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  • 1985-1989  (15)
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Year
  • 1
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 64 (1988), S. 2973-2980 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The diffusion of several elements implanted into layers of CoSi2 with a nominal thickness of 800 nm, grown by metal-silicon reaction, has been studied by secondary ion mass spectroscopy. Boron has by far the highest mobility. It is totally homogenized by heat treatment for 0.5 h at 800 °C; it displays evidence of grain-boundary diffusion at 400 °C and of lattice diffusion at 450 °C. The next group of elements, gallium, phosphorus, and germanium (used as a tracer in lieu of a silicon isotope) diffuse distinctly less rapidly, and remain nonhomogenized after annealing at 800 °C. The lattice diffusion of arsenic and antimony is not detectable (by the means presently used), even after heat treatment at the same relatively high temperature. Low-temperature effects, and effects far away from the implanted region, are dominated by grain-boundary diffusion. The lattice diffusion increases from boron to phosphorus and germanium, with activation energies determined to be 2.0 and 2.7 eV for boron and phosphorus, respectively. The results are discussed by comparison with those previously obtained with TiSi2.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 54 (1989), S. 228-230 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The reaction of Ti with pure Ge and several Ge-Si alloys has been investigated with the double aim of understanding the reaction with Ge and of throwing some light on the still vexing problem of the Ti-Si reaction. With pure Ge one observes first of all the formation of Ti6Ge5 until complete consumption of the Ti is present. This is followed by the clearly identifiable nucleation of TiGe2, initially forming islands that grow laterally. With a 50-50 (at. %) alloy of Si and Ge, one still observes distinct growth steps, but there is overlap between the growth of the initial phase, and the nucleation and growth of Ti(Ge,Si)2.
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 55 (1989), S. 1804-1804 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Type of Medium: Electronic Resource
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  • 4
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 65 (1989), S. 567-574 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Oxygen behavior during the formation of CrSi2 and TiSi2 was studied using 16O(α,α)16O resonant scattering and mass dispersive recoil detection analysis. The Ti and Cr films were deposited by e-beam evaporation in a cryopumped system. The oxygen content in the films was varied by evaporating at different pressures. The silicide films were formed by solid-solid reaction of the metal layers with the silicon substrate, and the annealing conditions were such that both partly and fully reacted silicides were obtained. The extent of the silicide formation was monitored by backscattering spectrometry. In the case of CrSi2, oxygen was found to be uniformly distributed throughout the silicide layer after annealing. For the Ti/TiSi2 system, however, oxygen seems to have preferentially remained in the Ti layer during the silicide growth, and its final distribution was confined in a region in the silicide close to the surface. It was also observed in the latter case that silicon diffused to the surface at the initial stage of annealing. A model based on the Nernst–Einstein equation is proposed to provide a general explanation for the oxygen behavior in metal/silicon systems. In addition, it was shown that oxygen which was initially in the form of metal oxides and in solid solution had been transformed into SiO2 after the silicide formation. Oxygen loss is observed for all samples, and increases with the extent of annealing.
    Type of Medium: Electronic Resource
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  • 5
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 59 (1986), S. 3458-3466 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The formation of Ni3Si2 from the reaction of Ni2Si with NiSi, and that of Pt6Si5 from the reaction of Pt2Si with PtSi have been investigated by Rutherford backscattering, x-ray diffraction, resistance measurements, and optical and electronic microscopy. Standard x-ray diffraction patterns were calculated for Pt6Si5 and for the high-temperature form (hexagonal) of Pt2Si. These are shown to match experimental diffraction patterns. Both Ni3Si2 and Pt6Si5 form quite suddenly (at 470 and 535 °C, respectively) according to the pattern of nucleation-controlled reactions which are anticipated when the free energies of formation of the new phases are sufficiently small. These observations are discussed with respect to the absence of both Ni3Si2 and Pt6Si5 from the sequence of phases which form when Ni and Pt thin films react with Si. Resistivity measurements are reported for Ni3Si2, Pt6Si5, and for the two forms (low and high temperature) of Pt2Si.
    Type of Medium: Electronic Resource
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  • 6
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 63 (1988), S. 5335-5345 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Gallium, Sb, and Ge were implanted into thick (about 400 nm) layers of TiSi2 prepared by metal-silicon reaction. The diffusion of the implanted atoms was analyzed by means of secondary ion mass spectrometry. Gallium was introduced because a former study had shown that the usual p-type dopant B does not diffuse in TiSi2. Germanium was used in lieu of a Si tracer. Its diffusion characteristics are compared to those of P and As (as well as Si) which had been investigated previously. Germanium and Ga diffuse readily above 600 °C, but Sb does not. Its diffusion appears to be limited to grain-boundary effects. Accumulations of the diffusing atoms are observed (except for Sb) at the silicide-silicon interface. These are due to kinetic effects, namely fast diffusion at grain boundaries and interfaces, rather than to real adsorption which is an equilibrium condition. Because diffusion in intermetallic compounds has been shown to be significantly affected by variations in stoichiometry, experiments were conducted with films implanted not only with foreign atoms but with Ti as well. These did not lead to significantly different observations.
    Type of Medium: Electronic Resource
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  • 7
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 62 (1987), S. 2972-2980 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: In situ ellipsometry was used to investigate the oxidation behavior of a group of silicides, CoSi2, CrSi2, Ir3Si5, Ru2Si3, and WSi2, on single-crystal silicon substrates. These observations were complemented by ex situ ellipsometric measurements on these silicides, as well as on Mn11Si19, MoSi2, NiSi, NiSi2, and ReSi2. Refractive index measurements necessary for the oxide thickness calculations were made using ellipsometry on the bare silicide surfaces. Three regimes of oxidation behavior were identified: one group of silicides oxidized much faster than Si itself, CoSi2, CrSi2, NiSi, and NiSi2; another group was intermediate in oxidation rate between the fast group and Si at low temperature, typically comprising the refractory silicides MoSi2 and WSi2; the third group oxidized at about the same rate as Si and included the semiconducting silicides Ir3Si5, ReSi2, and Ru2Si3. The oxidation of Mn11Si19 led to an oxide containing a small amount of Mn. The oxidation rates of the silicides scale with both the reported carrier concentrations and the measured absorption index. Thus, the electronic properties of the silicides are thought to be responsible for the oxidation behavior. Buffered HF etch rates of the oxides grown on silicides indicate that the oxides grown on the rapidly oxidizing silicides are less dense than the oxides on the intermediate and slowly oxidizing silicides.
    Type of Medium: Electronic Resource
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  • 8
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 61 (1987), S. 2203-2211 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The preparation of TaSi2-WSi2 alloys from the reaction of Si with Ta-W films allows one to explore the constitution diagram of the TaSi2-WSi2 pseudobinary system. The structure of the alloys has been investigated by means of Rutherford backscattering, x-ray diffraction, and transmission electron microscopy. The "equilibrium'' phase diagrams for the system TaSi2-WSi2 and for TiSi2-WSi2 are compared in light of simple ideas of alloy theory based on the consideration of the electron to atom ratios. The resistivity of the alloys is analyzed in terms of what has been established about the transport properties of the disilicides and of possible contributions of structural defects, mostly stacking faults, to scattering processes.
    Type of Medium: Electronic Resource
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  • 9
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 60 (1986), S. 193-200 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The pseudobinary system TiSi2–WSi2 has been investigated from about 85% TiSi2 to 100% WSi2 up to a temperature of 1100 °C. The equilibrium phase diagram which has been established contains a continuous (from 15% to 100% WSi2) solid solution with a hexagonal structure (TaSi2 type) at low temperatures, below ∼550 °C. At about 550 °C WSi2-rich alloys split into two phases, the normal tetragonal phase of WSi2, which has a very limited solubility for TiSi2, and the hexagonal (TaSi2) phase with the amount of WSi2 in solution decreasing with increasing temperature at about 50% at 1100 °C. The resistivity of the different alloys has been studied as a function of annealing temperature. There is considerable excess resistivity due to alloy scattering and no evidence of a marked difference in resistivity between the two phases.
    Type of Medium: Electronic Resource
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  • 10
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 59 (1986), S. 2773-2776 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Titanium interaction with phosphorus-doped polycrystalline silicon gate electrodes was investigated by cross-sectional transmission electron microscopy and correlated with sheet resistance measurements. Phosphorus concentration above 1×1016 ion/cm2 in the polycrystalline silicon leads to decreased TiSi2 formation, discontinuous metal silicide layer, and increased sheet resistance. A possible cause could be the formation of titanium phosphide at high phosphorus concentration in the polycrystalline silicon, competing with the total titanium available for silicide formation.
    Type of Medium: Electronic Resource
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