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  • 1
    Electronic Resource
    Electronic Resource
    Springer
    Applied physics 2 (1973), S. A107 
    ISSN: 1432-0630
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 58 (1985), S. 2553-2558 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Infrared absorption measurements of localized vibrational modes (LVM) due to Al in ZnSe performed under high-resolution conditions reveal additional features as compared to previous data. The cluster of bands near 340 cm−1 is resolved into at least six and possibly eight individual absorptions. A Green's function calculation over various pertinent models best explains most of these LVM as probably arising from a (2 AlZn-ZnSe) antisite complex (or at least an AlZn pair) with other complexes less likely. The linewidth of individual features can be explained in terms of nearest-neighbor Se host lattice isotopes. Finally, features perturbed from the isolated AlZn case are considered as well as the remaining LVM of unknown origin.
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 57 (1985), S. 1022-1028 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Infrared reflection and transmission measurements were used to study the thermally induced regrowth of (100) oriented, Be-implanted GaAs samples. The samples used in this study were implanted at low temperature (−100 °C) with 250-keV Be ions to a fluence of 6×1015 cm−2. The samples were postannealed at temperatures ranging from 100 to 550 °C. Isochronal and isothermal annealing at a series of temperatures between 180 and 240 °C were performed. Infrared reflection spectra were analyzed by using a three or four layer dielectric model. Analysis of the annealing data suggests that an amorphous layer first anneals to a second metastable amorphous state and then becomes a damaged crystalline layer after annealing at 220 °C for 12 h. The observed regrowth is not by a simple epitaxial process. After annealing at 400 °C for 1 h, the damage in the layer is reduced sufficiently for the refractive index to recover almost to the preimplantation value. On annealing at 450 °C free carriers are observed. From the measured average regrowth rate for the amorphous layer at various anneal temperature, an effective activation energy is estimated to be about 1.45 eV. This compares with activation energies of 2.3 eV for Si and 2.0 eV for Ge.
    Type of Medium: Electronic Resource
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  • 4
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 59 (1986), S. 1927-1935 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Free-charge carriers in both room- and low-temperature Be-implanted GaAs were generated by annealing at 400, 450, and 475 °C and were observed by using both infrared reflection and electrical measurements. Annealing at 400 °C for 2 h removes homogeneously most of the damage-related changes in the refractive index. Longer annealing (∼50 h) or shorter term annealing at higher temperature produces free carriers. A computer model including plasma effects was used to fit the reflection curves. In general the infrared analysis results and the electric data were in reasonable agreement. Results for the room-temperature-implanted samples show the free-carrier density profile, approximated by joined half-Gaussians, to be (i) a standard deviation for the deeper half-Gaussian (σh≤0.1 μm), which is about the same or smaller than that observed by secondary ion mass spectrometry measurements (∼0.13 μm) for the Be profile, and (ii) a peak position 1.2 μm, which is deeper than the Be ion peak at 0.95 μm. Both peak positions remain essentially unchanged during the anneals. Activation of carriers at these low temperatures is not seen in either Si- or Zn-implanted GaAs. The Zn-implanted material has a weak effect at 500 °C, while the Si-implanted material has none up to 550 °C. The free-carrier profile is considered as the combination of the concentration distributions of dopant ions, Ga vacancies, and possible compensating damage-related states. The discussion centers on the detailed results for the Be case.
    Type of Medium: Electronic Resource
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  • 5
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 59 (1986), S. 1936-1945 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: A study is given of the effect of ion implantation on the carrier density and the infrared dielectric constant of heavily doped, high-carrier density, n-type GaAs as measured by infrared reflection. Hydrogen ions were implanted at 300 keV at room temperature and carbon ions at 380 keV at near-liquid-nitrogen temperature. For H and C ions the effects of the implantation and subsequent annealing from 100 to 550 °C are examined. The 1H ion implantation and annealing results are compared with available SIMS data and with the carrier density profile obtained from capacitance-voltage measurements of a progressively etched sample. The 1H and carrier compensation profiles are clearly related and show a compensated layer ∼3 μm thick for the as-implanted samples. A deeply diffused layer is present after annealing and the depth grows with anneal temperature. After 500 °C annealing the carrier compensation in the diffused layer disappears but the original layer is still compensated. The 12C-implanted sample shows both carrier compensation and substantial damage-related changes in the dielectric constant. Annealing removes the damage-related changes and no compensated diffused layer such as that observed for hydrogen was present. An effective diffusion constant for the hydrogen related defect can be estimated but its value is dependent upon the model used. Different models give Deff=D0effe−Ea/kT with Ea about 1 eV but with D0eff values which are strongly model dependent.
    Type of Medium: Electronic Resource
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  • 6
    Electronic Resource
    Electronic Resource
    Springer
    Journal of materials science 13 (1978), S. 2418-2428 
    ISSN: 1573-4803
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Abstract The radiation damage induced by the implantation of 2.7 MeV P+ and N+ ions with a dose of 6.4 × 1016 ions cm−3 into GaAs at room temperature has been studied by transmission electron microscopy. The as-implanted material was found to consist of a buried amorphous layer which was sandwiched between a heavily damaged but crystalline cover layer exhibiting a high density of black dot defects, microtwins and dislocation loops and a less damaged substrate region. Post-implantation annealing of the specimens at 250° C for 6 h resulted in the recrystallization of the amorphous and cover layers by random nucleation of grains producing a polycrystalline region on the single crystal substrate. However, a second stage annealing of these samples at 400° C for 2 h caused an epitaxial regrowth of the implanted layer on the undamaged substrate producing single crystal regions which were heavily twinned on all {111} planes. The results of the present microstructural analyses have been compared with the previous infra-red reflectivity studies on identically implanted GaAs samples to determine the effects of structural changes on the dielectric properties. The two studies are found to be in reasonable agreement. The present results are also compared with those from previous lower energy-lower dose implantations.
    Type of Medium: Electronic Resource
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