Library

feed icon rss

Your email was sent successfully. Check your inbox.

An error occurred while sending the email. Please try again.

Proceed reservation?

Export
  • 1
    Electronic Resource
    Electronic Resource
    Springer
    Journal of thermal analysis and calorimetry 47 (1996), S. 685-695 
    ISSN: 1572-8943
    Keywords: DSC ; polymers ; resins ; TG
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology
    Notes: Abstract The paper describes the co-curing studies of ethynyl and ethenyl end-capped imide resins. The effect of composition and chemical structure of ethenyl end-capped resins (nadicimides) on thermal behavior of ethynyl end-capped resins was evaluated using DSC and thermogravimetric analysis. An increase in char yield was observed on co-curing of few resin formulations. A mechanism has been proposed to account for this observation.
    Type of Medium: Electronic Resource
    Library Location Call Number Volume/Issue/Year Availability
    BibTip Others were also interested in ...
  • 2
    Electronic Resource
    Electronic Resource
    Springer
    Journal of thermal analysis and calorimetry 49 (1997), S. 367-373 
    ISSN: 1572-8943
    Keywords: curing ; epoxymodified resin ; endcapping
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology
    Notes: Abstract Polyimides have aromatic moieties in the backbone structure which are responsible for their increased thermal stability. If phosphorus is introduced in the main chain structure of polyimides, there is further improvement in the thermal stability. This has been proved by the work carried out in our group. The polyimide having amine termination can be used for crosslinking of epoxy resins. In the present study amine terminated phosphorus containing nadicimide were taken as curing agent for DGEBA resins. The curing characteristics of DGEBA resin were studied by DSC using different amounts of nadic endcapped phosphorylated amines. DSC thermogram showed the heat of polymerization was lower as compared to system cured with aromatic amines.
    Type of Medium: Electronic Resource
    Library Location Call Number Volume/Issue/Year Availability
    BibTip Others were also interested in ...
  • 3
    Electronic Resource
    Electronic Resource
    Weinheim : Wiley-Blackwell
    Angewandte Makromolekulare Chemie 236 (1996), S. 55-66 
    ISSN: 0003-3146
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Physics
    Description / Table of Contents: Eine Reihe aromatischer Imide mit Phosphinoxid-Einheiten im Molekülgerüst und Ethinyl-Endgruppen wurde durch Reaktion vom 3-Ethinylanilin mit Tris(3-aminophenyl)-phosphinoxide oder Bis(3-aminophenyl)-methylphosphinoxide und Pyromellitsäuredianhydrid oder 3, 3′,4, 4′-Benzophenontetracarbonsäuredianhydrid oder 4, 4′-Hexafluorisopropylidenbis(phthalsäureanhydrid) hergestellt. Die Struktur der Substanzen wurde mittels IR- und NMR-Spektroskopie sowie Elementaranalyse charakterisiert. Das thermische Verhalten wurde mittels Differentialkalorimetrie und Thermogravimetrie untersucht. Die Ethinyl-Endgruppen ermöglichen eine Härtung bei hohen Temperaturen. Die Zersetzungstemperaturen unter Stickstoff der gehärteten Harze liegen bei über 500°C. Bei 800°C beträgt der Aschegehalt zwischen 52% und 63,5%.
    Notes: A series of ethynyl-terminated aromatic imide monomers containing phosphine oxide in the backbone were synthesized by the reaction of tris(3-aminophenyl) phosphine oxide (TAP) or bis(3-aminophenyl)methyl phosphine oxide (BAP) with pyromellitic dianhydride (PMDA) or 3, 3′,4, 4′-benzophenone tetracarboxylic acid dianhydride (BTDA) or 4, 4′-perfluoroisopropylidenebis(phthalic anhydride), and 3-ethynyl aniline. Structural characterization was done by infrared, nuclear magnetic resonance spectroscopy and elemental analysis. Thermal characterization was done by differential scanning calorimetry and thermogravimetric analysis. The decomposition temperatures of cured resins were above 500°C in nitrogen atmosphere. Char yield at 800°C ranged from 52-63.5%.
    Additional Material: 8 Ill.
    Type of Medium: Electronic Resource
    Library Location Call Number Volume/Issue/Year Availability
    BibTip Others were also interested in ...
  • 4
    Electronic Resource
    Electronic Resource
    New York, NY [u.a.] : Wiley-Blackwell
    Journal of Applied Polymer Science 53 (1994), S. 1073-1081 
    ISSN: 0021-8995
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: This article describes the synthesis and characterization of several methyl nadimides endcapped resins based on tris(3-aminophenyl)phosphine oxide. These resins were prepared by reacting methyl-5-norbornene 2,3-dicarboxylic anhydride (methyl nadic anhydride) (MNA), pyromellitic dianhydride (PMDA)/3,3′,4,4′-benzophenone tetracarboxylic acid dianhydride (BTDA)/2,2-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride (6F), and tris(3-aminophenyl)phosphine oxide (TAP) in glacial acetic acid/acetone. Structural characterization of the resins was done by elemental analysis, IR, and 1H-NMR. Thermal characterization of uncured resins using DSC and TGA techniques revealed an exothermic transition accompanied by a weight loss in the temperature range of 200-350°C. Residual weight at 800°C in nitrogen was found to be 47-55%. Isothermal curing of the resins was done at 340°C for 1 h in an air atmosphere. The cured resins were stable up to 400 ± 20°C. © 1994 John Wiley & Sons, Inc.
    Additional Material: 5 Ill.
    Type of Medium: Electronic Resource
    Library Location Call Number Volume/Issue/Year Availability
    BibTip Others were also interested in ...
Close ⊗
This website uses cookies and the analysis tool Matomo. More information can be found here...