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  • 11
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 67 (1990), S. 334-339 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: A backside secondary ion mass spectrometry technique is employed to examine elemental redistribution in the Ge/Pd/GaAs ohmic contact as a function of annealing conditions. Dilute Al containing marker layers (Ga1−x Alx As) in the GaAs permit precise calibration and alignment of the elemental depth profiles. Double etch-stop thinning yields high depth resolution. The onset of ohmic behavior is found to occur when Ge is detected at the GaAs surface. Good ohmic behavior is observed when an interfacial layer of reacted Pd4GaAs is dispersed and complete coverage of Ge occurs. The Ge/GaAs interface is abrupt with the Ge concentration dropping by over three orders of magnitude within 100 A(ring). About 40 A(ring) of GaAs is found to be consumed during the ohmic contact formation. Degradation of the ohmic contacts, as a result of further heat treatment, was found to correlate with Ge in-diffusion into the GaAs. The results place strict limitations on doping and heterointerface models of ohmic behavior for this contact.
    Type of Medium: Electronic Resource
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  • 12
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 65 (1989), S. 2300-2306 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The relative importance between the thermodynamical driving force and kinetics in thermal annealing and ion mixing in the thermally activated regime has not been clarified. To probe the role of the thermodynamical driving force in reactions between metals and silicon, the Co-Si system was chosen for investigation. In general, three silicide phases are formed during thermal annealing of samples consisting of Co thin films deposited on Si substrates, i.e., Co2Si (the first phase to form with a heat of formation, ΔHf=−9 kcal/g atoms), CoSi (ΔHf=−12 kcal/g atoms), and CoSi2 (the last phase to form, with ΔHf=−8.2 kcal/g atoms). Previous experiments have shown that annealing a sample of Si/CoSi/Co converts CoSi into Co2Si instead of a continuous growth of CoSi. This type of reaction is apparently unrelated to the magnitude of the thermodynamical driving force since ΔHf of CoSi is significantly larger than those of Co2Si and CoSi2, but is kinetically restricted instead. Under ion mixing conditions the kinetic restriction is expected to relax due to enhanced atomic mobilities under ion irradiation; the ion-induced reactions should then be driven by thermodynamics; i.e., growth of the phase with the largest ΔHf is favored. In this work, phase formation induced thermally and with ion mixing in the Co-Si system was investigated using Rutherford backscattering spectrometry and x-ray diffraction (Read camera). It was found that in thermal annealing, Co2Si is the first phase to form and Co is the dominant moving species in the formation of Co2Si, in agreement with previous results. In ion mixing, both CoSi and Co2Si are observed to form. At low temperatures, the formation of CoSi dominates. As the substrate temperature is increased, the formation of Co2Si becomes more significant. Co and Si are found to be the dominant moving species in the ion-beam-assisted formation of Co2Si and CoSi, respectively. By introducing the concept of an effective heat of formation, initial phase formation in both ion mixing and thermal annealing can be rationalized in terms of the thermodynamical driving force.
    Type of Medium: Electronic Resource
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  • 13
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 65 (1989), S. 1621-1625 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The temperature dependence of the contact resistance of the Ge/Pd and Si/Pd metalization scheme on n-GaAs was investigated. These two contact systems are based on solid-phase reactions, thus leading to nonspiking ohmic contacts to n-GaAs. The experimental results show that the ohmic behavior is likely due to both a highly doped surface n+ region and/or a small barrier at the interface. The origin of this small barrier and nonlinear current-voltage characteristics for certain samples are also discussed.
    Type of Medium: Electronic Resource
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  • 14
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 89 (2001), S. 5543-5546 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Al/Ti based metallization is commonly used for ohmic contacts to n-GaN and related compounds. We have previously reported an ohmic contact scheme specially designed for AlGaN/GaN heterostructure field-effect transistors (HFETs) [D. Qiao et al., Appl. Phys. Lett. 74, 2652 (1999)]. This scheme, referred to as the "advancing interface" contact, takes advantage of the interfacial reactions between the metal layers and the AlGaN barrier layer in the HFET structure. These reactions consume a portion of the barrier, thus facilitating carrier tunneling from the source/drain regions to the channel region. The advancing interface approach has led to consistently low contact resistance on Al0.25Ga0.75N/GaN HFETs. There are two drawbacks of the Al/Ti based advancing interface scheme, (i) it requires a capping layer for the ohmic formation annealing since Ti is too reactive and is easily oxidized when annealing is performed in pure N2 or even in forming gas, and (ii) the atomic number of Al and that of Ti are too low to yield efficient backscattered electron emission for e-beam lithographic alignment purposes. In this work, we investigated a Ta based advancing interface contact scheme for the HFET structures. We found that the presence of Ta in this ohmic scheme leads to (1) a specific contact resistivity as low as 5×10−7 Ω cm2, (2) efficient electron emission for e-beam lithographic alignment, and (3) elimination of the capping layer for the ohmic annealing. © 2001 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 15
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 87 (2000), S. 801-804 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The dependence of the Schottky barrier height of Ni/AlxGa1−xN contact on the Al mole fraction up to x=0.23 was studied. The barrier heights were measured by I–V, capacitance–voltage, and the internal photoemission method. The Al mole fractions were estimated from the AlGaN band gap energies measured by photoluminescence. In the range of x〈0.2 a linear relationship between the barrier height and Al mole fraction was obtained. This was consistent with the slope predicted by the Schottky rule. For x=0.23, the measured barrier height was lower than predicted. We believed this was due to crystalline defects at the Ni/AlGaN interface. © 2000 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 16
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 86 (1999), S. 2696-2699 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: A photoconductance method was used to determine the band-gap energy and, therefore, the Al mole fraction of bulk AlxGa1−xN and AlxGa1−xN/GaN heterostructures. The results are compared with those obtained by a more elaborate photoluminescence method. © 1999 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 17
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 67 (1990), S. 524-527 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Low dose ion implantation through the Pt/Si silicon interface prior to annealing has been shown to yield a more planar PtSi/Si interface after annealing. The electrical characteristics of these ion mixed diodes have also been shown to be more uniform from device to device as well as more nearly approaching theoretical performance than conventionally prepared diodes.
    Type of Medium: Electronic Resource
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  • 18
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 62 (1987), S. 942-947 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: A low resistance nonalloyed ohmic contact to n-GaAs is formed which utilizes the solid-phase epitaxy of Ge through PdGe. Discussion focuses on the conditions necessary to attain low specific contact resistivity (∼10−6 Ω cm2 on 1018 cm−3 n-GaAs) and on the interfacial morphology between the contact metallization and the GaAs substrate. MeV Rutherford backscattering spectrometry and channeling show the predominant reaction to be that of Pd with amorphous Ge to form PdGe followed by the solid-phase transport and epitaxial growth of Ge on 〈100〉 GaAs. Cross-sectional transmission electron microscopy and lattice imaging show a very limited initial Pd-GaAs reaction and a final interface which is planar and structurally abrupt to within atomic dimensions. The presence of excess Ge over that necessary for PdGe formation and the placement of Pd initially in contact with GaAs are required to result in the lowest contact resistivity. The experimental data suggest a replacement mechanism in which an n+-GaAs surface region is formed when Ge occupies excess Ga vacancies.
    Type of Medium: Electronic Resource
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  • 19
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 58 (1985), S. 1330-1334 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: We have studied the Er and ErSi2 contacts on p-Si. A correlation is found between the barrier height and the presence of an interfacial oxide layer. Samples with a thin interfacial oxide (∼ 3 A(ring)) exhibit a barrier height of 0.68 eV. In contrast, samples without any detectable interfacial oxide show a higher barrier height of ∼0.8 eV. The barrier heights were determined by current-voltage measurements and the thicknesses of the interfacial oxide were measured by the 16O(d,α)14 N nuclear reaction technique.
    Type of Medium: Electronic Resource
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  • 20
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 89 (2001), S. 2972-2978 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The orientation effect on blistering phenomenon in H implanted Si was studied for (100), (111), and (110) Si wafers. It was found that substrate orientation has no observable effects on the underlying blistering mechanisms. Furthermore, the implantation damage, Si–H complex formation in as-implanted samples and surface roughness of the transferred layer appeared to be unaffected by the orientation. However, the blistering kinetics are orientation dependent, with (100) Si having the fastest blistering rate, and (110) Si the slowest. This dependence was attributed to the different density of ruptured Si–Si bonds of different orientations. The magnitude of the observed in-plane compressive stress in the H-implanted Si wafers is rationalized in terms of the formation of platelets in the samples. © 2001 American Institute of Physics.
    Type of Medium: Electronic Resource
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