.8±0.2 eV, in good agreement with previously reported values obtained by surface analysis and desorption studies. When phosphine was added, an increase in activation energy was observed. © 1999 American Institute of Physics.
    Type of Medium: Electronic Resource
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