Electronic Resource
Woodbury, NY
:
American Institute of Physics (AIP)
Applied Physics Letters
69 (1996), S. 236-238
ISSN:
1077-3118
Source:
AIP Digital Archive
Topics:
Physics
Notes:
Silicon carbide plasma etching results are reported. Etching experiments are performed in a distributed electron cyclotron resonance reactor, using a SF6/O2 gas mixture, on both 3C- and 6H-SiC. A special interest has been given to the slope of the etched sidewalls. Slopes between 30° and 80° have been achieved by varying selectivities between SiC and the SiO2 masking layer. Two parameters have been investigated to modulate selectivity: bias voltage and O2 additive flow. A wide range of selectivities (from 1 to 6.5) has been obtained for suitable etch rate (100 to 270 nm/min) with very smooth surfaces. © 1996 American Institute of Physics.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1063/1.117935
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