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  • 1
    Electronic Resource
    Electronic Resource
    Springer
    Il nuovo cimento della Società Italiana di Fisica 11 (1989), S. 583-613 
    ISSN: 0392-6737
    Keywords: Surface conductivity
    Source: Springer Online Journal Archives 1860-2000
    Topics: Physics
    Description / Table of Contents: Riassunto La diminuzione della luminescenza (vicino al band gap) nel GaAs durante illuminazione continua a bassa intensità e a temperatura ambiente è quantitativamente spiegata da un modello in cui le reazioni tra i difetti reticolari in prossimità della superficie sono promosse dall’intrappolamento e dalla ricombinazione delle cariche elettriche in centri di ricombinazione senza emissione luminosa. Il modello che proponiamo spiega accuratamente le osservazioni sperimentali: la velocità di diminuzione della luminescenza stessa, la sua dipendenza dall’intensità dell’illuminazione esterna e dalla temperatura e la mancata diminuzione della luminescenza quando il GaAs è impiantato a bassa profondità.
    Abstract: Резюме Количественно описывается деградация фото-люминесцентного излучения вблизи запрещенной зоны в GaAs со временем экспозиции c.w.-лазерным возбуждением малой мощности при комнатной температуре с помощью модели, которая основана на реакции дефектов, которые стимулируют захват и рекомбинацию носителей в нерадиационных узлах рекомбинации. Предложенная модель описывает наблюдаемую интенсивность деградации, зависимость деградации от мощности и температуры, а также отсутствие деградации на поверхности в случае неглубокой имплантации ионов.
    Notes: Summary Degradation of near band gap photo-luminescence emission in GaAs with time of exposure to low power, c.w. laser excitation at room temperature is quantitatively described by a model based on defect reactions that are promoted by trapping and recombination of excess carriers at nonradiative recombination sites. The proposed model accurately describes the observed degradation rate, its power and temperature dependence, as well as the absence of degradation at a surface with shallow ion implantation.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 54 (1989), S. 1696-1698 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Enhancement of Schottky barrier height of Ti-Pt-Au on n-type GaAs was obtained by heavily (2×1018 cm−3) counter doping the near-surface region of the substrate. The p-type region was produced by recoil implantation of Mg from a Mg thin film (300 A(ring)) irradiated by a 60 keV As+ beam. The film was subsequently chemically etched. The recoil-implanted samples showed an enhancement of 140 meV in the Schottky barrier height following rapid thermal annealing in an AsH3 furnace at 850 °C for nominal zero second.
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 64 (1988), S. 2113-2121 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: To investigate the effects of microstructure of the Schottky characteristics of WSix contacts to n-type GaAs, cross-sectional transmission electron microscopy, x-ray diffraction, and secondary-ion mass spectrometry have been used to study the interfacial and bulk film microstructures. The barrier heights and ideality factors of WSi0.1 and WSi0.6 contacts were obtained by forward current-voltage and capacitance-voltage measurements. These Schottky characteristics were found to be unrelated to the bulk film microstructure, but closely related to the interfacial microstructure at the WSix/GaAs interfaces. Both the WSi0.1/GaAs and WSi0.6/GaAs interface morphologies were observed to be stable and remain smooth during annealing at 800 °C for 10 min, while a rough interface with W protrusions and Ga and As out-diffusion was observed in two-layer W/WSi0.6 contacts. The stability of the WSix interfacial microstructure is suggested to depend on both the chemical stability of the WSix films with GaAs and the intervening oxides between WSix and GaAs. Nontrivial amounts of W and Si were observed to diffuse from the WSi0.1 film into the GaAs substrate during annealing at 800 °C for 10 min. Although these in-diffused impurities in the GaAs substrate do not seem to affect the Schottky characteristics after the 800 °C annealing, they could be a potential problem in long-term stability. Of the three WSix film compositions, the single-layer WSi0.6 films were found to have the least W and Si in-diffusion and thus the best thermal stability.
    Type of Medium: Electronic Resource
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