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  • 11
    Electronic Resource
    Electronic Resource
    Finite Element Modeling of Burr Formation in Orthogonal Metal Cutting (2008)
    s.l. ; Stafa-Zurich, Switzerland
    Advanced materials research Vol. 53-54 (July 2008), p. 71-76 
    Details
    ISSN: 1662-8985
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: A coupled thermo-mechanical model of plane-strain orthogonal metal cutting includingburr formation is presented using the commercial finite element code. A simulation procedure basedon Normalized Cockroft-Latham damage criterion is proposed for the purpose of better understandingthe burr formation mechanism and obtaining a quantitative analysis of burrs at exit. The cuttingprocess is simulated from the transient initial chip formation state to the steady-state of cutting, andthen to tool exit transient chip flow, by incrementally advancing the cutting tool. The effects of cuttingcondition on the non-steady-state chip flow while tool exit can be investigated using the developedfinite element model
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/41/transtech_doi~10.4028%252Fwww.scientific.net%252FAMR.53-54.71.pdf
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  • 12
    Electronic Resource
    Electronic Resource
    Effects of Nb and Mg on Microdefects in NiAl Alloys (1994)
    s.l. ; Stafa-Zurich, Switzerland
    Materials science forum Vol. 175-178 (Nov. 1994), p. 339-342 
    Details
    ISSN: 1662-9752
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/02/00/transtech_doi~10.4028%252Fwww.scientific.net%252FMSF.175-178.339.pdf
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  • 13
    Electronic Resource
    Electronic Resource
    Finite Element Modeling of Burr Formation in Metal Cutting with a Backup Material (2007)
    s.l. ; Stafa-Zurich, Switzerland
    Advanced materials research Vol. 24-25 (Sept. 2007), p. 71-76 
    Details
    ISSN: 1662-8985
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: 2D finite element model with the same material for backup to minimize the burr size wasdeveloped to investigate mechanism of burr formation and burr minimization. The flowstress of theworkpiece and backup material are taken as a function of strain, strain-rate and temperature.Temperature-dependent material properties are also considered. The Cockroft-Latham damagecriterion has been adopted to simulate ductile fracture. The crack initiation and propagation issimulated by deleting the mesh element. The result shows putting a backup material behind the edgeof the workpiece is an effective way to minimize the burr size. The effects of cutting condition,temperature and different backup material properties on the burr formation and burr size can beinvestigated using the developed finite element model. This model could be useful in the search foroptimal tool geometry and cutting condition for burr minimization and for the modeling of a burrformation mechanism
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/39/transtech_doi~10.4028%252Fwww.scientific.net%252FAMR.24-25.71.pdf
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  • 14
    Electronic Resource
    Electronic Resource
    Study on Inner Micro-Grooves of Heat Pipe Spinning Process and Multi-Tooth Mandrel (2008)
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 375-376 (Mar. 2008), p. 358-363 
    Details
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: The manufacturing process of micro-grooves inside thin-walled copper heat-pipe is alwayscomplicated and difficult. Separately adopted GCr15 and W18Cr4V multi-tooth mandrel, a series ofexperiments have been done to machine axially inner micro-grooves of micro-heat-pipe with oil-filledsteel-ball spinning technology to analyze the mandrel effect and failure mechanism. It was studiedhow the tooth-shape of multi-tooth mandrel affects the inner micro-groove shape of the copper tubeand how the working position of multi-tooth mandrel affects groove-wall surface morphology andgroove path. The wear and fracture characteristics of multi-tooth mandrel are introduced. It is provedthat the form of GCr15 mandrel failure in machining micro-grooves is tooth-broken ortooth-collapsed, and its service life is short. Differently, the form of W18Cr4V mandrel failure is feltwear, and its service life is long
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/57/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.375-376.358.pdf
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  • 15
    Electronic Resource
    Electronic Resource
    Large Plastic Deformation and Ultra-Fine Grained Structures Generated by Machining (2008)
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 375-376 (Mar. 2008), p. 21-25 
    Details
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Microstructure of machined copper chips at very low velocity was characterized bytransmission electron microscopy. The structure of the machined chip produced by reasonablecombinations of machining parameters is virtually entirely occupied by isolated equiaxed submicrongrains of 100~300nm in size with high-angle boundaries. A finite element model was developed tostudy large plastic deformation in plain orthogonal machining copper. The numerical results showmost of the grain refinement associated with the formation of ultra-fine grained chip may be attributedto the large shear strain imposed in the deformation zone. It is feasible to take machining process as amethod of preparing ultra-fine grained materials. But the optimal design of the machining processrequires a precise and quantitative understanding of the mechanics of deformation-induced subgrainmicrostructure
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/57/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.375-376.21.pdf
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  • 16
    Electronic Resource
    Electronic Resource
    Study on Process of Planing Forming of Plate Fin Heat Sinks (2006)
    s.l. ; Stafa-Zurich, Switzerland
    Materials science forum Vol. 532-533 (Dec. 2006), p. 237-240 
    Details
    ISSN: 1662-9752
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Primary heat dissipation method of IC Chip is still air-cooling at present. This paperpresents a new machining method of air-cooled plate fin heat sinks, namely orthogonal planing. Thesurface of plate fins machined by this method are rough enough to augment its specific surface area;the rough surface can also disturb laminar sub-layer of turbulent thermal boundary layer, thus thethermal resistances of thermal boundary layer are reduced. Therefore, heat dissipation efficiency ofheat sink can be enhanced further. The focus of plate fin heat sinks forming by orthogonal planing ishow to machine flat chips. A new pattern of chip curl that is called down-curl can be observed whenrake angle of tool is rather large and cutting thickness is very thin. As cutting thickness increases,down-curl chips become flat and then up-curling. There is a transition area that chips are not curledbetween down- and up-curl. The conditions that chips are not curled are obtained throughinvestigating influences of rake angle and cutting thickness on chip curl, and flat plate fins with roughsurface are produced
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/02/14/transtech_doi~10.4028%252Fwww.scientific.net%252FMSF.532-533.237.pdf
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  • 17
    Electronic Resource
    Electronic Resource
    Effect of Rounded Cutting Edge Radius on Residual Stress within Machined Sublayer (2006)
    s.l. ; Stafa-Zurich, Switzerland
    Materials science forum Vol. 532-533 (Dec. 2006), p. 536-539 
    Details
    ISSN: 1662-9752
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: A coupled thermal-mechanical model of plane-strain orthogonal metal cutting withcontinuous chip formation is developed to investigate the residual stresses in the finished workpiece.Deformation of the workpiece material is treated as elastic-viscoplastic with isotropic strainhardening, and the numerical solution accounts for coupling between plastic deformation and thetemperature field, including treatment of temperature-dependent material properties. Automaticcontinuous remeshing and adaptive meshing technique are employed to achieve chip separation atthe tool tip region and a satisfactory solution. The finite element model is well validated bycomparing values of the predicted cutting forces and residual stresses with experimental results.Based on the established finite element model, the effect of rounded cutting edge radius on residualstress distribution is analyzed. The results show that altered cutting edge radius clearly producedsignificant changes in residual stresses. The maximum tensile residual stress and its penetrationdepth decrease as the cutting edge radius increases
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/02/14/transtech_doi~10.4028%252Fwww.scientific.net%252FMSF.532-533.536.pdf
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  • 18
    Electronic Resource
    Electronic Resource
    Defects in Carbon Allotropes Studied by Positron Annihilation (2008)
    s.l. ; Stafa-Zurich, Switzerland
    Materials science forum Vol. 607 (Nov. 2008), p. 149-151 
    Details
    ISSN: 1662-9752
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Slow positron beam technique has been employed to study the defects of graphite, nanophase C, as well as the structural changes in un-doped, B-doped and S-doped diamond films with annealing temperatures. The results show that the concentration of defects in nanophase C is higher than that in graphite. The vacancy concentration in the S-doped diamond film is higher than that in un-doped one. The addition of small amount of B atoms leads to the decrease of the vacancy concentration in the film. The vacancy concentration in un-doped diamond film would decrease after annealing at temperature below 600ºC, while vacancy concentration will increase after annealing at temperatures above 900ºC. The vacancy concentration in the 40 Ω cm B-doped diamond film decreases at annealing temperatures higher than 200ºC
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/02/20/transtech_doi~10.4028%252Fwww.scientific.net%252FMSF.607.149.pdf
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  • 19
    Electronic Resource
    Electronic Resource
    Influence of Sintering Temperature on Defects in Porous Silica Monoliths Studied by Positron Annihilation Techniques (2008)
    s.l. ; Stafa-Zurich, Switzerland
    Materials science forum Vol. 607 (Nov. 2008), p. 204-206 
    Details
    ISSN: 1662-9752
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Positron lifetime and coincidence Doppler broadening spectra for porous silica calcined at temperatures from 900 to 1500 oC have been measured. As the sintering temperatures increasing from 900 to 1000 oC, the height of the peaks of the ratio curves decrease, and the τ3 increases, which is due to the exclusion of the gas and the organic substance out of the cavities. As the sintering temperatures increasing from 1000 to 1250 oC, some of the defects were recovered, the grains of low quarts appearing and growing. This gives rise to the increase of the height of the peak of the ratio curve, and the decrease of lifetime (τ1,τ2 and τ3). As the sintering temperatures increasing from 1250 to 1500oC, the height of the peak of the ratio curve decreases, and the lifetime increases due to the phase transition of low quartz to cristobalite
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/02/20/transtech_doi~10.4028%252Fwww.scientific.net%252FMSF.607.204.pdf
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  • 20
    Electronic Resource
    Electronic Resource
    The Behavior of Oxygen and Defects in Si-Based Semiconductor Studied by Positron Annihilation Techniques (2008)
    s.l. ; Stafa-Zurich, Switzerland
    Materials science forum Vol. 607 (Nov. 2008), p. 131-133 
    Details
    ISSN: 1662-9752
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Slow positron beam and coincidence Doppler broadening techniques have been used to follow temperature-induced defects and structural changes in Cz-Si with an initial oxygen content of 1.1×1018 cm-3. Oxygen is recognized as a peak at about 11.85×10-3m0c on the ratio curves. For Cz-Si annealed at 480 oC/15h or 600 oC/15h, the ratio curves show the presence of vacancy-like defects, but they are not associated with oxygen. For Cz-Si annealed at 480 oC/15h, then followed by a 600 oC/15h heat treatment, the ratio curves show the signal of O atom. The ratio curves of Cz-Si, thermally treated by a two-step (480oC/15h + 600oC/15h) pre-annealing, followed by a one-step annealing under different hydrostatic argon pressures and annealed temperatures, also show a peak at 11.85×10-3m0c. The height of the peak varies with different samples. Experimental results indicate that the SiO2 film will form on the surface of Cz-Si after the heat treatment
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/02/20/transtech_doi~10.4028%252Fwww.scientific.net%252FMSF.607.131.pdf
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