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Digitale Medien

Co-curing studies of ethynyl terminated oligoimide and (methyl) nadicimide resins (1996)

Alam, Sarfaraz ; Kandpal, L. D. ; Varma, I. K.

Springer

Journal of thermal analysis and calorimetry 47 (1996), S. 685-695

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ISSN: 1572-8943

Schlagwort(e): DSC ; polymers ; resins ; TG

Quelle: Springer Online Journal Archives 1860-2000

Thema: Chemie und Pharmazie

Notizen: Abstract The paper describes the co-curing studies of ethynyl and ethenyl end-capped imide resins. The effect of composition and chemical structure of ethenyl end-capped resins (nadicimides) on thermal behavior of ethynyl end-capped resins was evaluated using DSC and thermogravimetric analysis. An increase in char yield was observed on co-curing of few resin formulations. A mechanism has been proposed to account for this observation.

Materialart: Digitale Medien

URL: http://dx.doi.org/10.1007/BF01981804

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