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  • 1
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Review of Scientific Instruments 71 (2000), S. 1032-1035 
    ISSN: 1089-7623
    Source: AIP Digital Archive
    Topics: Physics , Electrical Engineering, Measurement and Control Technology
    Notes: An ion accelerator, purpose built to produce beams at energies down to 10 eV with current densities in the 10–100 μA cm−2 range, is described. Fitted with dual ion source assemblies, the machine enables ultralow energy ion implantation and the growth of films and multilayers to be carried out under highly controlled conditions. The accelerator delivers ion beams into an ultrahigh vacuum chamber, containing a temperature controlled target stage (range −120 to +1350 °C), where they are used to study the fundamental physics relating to the interaction of ultralow energy ions with surfaces. This knowledge underlies a wide range of ion-beam and plasma-based technologies and, to illustrate its importance, results are presented from investigations designed to determine the optimum conditions for the growth of diamond-like and aluminum films by ion-beam deposition and the formation of ultrashallow junctions in semiconductors by 2.5 keV As+ implantation. The later investigation shows how transient arsenic diffusion, which occurs during post-implant thermal processing, can be controlled by manipulating the substrate temperature during implantation. © 2000 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 89 (2001), S. 7074-7076 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Interdiffusion and intermixing have been examined in Fe/Si trilayers prepared with ions of different energies, using the direct ion beam deposition technique. Isotope-pure layers were deposited and spin-polarized neutron reflectivity used to determine the role of Fe diffusion in iron silicide formation. It was found that a nonmagnetic iron silicide was formed that contained Fe from both the top and bottom layers in the trilayer, suggesting complete diffusion across the spacer region. Electron microscopy observations revealed the presence of an iron silicide phase and crystalline interface layers in films prepared with low energy ions (30 eV), while mixed and amorphous-like regions were found at higher ion energies (100 eV). © 2001 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 76 (2000), S. 571-573 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The redistribution of As during high-temperature annealing has been investigated as a function of the Si(100) substrate temperature (−120 °C, +25 °C, and +300 °C) during 2.5 keV implantation (to 1.5×1015atoms/cm2). Each implant produced a damaged near-surface region, the extent of which varied with implant temperature. Samples implanted at each temperature were annealed in a nitrogen ambient with a few percent oxygen for 10 s at 550, 925, and 975 °C. The changes in implant damage and dopant distributions both prior to and following annealing were investigated using medium energy ion scattering and secondary ion mass spectrometry. Transient enhanced diffusion (TED) of the dopant was observed for all implant temperatures after 925 °C annealing with the 25 °C implant showing the deepest diffusion. Between 925 and 975 °C annealing, the As diffusion rate in the 300 °C exceeded that of the 25 °C implant. Significantly, the −120 °C implant displayed less TED of As compared to the higher temperature implants following annealing at 975 °C. The results indicate that the diffusion is affected by the nature of the post-implant damage and the high arsenic concentrations. © 2000 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 4
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 58 (1991), S. 1626-1628 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Ultrashallow boron-doped junctions in silicon have been investigated using secondary-ion mass spectroscopy and four-point probe technique. The junctions were obtained by implanting B+ ions into n-type Si(100) at 200 eV to doses of 1.5×1014 and 6×1014 cm−2 and at substrate temperatures in the range 30–900 °C during B implantation. Both post-implantation in situ annealing by electron bombardment heating and rapid thermal annealing in a separate system were employed. The results show that sub 20 nm p+n junctions are obtained without the need for further processes such as preamorphization and high-temperature annealing.
    Type of Medium: Electronic Resource
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  • 5
    Electronic Resource
    Electronic Resource
    Chichester [u.a.] : Wiley-Blackwell
    International Journal of Numerical Modelling: Electronic Networks, Devices and Fields 11 (1998), S. 189-205 
    ISSN: 0894-3370
    Keywords: Engineering ; Numerical Methods and Modeling
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Electrical Engineering, Measurement and Control Technology
    Notes: The atomic mixing model that forms the basis of the IMPETUS software is described in detail. The model simulates the mixing and particle emission that occurs when a solid is bombarded with energetic particles, such as in SIMS or SNMS. The methods employed for computing the deposition of the bombarding particles and their energies along with the modelling of the particle yield and the surface recession speed are described.The material volume concentrations are governed by a set of partial differential equations. A description of the finite element method that is employed for their solution is given. Results from the application of IMPETUS II to a number of typical structures are given. © 1998 John Wiley & Sons, Ltd.
    Additional Material: 13 Ill.
    Type of Medium: Electronic Resource
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  • 6
    Electronic Resource
    Electronic Resource
    Chichester [u.a.] : Wiley-Blackwell
    Surface and Interface Analysis 9 (1986), S. 309-317 
    ISSN: 0142-2421
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Physics
    Notes: The application of static, dynamic and imaging SIMS to semiconductor starting materials and devices is discussed. Static SIMS is used to examine the effect of various chemical preparation methods on the surface of the III-V compounds InAs, InP and GaAs prior to epitaxial growth of device structures. Dynamic SIMS profiles from a superlattice structure involving alternative GaAlAs - GaAs layers are presented along with an examination of the factors affecting depth resolution for low-dimensional devices. Finally the importance of imaging or scanning SIMS for chemical mapping and microanalysis of final device structures is discussed.
    Additional Material: 8 Ill.
    Type of Medium: Electronic Resource
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  • 7
    ISSN: 0142-2421
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Physics
    Notes: Delta-doped structures represent a powerful class of test structures to investigate the experimental and fundamental factors limiting the depth resolution obtainable in SIMS sputter depth profiling.In this work, theoretical studies of the effects on the broadening of an Si delta spike in GaAs as a function of the energy (1.4-4.4 keV) and angle of incidence (2°, 45° and 60° off-normal) of the O2 sputter probe beam have been compared with recent experimental data. The theoretical calculations were carried out using the newly developed IMPETUS computer code, which simulates the depth profiling process by taking into account the combined effects of ballistic mixing (treating collisional mixing as a diffusion process), projectile incorporation into the matrix and sputtering. All of these are processes that always occur in any practical sputter depth profiling situation.The IMPETUS model can reproduce low-energy Si depth profiles with great accuracy by using the well-established TRIM calculated range, energy deposition and sputtering data and by making reasonable assumptions for the threshold energy for diffusion in addition to assuming a beam- and sputter statistics-induced surface microtopography, which is described by a Gaussian area versus height distribution having a standard deviation σ = 0.8 nm. Significantly, it is shown that the effects of these parameters on the shape of the sputter profile are largely independent, with σ (accounting for microroughness) mainly affecting the leading edge and the threshold energy (determining mixing processes) the trailing edge of the sputter profile. Good agreement on the energy dependence of the broadening is also obtained. The expected improvement in depth resolution with increasing off-normal bombardment angle is confirmed and can be quantified. The error in the experimental depth scale calibration based on a constant sputter rate, ignoring transient sputtering, is evaluated. Finally, the sputter depth profile observed for an Si delta spike in GaAs subjected to thermal annealing during growth by molecular beam epitaxy (MBE) can be reproduced accurately by considering diffusion broadening of the initial spike followed by a sputter profiling simulation.
    Additional Material: 5 Ill.
    Type of Medium: Electronic Resource
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  • 8
    Electronic Resource
    Electronic Resource
    Chichester [u.a.] : Wiley-Blackwell
    Surface and Interface Analysis 14 (1989), S. 393-400 
    ISSN: 0142-2421
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Physics
    Notes: A system of optics for electron impact post-ionization sputtered neutral mass spectrometry (SNMS) has been designed and constructed. The design is based on an existing set of ‘Wittmaack-box’-type secondary ion mass spectrometry (SIMS) optics, commercially operational at UMIST. The system operates with ‘state of the art’ efficiency in the SNMS mode (a post-ionization efficiency of 10-3-10-4), without significant degradation of the SIMS operation.The development stages described demonstrate many of the practical problems in the design of an electron beam post-ionizer, involving characterization of the energy analyser used and the conditions from the optics for best secondary ion and residual gas suppression in the SNMS mode.Calibration of the SNMS mode of the system has been undertaken using standardized samples, cross-calibrated by optical emission spectroscopy. (Typical spectra of standard stainless steel and some CuZn and CuAl alloys are presented.) These studies revealed a reproducibility of better than 10% in the relative sensitivity factors, which have been assigned to several elemental species. From these studies, a detection limit of better than 0.01 at.% was obtained for most elemental species under 10 μA Ar+ primary beam bombardment.The effects of surface roughness on the efficiency of sputtered neutral collection are reported. Studies of CuZn alloys have revealed effects on the absolute calibration and on data analysis of multicomponent materials where the individual components have differing sputter yields. This study also revealed SNMS to be a useful tool in the measurement of the sputter yields of composite materials. Studies of InAsxP1-x have been used to demonstrate the linearity of SNMS for quantitative analysis, as well as revealing the homogeneity of the layers analysed.
    Additional Material: 6 Ill.
    Type of Medium: Electronic Resource
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  • 9
    ISSN: 0142-2421
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Physics
    Notes: Fast atom bombardment mass spectrometry permits the detection of secondary ions from surfaces of insulator materials without the necessity for charge neutralization of the surface by electron bombardment. It thus opens the possibility of routine mass spectral analysis of surfaces yielding data concerning not only their elemental composition but also their chemical structure. The possibilities are illustrated from examples of the analysis of glass and catalyst surfaces.
    Additional Material: 15 Ill.
    Type of Medium: Electronic Resource
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  • 10
    ISSN: 0749-503X
    Keywords: FLO1 ; flocculation ; Saccharomyces cerevisiae ; Life and Medical Sciences ; Genetics
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Biology
    Notes: The cloned part of the flocculation gene FLO1 of Saccharomyces cerevisiae (Teunissen, A.W.R.H., van den Berg, J.A. and Steensma, H.Y. (1993). Physical localization of the flocculation gene FLO1 on chromosome I of Saccharomyces cerevisiae, Yeast, in press) has been sequenced. The sequence contains a large open reading frame of 2685 bp. The amino acid sequence of the putative protein reveals a serine- and threonine-rich C-terminus (46%), the presence of repeated sequences and a possible secretion signal at the N-terminus. Although the sequence is not complete (we assume the missing fragment consists of repeat units), these data strongly suggest that the protein is located in the cell wall, and thus may be directly involved in the flocculation process.
    Additional Material: 3 Ill.
    Type of Medium: Electronic Resource
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