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  • 1
    Electronic Resource
    Electronic Resource
    Co-curing studies of ethynyl terminated oligoimide and (methyl) nadicimide resins (1996)
    Springer
    Journal of thermal analysis and calorimetry 47 (1996), S. 685-695 
    Details
    ISSN: 1572-8943
    Keywords: DSC ; polymers ; resins ; TG
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology
    Notes: Abstract The paper describes the co-curing studies of ethynyl and ethenyl end-capped imide resins. The effect of composition and chemical structure of ethenyl end-capped resins (nadicimides) on thermal behavior of ethynyl end-capped resins was evaluated using DSC and thermogravimetric analysis. An increase in char yield was observed on co-curing of few resin formulations. A mechanism has been proposed to account for this observation.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF01981804
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