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  • 1995-1999
  • 1990-1994  (7)
  • 1990  (7)
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  • 1995-1999
  • 1990-1994  (7)
Year
  • 1
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Tungsten was deposited from a gas mixture of hydrogen and tungsten hexafluoride onto a polycrystalline silicon gate structure in a chemical vapor deposition system. During the deposition process fluorine was also deposited as an undesired impurity. In order to remove the fluorine, heat treatments in the temperature range 550–1050 °C were performed in a hydrogen atmosphere. By this treatment it is possible to form volatile hydrofluoric acid and hence remove fluorine from the structure. Nuclear-resonance-broadening technique and secondary ion mass spectrometry were used for the analysis of fluorine. Fluorine was detected in all the samples except for the sample heat treated at 1050 °C. Moreover, etching of the polycrystalline silicon was observed. The gettering of fluorine, the etching of silicon and the observed formation of tungsten disilicide at 650 °C are discussed with respect to conceivable mechanisms. A thermodynamic study supporting the interpretations is also included.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 68 (1990), S. 6213-6223 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The process of atomic transport in the silicide during oxidation of silicide layers formed on Si substrates has been analyzed by means of implanted inert markers. The results confirm that CrSi2 oxidizes via the diffusion of Cr atoms towards the Si substrate, and reveal that the same type of transport occurs in VSi2, which is in opposition to the growth of these disilicides that proceeds via Si motion. Moreover during the oxidation of both VSi2 and CrSi2, the diffusing metal atoms are accompanied by a large proportion of the Si atoms from the silicide which also diffuse towards the substrate. Thus, the experimental evidence now available reveals that all the silicon-rich silicides, in increasing atomic numbers from TiSi2 to NiSi2, oxidize with the formation of metal-free SiO2 in a process that involves the diffusion of both metal and Si regardless of the predominant moving species during silicide formation. In CrSi2, VSi2, as well as TiSi2, with similar structures, examination of the structure shows that diffusion should occur via a vacancy mechanism. The thermodynamic conditions that prevail during oxidation lead indifferently to metal diffusion in one direction or Si diffusion in the other. Any selection between one mechanism or the other has to be dictated by kinetic conditions relating to the relative mobilities of the two atomic species. What is known about this is discussed in detail. Finally it is proposed that the observed dual, parallel diffusion of metal and Si, results from the very nature of the oxidation process which modifies the chemical potential of the atoms at the surface being oxidized. Thus is created a force that drives some of the atoms away from the surface, into the inside of the samples. The best known example of this behavior is the often observed "injection'' of interstitials during Si oxidation, but a similar process is at work in silicide oxidation, with somewhat similar results. Volume effects, thought to play an important role in solid state chemical reactions, are remarkably well illustrated by the oxidation of silicides.
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 68 (1990), S. 5133-5139 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The mechanism of atomic transport inside the silicide during thermal oxidation of silicide layers on Si substrates has been analyzed by means of inert gas markers implanted in TiSi2, Mn11Si19, FeSi2, and NbSi2. Oxidation was carried out in dry oxygen. The marker displacement reveals that the growth of metal-free SiO2 over the first three of these compounds occurs via the reverse motion of metal atoms, from the silicide/oxide to the silicon/silicide interface, rather than through the direct diffusion of Si atoms from the substrate to the oxide. Moreover, analysis of the marker position indicates that the total amount of Si between the marker and the free surface decreases during oxidation, as had been previously observed in the oxidation of NiSi2, CoSi2, and CrSi2. Although this could occur via the formation and evaporation of SiO, it is believed that the loss of Si is due to the motion of Si atoms, also in the "reverse'' direction as for the metal atoms, across the silicide layer. The experiment conducted with NbSi2 shows that this silicide oxidizes via the direct motion of Si from the substrate to the oxide as anticipated. With TiSi2 the initial state of oxidation occurs as described, but the experimental observations imply that thick oxide layers grow via the direct motion of Si from the substrate to the oxide.
    Type of Medium: Electronic Resource
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  • 4
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 56 (1990), S. 2519-2521 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: We demonstrate remarkably rapid oxidation of (100) silicon at room temperature catalyzed by the presence of Cu3Si. Thermal oxidation of Si is normally carried out at temperatures above 700 °C. Oxidation of many metal silicides occurs more rapidly than that of Si, but under controlled conditions results in a surface layer of SiO2. In contrast, the oxidation process described here produces a thick layer of SiO2 underneath the copper-rich surface layer. The SiO2 layer grows spontaneously to over 1 μm in thickness in several weeks in air at room temperature. Analysis by Rutherford backscattering, Auger electron spectroscopy, cross-sectional transmission electron microscopy, and scanning electron microscopy reveals the presence of Cu3Si at the buried SiO2/Si interface, epitaxially related to the underlying Si substrate. Catalytic action by this silicide phase appears responsible for the unusual oxidation process.
    Type of Medium: Electronic Resource
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  • 5
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 67 (1990), S. 241-246 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The structure of zirconium silicide (ZrSi2, orthorhombic C49; a=0.369 nm, b=1.47 nm, c=0.366 nm) thin films has been investigated by high-resolution electron microscopy. The crystals are heavily faulted in the 010 plane with an average distance between faults of 1.6 nm. The fault has been found to be a π/2-rotation twin around the b axis, the habit plane lying between two silicon layers. The crystals contain an equal number of 〈a〉- and 〈c〉-oriented slabs, giving rise to a strained lattice with an average a=c lattice parameter. On the basis of an elastic calculation, the fault energy is evaluated to be of the order of 5 ergs cm−2. This low energy explains the tendency to form polytypes which are mostly disordered, although some ordered sequences are favored at short range.
    Type of Medium: Electronic Resource
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  • 6
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Isotope separation resulting from the diffusion-controlled growth of reacted films has been proposed as a tool to elucidate the diffusion mechanism which controls the growth. A "reverse'' isotope separation would be indicative of a grain boundary diffusion mechanism. Such an isotope separation has been studied by secondary ion mass spectrometry (SIMS) during the growth of nickel silicides (Ni2Si and NiSi) for different experimental growth conditions: silicon substrate orientation, temperature of reaction, and silicide thickness. In every case, the isotope separation resulting from the diffusion-controlled growth is below the accuracy of the SIMS measurements. This is consistent with the fact that isotope effects are usually very small. The difficulties of such studies and the multiple SIMS artifacts encountered at interfaces—matrix effects, variations in the sputtering yield, mass interferences, and sequential acquisition of data—are analyzed in detail. They are found to be quite important in the case of nickel silicides and may lead to erroneous conclusions. A model for isotope separation during layer growth, which had been previously proposed, is shown to provide overoptimistic estimates of the magnitude of the anticipated effect.
    Type of Medium: Electronic Resource
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  • 7
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 67 (1990), S. 2410-2414 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The behaviors of metallic bilayers, chromium-molybdenum and chromium-tungsten, on (100) silicon during isochronal annealing have been studied by Rutherford backscattering of 2.3-MeV 4He+ ions and x-ray diffraction. These experiments were conducted with the aim of obtaining information about the respective mobilities of silicon and metal atoms in the different silicides through a comparison of the temperatures at which the silicides form and those at which they mix (through metal-atom diffusion). The results confirm that the respective silicides form via silicon-atom motion and that the mobilities of the metal atoms are markedly smaller than that of the silicon atoms.
    Type of Medium: Electronic Resource
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