ISSN:
0947-5117
Keywords:
Chemistry
;
Polymer and Materials Science
Source:
Wiley InterScience Backfile Collection 1832-2000
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Description / Table of Contents:
Inhibition of copper corrosion in sodium hydroxide solutionsThe authors have investigated the effect of 30 organic substances on the corrosion of copper in aqueous NaOH solutions (0.2, 0.5 and 1.0 n). The following substances were found to be effective inhibitors: resorcin, phloroglucin, pyragallol, tanni, β-naphthom, m and p-aminophenol, glucose, furfural, cyclohexanon, 8-oxychinolin, hydrazine sulphate, chinalizarine, hydrochinon, sodium diethyldithiocarbamate, sodium rhodizonate, gallocyanine and acriflavine. In most cases, the inhibition effect is due to a covering layer of reaction products of metal, inhibitor and hydroxide. The decisive factor is the stability of the covering layer with the different lye concentrations.
Notes:
Die Verfasser untersuchten die Wirkung von 30 organischen Substanzen auf die Korrosion von Kupfer in wäßrigen NaOH-Lösungen (0,2, 0,5, und 1,0 n). Als gute Inhibitoren erweisen sich Resorcin, Phologluchin, Pyrogallol, Tannin, β-Naphthol, m- und p-Animophenol, Glucose, Fufurol, Cyclohexanon, 8-Oxychinolin, Hydrazinsulfat, Chinalizarin, Hydrochinon, Natriumdiäthyldithiocarbanmat, rhodiozonsaures Natrium, Gallocynin und Acriflavin. Die Hemmwirkung beruht in den meisten Fällen auf Deckschicht-Bildung aus Reaktionsprodukten von Metall, Inhibitor und Hydroxid. Entscheidend ist die Stabilität der Deckschicht bei den verschiedenen Laugenkonzentrationen.
Additional Material:
1 Tab.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1002/maco.19660171006
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