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  • 1
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 84 (1998), S. 2565-2570 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Deep level transient spectroscopy has been used to investigate the electronic properties and isochronal annealing behavior of defects formed in epitaxially grown n-Si by 1 keV He-, Ne-, and Ar-ion bombardment. Similarities between peaks found for the different bombardment gases suggested that they were from structurally related defects. Two families of such related defects were observed in the unannealed samples. Annealing data revealed additional peaks and enabled another defect family formed above 400 °C to be identified. The energy levels and capture cross sections have been determined for three new families of related defects. The defect families were presumed to be either complex vacancy clusters or hydrogen related. © 1998 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 88 (2000), S. 5255-5261 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: We have recently shown [P. N. K. Deenapanray et al., Appl. Phys. Lett. 77, 626 (2000)] that four electron traps S1(Ec−0.23 eV), S2(Ec−0.46 eV), S3(Ec−0.72 eV), and S4(Ec−0.74 eV) are introduced in rapid thermally-annealed (RTA) SiO2-capped n-type GaAs epitaxial layers. In the present study, we have used deep level transient spectroscopy to investigate the electronic and annealing properties of these deep levels. The electron emission kinetics of S1 is enhanced by an electric field, and the activation energy of S1 decreases linearly from ∼233 to ∼199 meV when the field is increased from 7.5×104 to 13.4×104 V cm−1. The intensities of S1, S2, and S4 show Arrhenius-like dependencies on the RTA temperature, which relate to the outdiffusion of Ga atoms into the SiO2 layer. The intensity of S2(VGa–SiGa) also increases exponentially with the square of the annealing time for RTA at 800 °C. Isochronal annealing experiments show that S1 and S2 are thermally stable below 500 and 400 °C, respectively. S4, which is a member of the EL2 family, is stable up to 600 °C. Secondary defects are introduced during isochronal annealing above 400 °C, and some of these defects are thermally stable at 600 °C. © 2000 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 75 (1999), S. 2424-2426 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The effect of oxygen implanted into epitaxial Si layers on the ability to getter Au to nanocavities, previously formed by H implantation and annealing, has been studied by Rutherford backscattering, transmission electron microscopy, and secondary ion mass spectrometry. We demonstrate that oxygen is gettered to cavities during extended annealing at 950 °C. Furthermore, the arrival of oxygen at cavities is not only shown to inhibit subsequent attempts to getter Au to cavities, but also to eject chemisorbed Au from the cavity walls. Similar behavior is observed in Czochralski Si, where the source of oxygen is within the Si itself. © 1999 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 4
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 76 (2000), S. 837-839 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The quality of spin-on silica films prebaked at different temperatures has been studied using Fourier transform infrared spectroscopy, spectroscopic ellipsometry, and P-etch [HF(40%):HNO3(70%):H2O=3:2:60] measurements. Low-temperature photoluminescence (PL) was performed on GaAs/AlGaAs quantum-well (QW) structures encapsulated by the same films. For all the prebaked films, not only the Si–O–Si peaks, but also OH-related peaks were detected in the IR spectra. After annealing at 950 °C for 60 s, almost all OH-related peaks disappeared. Spectroscopic ellipsometry modeling and P-etch measurements showed that the porosity of high-temperature (〉300 °C) baked samples was similar, and was significantly higher than the low-temperature (210 °C) baked sample. The same trend was observed in the PL energy shifts from the GaAs/AlGaAs QWs, indicating a direct correlation between the film quality and quantum-well intermixing. © 2000 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 5
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 77 (2000), S. 696-698 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Defects created in rapid thermally annealed (RTA) SiO2-capped epitaxial GaAs layers grown by metal-organic chemical vapor deposition have been investigated by deep level transient spectroscopy. RTA introduced four electron traps S1 (Ec−0.23 eV), S2 (Ec−0.46 eV), S3 (Ec−0.72 eV), and S4 (Ec−0.74 eV). S1 may be the so-called EL9 defect. We propose that S2 is a defect complex involving the Ga vacancy and Si dopant atoms, VGa–SiGa, and associate it with the EL5. S2 is introduced almost uniformly within the first 0.8 μm below the surface with an activation energy of 4.4 eV. S4 is most probably one of the EL2 family. The concentration of S4 decreased exponentially below the surface with a characteristic decay length ∼0.2 μm. The activation energy for the introduction of S4 is 2.5 eV. © 2000 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 6
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 73 (1998), S. 1287-1289 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: High-resolution Rutherford backscattering and channeling has been used to study the formation of surface nitrides during room temperature bombardment of silicon with nitrogen in a secondary ion mass spectrometry system. Slightly N-rich silicon nitride is formed at angles of incidence (to the surface normal) 〈27°. Nitrogen buildup profile exhibits several intense oscillations before reaching a constant level. Implanted metals were found to show little tendency for segregation under nitrogen bombardment even when a silicon nitride layer forms at the surface. © 1998 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 7
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 83 (1998), S. 4075-4080 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The modification in the G-line (969.5 meV) and the C-line (789.4 meV) photoluminescence (PL) intensities were studied as a function of the fluence, energy, and mass of the bombarding ions (He, Ne, Ar, and Kr). The intensities of the luminescent lines induced by 1 keV Ne bombardment were found to decrease with increasing dose after reaching a maximum at about 1×1012 ions/cm2. Considerable reductions in the intensities of the G- and C-lines were also recorded during bombardment using heavier noble gas ions and they have been attributed to the higher rates of nuclear energy deposition with increasing bombarding ion mass. The incident ion energy at which the PL intensities of the spectral lines reached their maximum values was found to be dependent on the ion mass and fluence. We have explained the decrease in PL intensities of the G-line and C-line to be due to the introduction of increased amounts of nonradiative recombination centers with increasing incident ion dose and mass. Further, the integral sum of defects induced during bombardment as a function of projected ion range and excitation depth of the Ar-ion laser has been used to qualitatively describe the decrease in the intensities of the two lines. © 1998 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 8
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 83 (1998), S. 5576-5578 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Epitaxially grown n-Si was bombarded with low-energy (1 keV) He ions. Deep level transient spectroscopy revealed that this introduced four prominent defects with energy levels at 0.14, 0.20, 0.30, and 0.55 eV, respectively, below the conduction band. The electronic properties and annealing behavior of these defects are different to those of the main defects, namely, divacancies (V2) and vacancy-phosphorous centers, observed after 5.4 MeV He-ion bombardment of the same material. We propose that, except for the defect with an energy level at Ec−0.14 eV, the defects introduced by 1 keV He-ion bombardment of n-Si may be related to: (1) vacancy clusters larger than divacancies, or (2) incorporation of He and H into V2 or higher-order vacancy clusters. © 1998 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 9
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 84 (1998), S. 1973-1976 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: We employed capacitance-voltage (C–V) measurements to determine the free-carrier concentration changes in n-GaAs after processing it in a He plasma, and deep-level transient spectroscopy (DLTS) to study the electrical properties of the plasma-induced defects. C–V measurements indicated that He-plasma processing resulted in a strong carrier reduction up to 1 μm below the GaAs surface. DLTS showed that He-ion processing introduced several prominent defects, including the frequently studied radiation-induced defects E1 and E2, associated with VAs. Current-voltage measurements demonstrated that the He-plasma processing inhibits the fabrication of high barrier Schottky diodes on n-GaAs. © 1998 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 10
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 71 (1997), S. 668-670 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: We employed deep-level transient spectroscopy to determine the electrical properties of defects introduced in epitaxially grown n-GaAs during dry etching in a SiCl4 plasma at different rf powers and plasma pressures. We found that SiCl4 etching introduced two prominent defects, one of which is metastable. Current–voltage measurements demonstrated that high barrier Schottky barrier diodes can be fabricated on SiCl4-etched n-GaAs surfaces for all power and plasma pressure conditions investigated. The defect concentration decreased and the diode quality improved when etching at lower rf power and higher plasma pressure. © 1997 American Institute of Physics.
    Type of Medium: Electronic Resource
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