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  • 1
    Electronic Resource
    Electronic Resource
    s.l. : American Chemical Society
    The @journal of physical chemistry 〈Washington, DC〉 94 (1990), S. 8703-8708 
    Source: ACS Legacy Archives
    Topics: Chemistry and Pharmacology , Physics
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    s.l. : American Chemical Society
    The @journal of physical chemistry 〈Washington, DC〉 95 (1991), S. 6129-6141 
    Source: ACS Legacy Archives
    Topics: Chemistry and Pharmacology , Physics
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 71 (1992), S. 725-734 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Electron trap generation in thermally grown silicon dioxide (SiO2) during Fowler–Nordheim (FN) stress is investigated by using an aluminium-gated capacitor structure. The generated electron traps are characterized by the avalanche electron injection technique. The experimental results support the model that electron trapping in oxide follows the first-order kinetics and may have multiple-capture cross sections. It is found that both donorlike (positive charge related) and acceptorlike (neutral before capturing electron) traps are generated and they behave differently. The donorlike trap is not stable at or above room temperature and its effective density saturates as the stressing time increases, while the opposite is true for the acceptorlike trap. The electron-capture cross section of donorlike trap spreads from 10−18 to over 10−14 cm2, but the capture cross section of the generated acceptorlike trap is limited in the range of (4.5–9)× 10−17 cm2. The acceptorlike trap is generated by the interaction between free holes and SiO2 and hole trapping leads to donorlike traps. The relation between the generated trap and the as-grown trap will be discussed. Comparison of the electron traps generated by FN stress with those by irradiation and hot hole injection indicates that the electron trap generation under these different stressing conditions is controlled by the same mechanism. The necessary condition for electron trap generation is the presence of holes in the oxide, rather than a high electrical field.
    Type of Medium: Electronic Resource
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  • 4
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: High-Tc superconducting Bi-Sr-Ca-Cu-O thin films with good electrical properties and smooth surface morphologies have been prepared by low-pressure organometallic chemical vapor deposition using the new fluorocarbon-based precursors Sr(hexafluoroacetylacetonate)2⋅tetraglyme and Ca(hexafluoroacetylacetonate)2⋅triglyme together with Cu(acetylacetonate)2 and triphenylbismuth [Bi(C6H5)3]. The fluorinated precursors are air-stable and exhibit high, stable volatility even after prolonged heating. X-ray diffraction measurements reveal that the films deposited at 650 °C contain some fluoride phases but no high-Tc phases. However, post-annealing in oxygen produces films composed predominantly of the Bi2Sr2CaCu2Ox phase with high preferential orientation of the crystallite c axes perpendicular to the substrate surface. Four-probe resistivity measurements indicate the onset of film superconductivity at ∼100 K and zero resistivity achieved at 73 K.
    Type of Medium: Electronic Resource
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  • 5
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 72 (1992), S. 1429-1435 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Preparation of silicon dioxide (SiO2) thin films by plasma anodization is a promising low temperature (≤600 °C) silicon oxidation technique. This paper investigates the electron trapping and thermal detrapping properties of the plasma grown oxide and compares them with those of the conventional thermal oxide. The avalanche electron injection measurement shows that the electron trapping in the plasma oxide is more severe. The two electron capture cross sections detected in the plasma oxide are of the order of 10−15 and 10−17 cm2, respectively. The former is absent in the thermal oxide and is a feature of oxides prepared at low temperature. The latter is also found in thermal oxide, but its chemical nature is different. Both of them are located near SiO2/silicon interface, indicating that they are related to the intermediate layer. The electron detrapping process in the plasma oxide is different from that in the thermal oxide and has a linear dependence on the logarithmic time. The detrapping is thermally activated with an activation energy of 0.63–0.75 eV. The above traps in plasma oxide can be removed by a high temperature (e.g., 960 °C) post-oxidation annealing (POA) in an inert ambient. After such a POA, the electron trapping in plasma oxide is similar to that in thermal oxides. Some speculation on the trap formation processes is included.
    Type of Medium: Electronic Resource
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  • 6
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 71 (1992), S. 5168-5172 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Reflection high-energy electron diffraction was used to monitor Si(111) growth during gas source molecular beam epitaxy using disilane (Si2H6). Depending on the substrate temperature, the growing Si(111) surface was found to exhibit hydrogenated δ(7×7), (1×1), (5×5), and (7×7) reconstructions. Within the substrate temperature range of 490 to 560 °C where growth proceeded two-dimensionally, clear and well-defined intensity oscillations could be observed in the [21¯0] azimuths. Since consecutive atomic layers on the Si(111) surface are nonequivalent, the oscillation periods were found to correspond to bilayer growth. In the two-dimensional (2D) growth regime, the oscillation frequencies, and hence the growth rates deduced, were found to increase with increasing substrate temperature and flow rate of Si2H6. At higher temperatures, there was a change from 2D layer-by-layer growth to step propagation and consequently, the intensity oscillations were weak or absent. At low temperatures (〈400 °C) where no dissociative adsorption of Si2H6 occurred, intensity oscillations were not observed.
    Type of Medium: Electronic Resource
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  • 7
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Three techniques have been combined to correlate interface morphology and optical properties of single AlAs-GaAs quantum wells grown by molecular beam epitaxy (MBE) with and without growth interruption at the inverted (GaAs on AlAs) interface. Surface recovery and interface formation were monitored in situ by reflection high energy electron diffraction, optical properties were assessed by photoluminescence excitation (PLE) spectroscopy and the results compared with a Monte Carlo simulation of MBE growth, extended to evaluate PLE linewidths. Criteria for linewidth reduction have been established and interface morphology described.
    Type of Medium: Electronic Resource
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  • 8
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 73 (1993), S. 2333-2337 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The transition from growth by the formation and coalescence of two-dimensional clusters to the growth by step advancement on vicinal InAs(001) surfaces has been examined during molecular-beam epitaxy by the measurements of reflection high-energy electron diffraction oscillations. The growth mode transition is compared with results from vicinal GaAs(001) surfaces and qualitatively analyzed on the basis of the surface migration and attachment kinetics of In adatoms.
    Type of Medium: Electronic Resource
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  • 9
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 71 (1992), S. 4299-4304 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: We have systematically examined the transition from two-dimensional nucleation to step-flow growth on variously misoriented vicinal GaAs (001) surfaces during molecular beam epitaxy using reflection high-energy electron diffraction (RHEED). The time to the first maximum of the RHEED intensity oscillations is gradually delayed as the growth mode transition temperature is approached from below as the result of an increasing number of adatoms being incorporated at steps. Detailed analysis of this delay has shown that the incorporation rate is independent of the Ga flux, but it is strongly dependent on the direction of misorientation. This means that step edges do not act as perfect sinks for adatoms, but that detachment can occur relatively easily. The energy barrier for incorporation is considerably higher for Ga- than As-terminated steps, which strongly suggests that the anisotropic growth mode transition on GaAs (001) stems mainly from the different step structures rather than anisotropic Ga adatom migration.
    Type of Medium: Electronic Resource
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  • 10
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 71 (1992), S. 2655-2662 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: We demonstrate that optical second-harmonic generation (SHG) can be successfully used for in situ study of metal/polymer interfaces. With this SHG technique, Cu cluster formation on polyimide by surface diffusion and Cu diffusion into polyimide have been investigated. The diffusion coefficients of Cu clusters into polyimide at various temperatures have been determined from the measured decay of SHG signal with time. The effects of temperature, cluster size, and surface modification on diffusion have also been examined. For T 〈 Tg, the surface diffusion of Cu on polyimide to form clusters dominates over the diffusion into the bulk. The latter process becomes competitive with increasing temperature. When T (approximately-greater-than) Tg, few large-size Cu clusters can be formed on the polyimide surface. Cu diffusion into polyimide bulk can be greatly impeded by either a monolayer of Ti or by Cu clusters implanted in polyimide beforehand. In this case, Cu can wet the modified surface and form an interface between Cu and polyimide with good adhesion.
    Type of Medium: Electronic Resource
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