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  • 1
    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Solid state phenomena Vol. 141-143 (July 2008), p. 599-604 
    ISSN: 1662-9779
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Physics
    Notes: The apparent viscosity model of the semi-solid A356 aluminum alloy, based on fitting ofexperimental data obtained by the Couette type viscometer, was developed in the paper. Thecommercial package CastSoft6.0 coupled with the model was used to simulate the mould filling of thesemi-solid A356 aluminum alloy in the key-shaped component with iron cores. The simulation resultsshowed that the position of the iron cores has an important effect on the filling of the semisolid slurry,and it is easy to obtain the completely filled key-shaped component when the iron cores were near tothe inlet. The filling tests verified that the simulation results have good agreement with theexperimental results. The fitting results indicated that the developed apparent viscosity model ispractical and feasible and it can be used to simulate the mould filling process of the semisolid A356aluminum alloy slurry. Also the parameters were optimized and the optimum parameters are asfollows: the inject pressure is more than 15MPa, the inlet velocity is more than 1.73m/s and theforming temperature is over 585 °C
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Materials science forum Vol. 157-162 (May 1994), p. 1009-1014 
    ISSN: 1662-9752
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Solid state phenomena Vol. 116-117 (Oct. 2006), p. 410-416 
    ISSN: 1662-9779
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Physics
    Notes: The study on new rheoforming technologies of semisolid alloys has recently been onemain subject interesting many professors, experts and industrials, and so many new methods aboutpreparing semisolid alloy slurry and rheoforming process have been put forward. The semisolidslurry of AlSi7Mg alloy was prepared by being poured at a low superheat and stirred by anelectromagnetic field at a low power for a short time, and then the slurry was further soaked forproper time and finally rheoformed into a key-shaped die cavity in this paper. The influence ofslurry temperature, injection specific pressure and injection speed on the rheoforming process wasalso studied. The experimental results show that if AlSi7Mg alloy melt is poured at 630°C or 650°Cand meanwhile stirred by an electromagnetic field at a low power for a short time, the most primaryα-Al grains solidified in the slurry are spherical and only a few are rosette-like. If the slurry aftermade is then soaked in the liquidus-solidus range for some time, the ripening of primary α-Algrains is developed further and they become more spherical and larger. The experimental resultsalso show that the slurry temperature, injection pressure and speed have a great influence on fillingability. The higher the slurry temperature, injection pressure and speed, the higher the slurry fillingability, and the shorter the core distance from the ingate, the more easily the die cavity is filled.With the given key-shaped casting, if only the slurry temperature should be equal to or more than585,, or the injection pressure is equal to or more than 20 MPa, or the injection speed should beequal to or more than 1.73m/s, the key-shaped die cavity can be filled completely. Themicrostructural distribution in the casting is very homogeneous and it shows that the slurry preparedby the new method is very suitable for rheoforming and helpful to obtaining high quality castings
    Type of Medium: Electronic Resource
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  • 4
    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Solid state phenomena Vol. 105 (July 2005), p. 95-100 
    ISSN: 1662-9779
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Physics
    Notes: A new model describing the reaction stresses during plastic deformation of metals isproposed in which the reaction stresses among the grains and their accumulation are calculated. The model could overcome the shortages of the Sachs and Taylor deformation model. According to the model, the plastic strain tensor induced by activation of slip systems will produce certain elastic reaction stress in the surrounding matrix, which influences the choice of further activation of slip systems as well as the orientation evolution. The model gives more attention to both of the stress and strain compatibility among the grains. The simulation on the tensile deformation of pure copper indicates that the model could exhibit the main characteristics of the real deformation process
    Type of Medium: Electronic Resource
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  • 5
    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Materials science forum Vol. 495-497 (Sept. 2005), p. 639-644 
    ISSN: 1662-9752
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Orientation mapping based on EBSD technique was applied to reveal the orientations of new grains and their relationships to the surrounding matrices, to analyze Kikuchi band contrast and the influence of strain rates on local orientation evolution. This information is used to understand the dynamic recrystallization mechanism and the relative contribution of plastic slip versus grain boundary glide or grain rotation related with super-plasticity. For this purpose samples with differentinitial textures were deformed by (quasi-)plain strain compression at two strain rates. It is suggested that the dynamic recrystallization in this alloy proceeds in continuous way by progressive subgrain rotation. No evident non-basal slip of 〈a+c〉 was observed by referring texture evolution in the sample with initial basal texture. A high strain rate promotes more contribution of plastic slip accompanied by fast orientation changes. The fact that groups of grains with very similar orientationsin basal oriented samples is discussed in terms of viscous flow
    Type of Medium: Electronic Resource
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  • 6
    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Materials science forum Vol. 408-412 (Aug. 2002), p. 269-274 
    ISSN: 1662-9752
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Type of Medium: Electronic Resource
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  • 7
    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Materials science forum Vol. 495-497 (Sept. 2005), p. 995-1000 
    ISSN: 1662-9752
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: A reaction stress model is introduced in this paper and its applications for thecrystallographic texture simulation are also discussed with the comparison to the classic Taylor type model and the self consistent model. This model took the external deformation stress tensor as an initial point, and the activation process of slip systems as well as the orientation evolutions was simulated step by step. Certain relaxation of reaction stress were introduced during tensile or drawingdeformation, which predicts the tensile direction distribution along the orientation line between 〈111〉 and 〈100〉 in the inverse pole figure besides the 〈111〉 and 〈100〉 fiber texture. The simulation agrees with the common experimental observations. The model supplies a simple way to follow the deformation process in the main part of polycrystals, in which the effect of grain orientation and its interaction with the surrounding matrix are considered
    Type of Medium: Electronic Resource
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  • 8
    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Materials science forum Vol. 408-412 (Aug. 2002), p. 281-286 
    ISSN: 1662-9752
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Type of Medium: Electronic Resource
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  • 9
    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Materials science forum Vol. 475-479 (Jan. 2005), p. 3153-3156 
    ISSN: 1662-9752
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: A new approach to simulating the orientation distribution function (ODF) using onediffraction frame collected by X-ray two-dimensional detector is proposed. Based on the concept that the texture component presents a normal distribution form, the volume fraction and the orientation spread of texture component are obtained using curve fitting method from diffraction profile and, the pole figures as well as ODF can be calculated. Thus the texture of grain-oriented silicon steel is determined rapidly and conveniently. A comparison of the simulation ODF with that reconstructed from experimental pole figures by series expansion is presented and the results showthat the new approach works correctly
    Type of Medium: Electronic Resource
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  • 10
    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Materials science forum Vol. 495-497 (Sept. 2005), p. 1359-1364 
    ISSN: 1662-9752
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: The residual stress and crystallographic texture of diamond films were investigated in the present work. The diamond films were synthesized on (100) silicon wafer by Microwave Plasma Chemical Vapor deposition (MPCVD). Then the residual stresses of the films were measured by X-ray diffractometer equipped with the two-dimensional detector. The residual stresses can be classified into two categories, i.e., the intrinsic stresses and the thermal stresses. It was shown that the thermal stresses were compressive in the temperature range studied and the intrinsic stresses were tensile. The crystallographic textures of the films were measured by X-ray diffractometer with the method of pole figure and orientation distribution function (ODF). The experimental results suggest that the crystallographic textures of the films depend upon the deposition temperature and methane flow rates, and the components and intensity of crystallographic textures have effect on the residual stresses in diamond films to a certain extent
    Type of Medium: Electronic Resource
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